XCKU3P-1FFVD900I vs XCKU3P-2FFVD900I Comparison
Detailed side-by-side comparison of XCKU3P-1FFVD900I by AMD and XCKU3P-2FFVD900I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-1FFVD900I | XCKU3P-2FFVD900I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ FPGA | Kintex UltraScale+ field-programmable gate array |
| Logic Cells | 355,950 cells | 355,950 cells |
| Configurable Logic Blocks | 20,340 CLBs | — |
| Input/Output Count | 304 I/Os | — |
| Memory Bits | 31,641,600 bits | — |
| Nominal Core Voltage | 0.85 V | — |
| Speed Grade | -1 | -2 |
| Package | 900-BBGA FCBGA | 900-FCBGA |
| FPGA Architecture | Kintex UltraScale+ | — |
| Mounting Type | Surface Mount | Surface mount |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Maximum I/O Voltage | [DATA_NEEDED: maximum I/O voltage] | — |
| Power Consumption | [DATA_NEEDED: power consumption] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Block RAM | — | 12,960 Kb |
| DSP Slices | — | 1,368 slices |
| User I/O | — | 304 I/O |
| Temperature Grade | — | Industrial |
| Junction Temperature Range | — | -40°C to 100°C |
| Package Dimensions | — | 31 x 31 mm |
| Programmable Logic | — | Kintex UltraScale+ FPGA fabric |
| On-Chip Memory | — | Block RAM |
| Digital Signal Processing Resources | — | DSP slices |
| Configuration Architecture | — | [DATA_NEEDED: configuration architecture] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |