XCKU3P-1SFVB784I vs XCKU3P-1SFVB784E Comparison

Detailed side-by-side comparison of XCKU3P-1SFVB784I by AMD and XCKU3P-1SFVB784E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XCKU3P-1SFVB784I XCKU3P-1SFVB784E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Product Type Field-programmable gate array (FPGA) —
Device Family XCKU3P —
I/O Count 256 I/O —
Package Type 784-ball FCBGA FCBGA
Package Designation 784-BFBGA —
Mounting Type Surface mount Surface mount
Ordering Suffix 1SFVB784I —
Performance Grade 1 —
Temperature Grade Industrial (I) E
Programmable Logic Cells [DATA_NEEDED: programmable logic cell count] —
Block RAM [DATA_NEEDED: block RAM capacity] 31,641,600 bits
DSP Resources [DATA_NEEDED: DSP resource count] —
Transceiver Resources [DATA_NEEDED: transceiver count and type] —
Maximum I/O Performance [DATA_NEEDED: maximum I/O data rate] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
Auxiliary Supply Voltage [DATA_NEEDED: auxiliary supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Configuration Memory [DATA_NEEDED: configuration memory type and capacity] —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Device Type — Kintex UltraScale+ FPGA
Logic Elements — 355,950
Logic Blocks — 20,340
User I/O — 304
Package — 784-pin FCBGA
Speed Grade — -1
Operating Supply Voltage — 0.825 V to 0.876 V
Minimum Operating Temperature — 0 °C
Maximum Operating Temperature — [DATA_NEEDED: maximum operating temperature]
Programmable I/O — 304 user I/O
Device Status — Active
FPGA Architecture — Kintex UltraScale+
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]

Datasheets & Resources

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