XC6SLX75-N3FG676C vs XC6SLX75-2FGG676I Comparison

Detailed side-by-side comparison of XC6SLX75-N3FG676C by AMD and XC6SLX75-2FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ Active

Specification Comparison

Parameter XC6SLX75-N3FG676C XC6SLX75-2FGG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX field-programmable gate array Spartan-6 LX field-programmable gate array (FPGA)
Logic Elements 74,637 —
Logic Activity Blocks / Configurable Logic Blocks 5,831 —
User I/O 408 —
Block RAM 3,170,304 bits [DATA_NEEDED: block RAM capacity]
Core Supply Voltage 1.14 V to 1.26 V —
Junction Temperature Range 0°C to 85°C —
Speed Grade -3 -2
Temperature Grade Industrial —
Package 676-ball BGA —
Number of Package Balls 676 —
Package Family S-PBGA-B676 —
Mounting Type Surface mount Surface mount
Programmable I/O Count 408 user I/O —
Device Configuration Spartan-6 LX FPGA configuration architecture —
RoHS Compliance unknown [DATA_NEEDED: RoHS compliance status]
REACH Compliance unknown [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification unknown [DATA_NEEDED: AEC-Q100 qualification status]
Logic Cells — 74,637 cells
Configurable Logic Blocks — 5,831 CLBs
Internal Frequency — 667 MHz
Input/Output Count — 408 I/O
Supply Voltage — 1 V
Process Technology — 45 nm CMOS
Package Type — 676-ball FBGA
Package Dimensions — 27 mm × 27 mm
Ball Pitch — 1 mm
Operating Temperature — -40°C to +100°C
Lead-Free Status — Lead free
Device Family — Spartan-6 LX
FPGA Configuration — [DATA_NEEDED: FPGA configuration interface and supported configuration modes]
DSP Resources — [DATA_NEEDED: DSP slice count]

Datasheets & Resources

Browse All Products Create BOM Request Quote