XCKU3P-1SFVB784I vs XCKU3P-2SFVB784I Comparison

Detailed side-by-side comparison of XCKU3P-1SFVB784I by AMD and XCKU3P-2SFVB784I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XCKU3P-1SFVB784I XCKU3P-2SFVB784I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Product Type Field-programmable gate array (FPGA) —
Device Family XCKU3P —
I/O Count 256 I/O —
Package Type 784-ball FCBGA —
Package Designation 784-BFBGA —
Mounting Type Surface mount Surface Mount
Ordering Suffix 1SFVB784I —
Performance Grade 1 —
Temperature Grade Industrial (I) I
Programmable Logic Cells [DATA_NEEDED: programmable logic cell count] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] 355950
Transceiver Resources [DATA_NEEDED: transceiver count and type] —
Maximum I/O Performance [DATA_NEEDED: maximum I/O data rate] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 0.825 V to 0.876 V
Auxiliary Supply Voltage [DATA_NEEDED: auxiliary supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Configuration Memory [DATA_NEEDED: configuration memory type and capacity] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Device Type — Kintex UltraScale+ FPGA
Manufacturer — AMD / Xilinx
User I/O — 304 I/O
Logic Resources — 31641600
Operating Junction Temperature — -40°C to 100°C
Package — 784-FCBGA
Package Dimensions — 23 x 23 mm
Speed Grade — -2
Product Family — Kintex UltraScale+
Programmable Device Type — FPGA
Configuration Method — [DATA_NEEDED: configuration method]

Datasheets & Resources

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