XCKU3P-2FFVB676I vs XCKU3P-1FFVA676E Comparison
Detailed side-by-side comparison of XCKU3P-2FFVB676I by AMD and XCKU3P-1FFVA676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-2FFVB676I | XCKU3P-1FFVA676E |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ field-programmable gate array (FPGA) | Kintex UltraScale+ FPGA (Field Programmable Gate Array) |
| Product Type | FPGA IC | — |
| Manufacturer | AMD | — |
| Series | Kintex UltraScale+ | — |
| Device Designation | KU3P | — |
| Speed Grade | -2 | -1 |
| Logic Cell Count | 162,720 cells | — |
| Input/Output Count | 280 I/O | — |
| Package Type | FCBGA-676 | — |
| Package Format | 676-BBGA, FCBGA | — |
| Programmability | Field-programmable digital logic | — |
| Temperature Grade | Industrial grade | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: VCCINT operating voltage] | — |
| Auxiliary Supply Voltage | [DATA_NEEDED: VCC AUX supply voltage] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface details] | [DATA_NEEDED: configuration interface list (SPI, BQS, JTAG) |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Performance | [DATA_NEEDED: maximum I/O data rate] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Logic Cells | — | 355,950 (as published in distributor listings) |
| Number of Gates | — | 31,641,600 (as published in distributor listings) |
| User I/O Count | — | 256 |
| Maximum Clock Frequency | — | 667 MHz |
| Package | — | 676-BBGA (FCBGA), 31 x 31 mm |
| Total Ball Count | — | 676 |
| Device Series | — | Kintex UltraScale+ (KU3P) |
| Programming Technology | — | SRAM-based, volatile configuration (FPGA) |
| Mounting Type | — | Surface Mount |
| Operating Temperature Grade | — | [DATA_NEEDED: operating temperature grade for the -1 non-I suffix] |
| Core Supply Voltage Range | — | [DATA_NEEDED: core supply voltage range] |
| Auxiliary Supply Voltage Range | — | [DATA_NEEDED: auxiliary supply voltage range] |
| DSP48E2 Arithmetic Slices | — | [DATA_NEEDED: DSP48E2 slice count] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| Transceiver Count and Speed | — | [DATA_NEEDED: GTY transceiver count and maximum data rate] |
| MSL (Moisture Sensitivity Level) | — | [DATA_NEEDED: MSL rating] |