XC6SLX9-2FTG256C vs XC6SLX16-2FT256I Comparison

Detailed side-by-side comparison of XC6SLX9-2FTG256C by AMD and XC6SLX16-2FT256I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX9-2FTG256C XC6SLX16-2FT256I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $27.85 $63.85
Series Spartan-6 LX Spartan-6 LX
Device Logic Cells 9,152 LE —
Adaptive Logic Modules (ALMs) 1,430 ALM —
Configurable Logic Blocks (CLBs) 715 CLB —
Embedded Block RAM 576 Kbits —
Distributed RAM 32 Kbits —
DSP / Multiplier Blocks 16 (18 x 18 multipliers) —
Maximum User I/Os 186 —
Speed Grade -2 (commercial) -2
Internal Performance Up to 667 MHz —
Process Technology 45 nm low-power CMOS 45 nm CMOS
Package 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch 256-ball FTBGA, 17 mm x 17 mm, 1.0 mm pitch
Operating Temperature 0 C to 85 C (commercial) -40C to +100C (Industrial)
Supply Voltage 1.2 V core / 1.2 V-3.3 V I/O (per DS160) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant (lead-free FTBGA) —
Configuration Modes SPI, JTAG, BPI, Master Serial SPI, BPI, JTAG, Slave SelectMAP
Device Type — FPGA
Logic Cells — 14,579
Block RAM — 589,824 bits (576 Kbits)
Total Block RAM (Kbits) — 2,278
User I/O Count — 186
Number of I/O Banks — 4
DSP48A1 Slices — 32
Clock Management Tiles (CMTs) — 4
Core Voltage — 1.2 V
I/O Voltage Range — 1.2 V to 3.3 V
Lead-Free / RoHS — Yes / Compliant

Datasheets & Resources

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