XC6SLX75T-3FG676I vs XC6SLX75-3FG676I Comparison

Detailed side-by-side comparison of XC6SLX75T-3FG676I by Xilinx and XC6SLX75-3FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Xilinx
XC6SLX75T-3FG676I XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx

XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx

XC6SLX75T-3FG676I ✓ Active

Specification Comparison

Parameter XC6SLX75T-3FG676I XC6SLX75-3FG676I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Spartan-6 LXT Field Programmable Gate Array Field Programmable Gate Array (FPGA)
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Internal Frequency 667 MHz —
I/O Count 348 I/Os 408 I/O
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V —
Package 676-pin FCBGA 676-ball FCBGA
Package Dimensions 27 x 27 mm —
Package Pitch 1.0 mm —
Speed Grade -3 -3
Operating Temperature 0°C to 85°C —
Mounting Type Surface Mount —
Programming Interface [DATA_NEEDED: programming interface type] —
Number of Dedicated I/O Standards [DATA_NEEDED: supported I/O standard count] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
RoHS Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown [DATA_NEEDED: REACH status]
AEC-Q100 Qualification unknown —
FPGA Family — Spartan-6 LX
Maximum Frequency — 862 MHz
Package Body Size — 27 mm x 27 mm
Ball Pitch — 1 mm
Terminal Count — 676 terminals
Temperature Grade — Industrial
Surface-Mount Type — Ball Grid Array (BGA)
Verified Distributor Price — USD 67.1347 per unit
LCSC Availability — In stock
Lead-Free Status — [DATA_NEEDED: lead-free status]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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