XCKU3P-1SFVB784E vs XCKU3P-2SFVB784I Comparison
Detailed side-by-side comparison of XCKU3P-1SFVB784E by AMD and XCKU3P-2SFVB784I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-1SFVB784E | XCKU3P-2SFVB784I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ FPGA | Kintex UltraScale+ FPGA |
| Logic Elements | 355,950 | — |
| Logic Blocks | 20,340 | — |
| Block RAM | 31,641,600 bits | — |
| User I/O | 304 | 304 I/O |
| Package | 784-pin FCBGA | 784-FCBGA |
| Mounting Type | Surface mount | Surface Mount |
| Speed Grade | -1 | -2 |
| Temperature Grade | E | I |
| Operating Supply Voltage | 0.825 V to 0.876 V | — |
| Minimum Operating Temperature | 0 °C | — |
| Maximum Operating Temperature | [DATA_NEEDED: maximum operating temperature] | — |
| Programmable I/O | 304 user I/O | — |
| Device Status | Active | — |
| FPGA Architecture | Kintex UltraScale+ | — |
| Package Type | FCBGA | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Manufacturer | — | AMD / Xilinx |
| Logic Resources | — | 31641600 |
| DSP Resources | — | 355950 |
| Core Supply Voltage | — | 0.825 V to 0.876 V |
| Operating Junction Temperature | — | -40°C to 100°C |
| Package Dimensions | — | 23 x 23 mm |
| Product Family | — | Kintex UltraScale+ |
| Programmable Device Type | — | FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |