XCKU3P-2FFVB676E vs XCKU3P-2FFVA676E Comparison

Detailed side-by-side comparison of XCKU3P-2FFVB676E by AMD and XCKU3P-2FFVA676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XCKU3P-2FFVB676E XCKU3P-2FFVB676E - Kintex UltraScale+ FPGA | AMD

XCKU3P-2FFVB676E - Kintex UltraScale+ FPGA | AMD

XCKU3P-2FFVB676E ✓ Active
AMD
XCKU3P-2FFVA676E XCKU3P-2FFVA676E Kintex UltraScale+ FPGA | AMD

XCKU3P-2FFVA676E Kintex UltraScale+ FPGA | AMD

XCKU3P-2FFVA676E ✓ Active

Specification Comparison

Parameter XCKU3P-2FFVB676E XCKU3P-2FFVA676E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ field-programmable gate array (FPGA) Kintex UltraScale+ FPGA
Manufacturer AMD —
Part Number XCKU3P-2FFVB676E —
FPGA Family Kintex UltraScale+ —
Order Code Performance Grade -2 grade —
Number of I/O Positions 280 positions —
Package 676-ball FCBGA 676-BBGA FCBGA
Mounting Type Surface mount Surface mount
Programmable Device Category FPGA —
Logic Cell Count [DATA_NEEDED: logic cell count] —
DSP Block Count [DATA_NEEDED: DSP block count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
Transceiver Count [DATA_NEEDED: transceiver count] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Package Body Dimensions [DATA_NEEDED: package body dimensions] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Logic Cells — 355,950 cells
Configurable Logic Blocks — 20,340 CLBs
Input/Output Connections — 304 I/O
Nominal Core Voltage — 0.85 V
Programmable Logic Type — FPGA
Device Family — Kintex UltraScale+
Speed Grade — -2
Temperature Grade — Extended
Embedded Memory — [DATA_NEEDED: embedded memory capacity]
High-Speed Transceivers — [DATA_NEEDED: transceiver count and data rate]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Slices — [DATA_NEEDED: DSP slice count]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]

Datasheets & Resources

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