XCKU3P-2SFVB784E vs XCKU3P-1SFVB784E Comparison

Detailed side-by-side comparison of XCKU3P-2SFVB784E by AMD and XCKU3P-1SFVB784E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XCKU3P-2SFVB784E XCKU3P-1SFVB784E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ FPGA Kintex UltraScale+ FPGA
Programmable Logic Type Field-programmable gate array (FPGA) —
I/O Count 304 I/O —
Logic Cell Count 31,641,600 logic cells —
LUT Count 355,950 LUTs —
Package 784-BFBGA FCBGA 784-pin FCBGA
Package Type Fine-pitch ball-grid-array FCBGA FCBGA
Mounting Type Surface mount Surface mount
Device Family Kintex UltraScale+ —
Speed Grade -2 -1
Programmable Resources [DATA_NEEDED: programmable resource breakdown] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Operating Voltage [DATA_NEEDED: operating voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Logic Elements — 355,950
Logic Blocks — 20,340
Block RAM — 31,641,600 bits
User I/O — 304
Temperature Grade — E
Operating Supply Voltage — 0.825 V to 0.876 V
Minimum Operating Temperature — 0 °C
Maximum Operating Temperature — [DATA_NEEDED: maximum operating temperature]
Programmable I/O — 304 user I/O
Device Status — Active
FPGA Architecture — Kintex UltraScale+
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]

Datasheets & Resources

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