XC7K325T-1FB676C vs XC7K325T-1FB676I Comparison

Detailed side-by-side comparison of XC7K325T-1FB676C by AMD and XC7K325T-1FB676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC7K325T-1FB676C XC7K325T-1FB676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Kintex-7 Field Programmable Gate Array Kintex-7 Field Programmable Gate Array (FPGA)
Logic Cells 326080 —
User I/O 400 400
Speed Grade -1 -1
Package 676-BBGA FCBGA 676-BBGA, FCBGA
Package Pin Count 676 balls —
Package Type FCBGA —
Programmable Logic Kintex-7 FPGA —
Device Family Kintex-7 Kintex-7
Mounting Type Surface Mount Surface Mount
Terminal Type Ball —
Package Shape Square —
Core Supply Voltage [DATA_NEEDED: VCCINT operating range] [DATA_NEEDED: core supply voltage]
Auxiliary Supply Voltage [DATA_NEEDED: VCCAUX operating range] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Operating Temperature Range [DATA_NEEDED: commercial temperature range] [DATA_NEEDED: operating temperature range]
Maximum Operating Frequency [DATA_NEEDED: maximum clock frequency] —
Block RAM [DATA_NEEDED: block RAM resources and capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
High-Speed Transceivers [DATA_NEEDED: transceiver count and configuration support] —
RoHS Status [DATA_NEEDED: RoHS compliance statement] [DATA_NEEDED: RoHS status]
Logic Elements — 326,080
Configurable Logic Blocks — 25,475
Total Block RAM — 16,404,480 bits
Listed General-Purpose I/O — 250
Temperature Grade — Industrial
Package Dimensions — 27 mm x 27 mm
Ball Count — 676 balls
Clock Management — MMCM and PLL
Configuration Interface — [DATA_NEEDED: configuration interface types]
Static Power — [DATA_NEEDED: static power]
REACH Status — [DATA_NEEDED: REACH status]

Datasheets & Resources

Browse All Products Create BOM Request Quote