XC6SLX9-N3CSG225I vs XC6SLX9-2CSG225C Comparison

Detailed side-by-side comparison of XC6SLX9-N3CSG225I by AMD and XC6SLX9-2CSG225C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX9-N3CSG225I XC6SLX9-N3CSG225I - Spartan-6 LX FPGA, 225-BGA | AMD

XC6SLX9-N3CSG225I - Spartan-6 LX FPGA, 225-BGA | AMD

XC6SLX9-N3CSG225I ✓ Active

Specification Comparison

Parameter XC6SLX9-N3CSG225I XC6SLX9-2CSG225C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Product Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Manufacturer AMD —
Device Designation XC6SLX9 —
Speed Grade -3 -2
User I/O Count 160 I/O 160
Package 225-LFBGA, CSPBGA 225-ball CSBGA (CSG225)
Package Ball Count 225 balls —
Mounting Type Surface Mount Surface Mount
Programmable Logic Type Nonvolatile configuration memory —
Maximum Operating Temperature [DATA_NEEDED: maximum operating temperature] —
Minimum Operating Temperature [DATA_NEEDED: minimum operating temperature] —
Logic Cell Count [DATA_NEEDED: logic cell count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Configuration Memory [DATA_NEEDED: configuration memory capacity] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
Family — Spartan-6 LX
Part Number — XC6SLX9-2CSG225C
Logic Cells — 9152
Configurable Logic Blocks (CLBs) — 715
Total Block RAM — 589824 bits
Package Size — 13 x 13 mm
Ball Pitch — 0.8 mm
Core Voltage — 1.14 V to 1.26 V
Maximum Operating Frequency — 667 MHz
Maximum Internal Clock — 375 MHz
Process Node — 45 nm CMOS
Operating Temperature — 0C to +85C (commercial)
Lead Free — Yes

Datasheets & Resources

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