XCKU5P-1FFVA676E vs XCKU5P-1FFVB676E Comparison

Detailed side-by-side comparison of XCKU5P-1FFVA676E by AMD and XCKU5P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XCKU5P-1FFVA676E XCKU5P-1FFVA676E - 256 I/O Kintex UltraScale+ | AMD

XCKU5P-1FFVA676E - 256 I/O Kintex UltraScale+ | AMD

XCKU5P-1FFVA676E ✓ Active

Specification Comparison

Parameter XCKU5P-1FFVA676E XCKU5P-1FFVB676E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ FPGA Kintex UltraScale+ Field Programmable Gate Array
Number of I/O 256 —
Logic Cell Count 41,984,000 —
Logic Register Count 474,600 —
Package 676-FCBGA —
Package Type Fine-pitch ceramic ball grid array 676-FCBGA
Pin or Ball Count 676 balls —
Programmable Logic Type FPGA —
FPGA Family Kintex UltraScale+ —
Manufacturer AMD —
Mounting Type Surface mount Surface Mount
Speed Grade -1 -1
Ordering Code FFVA676E —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Maximum I/O Frequency [DATA_NEEDED: maximum I/O frequency] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
RoHS Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown [DATA_NEEDED: REACH status]
AEC-Q100 Qualification unknown [DATA_NEEDED: AEC-Q100 qualification]
Logic Cells — 474,600 cells
User I/O — 280 I/O
Block RAM — 17,280 Kb
DSP Slices — 1,824 slices
Process Technology — FinFET
Temperature Grade — Extended
Junction Temperature Range — 0°C to 100°C
Package Dimensions — 27 x 27 mm
Package Pin Count — 676 balls
Product Family — Kintex UltraScale+
Programmable Logic — FPGA
Lead-Free Status — [DATA_NEEDED: lead-free status]
Packaging Type — [DATA_NEEDED: shipping package type]
Standard Packaging Quantity — [DATA_NEEDED: standard packaging quantity]

Datasheets & Resources

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