XCKU3P-1SFVB784E vs XCKU3P-2SFVB784E Comparison

Detailed side-by-side comparison of XCKU3P-1SFVB784E by AMD and XCKU3P-2SFVB784E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XCKU3P-1SFVB784E XCKU3P-2SFVB784E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ FPGA Kintex UltraScale+ FPGA
Logic Elements 355,950 —
Logic Blocks 20,340 —
Block RAM 31,641,600 bits —
User I/O 304 —
Package 784-pin FCBGA 784-BFBGA FCBGA
Mounting Type Surface mount Surface mount
Speed Grade -1 -2
Temperature Grade E —
Operating Supply Voltage 0.825 V to 0.876 V —
Minimum Operating Temperature 0 °C —
Maximum Operating Temperature [DATA_NEEDED: maximum operating temperature] —
Programmable I/O 304 user I/O —
Device Status Active —
FPGA Architecture Kintex UltraScale+ —
Package Type FCBGA Fine-pitch ball-grid-array FCBGA
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Programmable Logic Type — Field-programmable gate array (FPGA)
I/O Count — 304 I/O
Logic Cell Count — 31,641,600 logic cells
LUT Count — 355,950 LUTs
Device Family — Kintex UltraScale+
Programmable Resources — [DATA_NEEDED: programmable resource breakdown]
Embedded Memory — [DATA_NEEDED: embedded memory capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]
Maximum Clock Frequency — [DATA_NEEDED: maximum clock frequency]
Operating Voltage — [DATA_NEEDED: operating voltage]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

Datasheets & Resources

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