XCKU3P-2FFVD900I vs XCKU3P-1FFVD900I Comparison
Detailed side-by-side comparison of XCKU3P-2FFVD900I by AMD and XCKU3P-1FFVD900I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-2FFVD900I | XCKU3P-1FFVD900I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ field-programmable gate array | Kintex UltraScale+ FPGA |
| Logic Cells | 355,950 cells | 355,950 cells |
| Block RAM | 12,960 Kb | — |
| DSP Slices | 1,368 slices | — |
| User I/O | 304 I/O | — |
| Speed Grade | -2 | -1 |
| Temperature Grade | Industrial | — |
| Junction Temperature Range | -40°C to 100°C | — |
| Package | 900-FCBGA | 900-BBGA FCBGA |
| Package Dimensions | 31 x 31 mm | — |
| Mounting Type | Surface mount | Surface Mount |
| Programmable Logic | Kintex UltraScale+ FPGA fabric | — |
| On-Chip Memory | Block RAM | — |
| Digital Signal Processing Resources | DSP slices | — |
| Configuration Architecture | [DATA_NEEDED: configuration architecture] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Configurable Logic Blocks | — | 20,340 CLBs |
| Input/Output Count | — | 304 I/Os |
| Memory Bits | — | 31,641,600 bits |
| Nominal Core Voltage | — | 0.85 V |
| FPGA Architecture | — | Kintex UltraScale+ |
| Programming Interface | — | [DATA_NEEDED: programming interface] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Power Consumption | — | [DATA_NEEDED: power consumption] |