XCKU3P-2SFVB784I vs XCKU3P-1SFVB784E Comparison
Detailed side-by-side comparison of XCKU3P-2SFVB784I by AMD and XCKU3P-1SFVB784E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-2SFVB784I | XCKU3P-1SFVB784E |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ FPGA | Kintex UltraScale+ FPGA |
| Manufacturer | AMD / Xilinx | — |
| User I/O | 304 I/O | 304 |
| Logic Resources | 31641600 | — |
| DSP Resources | 355950 | — |
| Core Supply Voltage | 0.825 V to 0.876 V | — |
| Operating Junction Temperature | -40°C to 100°C | — |
| Package | 784-FCBGA | 784-pin FCBGA |
| Package Dimensions | 23 x 23 mm | — |
| Mounting Type | Surface Mount | Surface mount |
| Speed Grade | -2 | -1 |
| Temperature Grade | I | E |
| Product Family | Kintex UltraScale+ | — |
| Programmable Device Type | FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Logic Elements | — | 355,950 |
| Logic Blocks | — | 20,340 |
| Block RAM | — | 31,641,600 bits |
| Operating Supply Voltage | — | 0.825 V to 0.876 V |
| Minimum Operating Temperature | — | 0 °C |
| Maximum Operating Temperature | — | [DATA_NEEDED: maximum operating temperature] |
| Programmable I/O | — | 304 user I/O |
| Device Status | — | Active |
| FPGA Architecture | — | Kintex UltraScale+ |
| Package Type | — | FCBGA |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |