XC6SLX75-L1FG676I vs XC6SLX75-2FGG676I Comparison

Detailed side-by-side comparison of XC6SLX75-L1FG676I by AMD and XC6SLX75-2FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ Active

Specification Comparison

Parameter XC6SLX75-L1FG676I XC6SLX75-2FGG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX field-programmable gate array (FPGA) Spartan-6 LX field-programmable gate array (FPGA)
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
User I/O 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1 V —
Package 676-ball FBGA —
Package Body Size 27 x 27 mm —
Ball Pitch 1 mm 1 mm
Terminal Count 676 terminals —
Package Shape Square —
Mounting Style BGA —
Temperature Grade Industrial —
Lead-Free Status Lead-free Lead free
Programmability User-programmable FPGA logic —
Internal Frequency — 667 MHz
Input/Output Count — 408 I/O
Supply Voltage — 1 V
Speed Grade — -2
Package Type — 676-ball FBGA
Package Dimensions — 27 mm × 27 mm
Mounting Type — Surface mount
Operating Temperature — -40°C to +100°C
Device Family — Spartan-6 LX
FPGA Configuration — [DATA_NEEDED: FPGA configuration interface and supported configuration modes]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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