FPGA & CPLD
Produkte (6666)
EP2S180F1020I4N - 180K LEs Stratix II FPGA, 742 I/O, FBGA-1020 | Intel
The Intel (formerly Altera) EP2S180F1020I4N is a high-density Stratix II family Field-Programmable Gate Array delivering 179,400 equivalent logic elements, 8,970 CLBs, and 9,383,040 RAM bits in a 1,020-ball FineLine BGA package (33 x 33 mm, 1.0 mm pitch). Built on a 90 nm CMOS process, the part is rated for the industrial temperature range (-40C to +100C) per the 'I' suffix and ships as a lead-free, RoHS-compliant device. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic IC whose function is defined by a user-supplied bitstream rather than fixed at the fab. It sits within the digital-semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Modern FPGAs integrate hard IP blocks such as transceivers, DSP blocks, embedded memory, and PLL/clock networks, which is why an FPGA like the EP2S180F1020I4N can replace multiple discrete logic, memory, and interface chips in a high-performance design. Key features of the EP2S180F1020I4N include 742 user I/O pins, a 1.2 V core supply typical of the Stratix II family, and 8,970 Configurable Logic Blocks (CLBs) arranged in the Stratix II Adaptive Logic Module (ALM) architecture that yields higher effective logic density than older 4-LUT designs. The 1,020-ball FBGA package exposes 742 usable I/O with the remainder dedicated to power, ground, and configuration pins, and supports high-speed LVDS, DDR, and source-synchronous interfaces typical of Stratix II designs. Architecturally, the Stratix II family introduces the ALM, which combines adaptive carry chains, distributed LUT RAM, and dedicated register files to deliver up to 2.5x the logic capacity per area versus prior Stratix devices. The EP2S180F1020I4N also includes dedicated DSP blocks for fixed- and floating-point math, on-chip TriMatrix memory, and up to 12 high-speed transceivers (rate dependent on speed grade), enabling single-chip implementation of DSP-intensive signal processing pipelines. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband processing, radar and software-defined radio front ends, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet via external PHYs), and broadcast video processing. Designers also deploy Stratix II EP2S180 devices in defense and aerospace systems and in test & measurement equipment where the large logic capacity allows whole systems to be emulated before tape-out. Design consideration: the EP2S180F1020I4N is a power-hungry device at full utilization; PCB designers must allocate a multi-layer supply tree (1.2 V VCCT/VCC, 2.5 V/3.3 V VCCIO banks, PLL analog supplies) and a substantial copper pour plus thermal vias to keep junction temperature within the 100C industrial envelope. Configuration via JTAG or an external EPC-series configuration device must be planned early in the design. This page synthesizes distributor pricing, same-family Altera drop-in alternatives, and practical Stratix II design notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference for EP2S180F1020I4N selection and sourcing.
EP2S180F1508C3 - 180K Logic Elements FPGA | Altera | Embedded
Altera EP2S180F1508C3 is a high-density Stratix II field-programmable gate array (FPGA) featuring approximately 180,000 gates, 1,170 user I/Os, and 8,970 logic array blocks in a 1,508-ball FCBGA package. It belongs to the Stratix II FPGA family and targets designs requiring substantial programmable logic, high I/O capacity, and integration of multiple digital functions on one device. The package is identified in verified distributor data as 1508-BBGA, FCBGA, with a 30 mm by 30 mm supplier-device format. An FPGA is a programmable semiconductor whose logic cells, interconnects, and I/O blocks can be configured after manufacturing. In the system hierarchy, EP2S180F1508C3 is an FPGA, a programmable logic device, and an integrated circuit used for implementing digital hardware. Unlike a fixed-function application-specific integrated circuit, an FPGA can support changing protocols, parallel datapaths, control logic, and signal-processing architectures through configuration. Its high gate count and large I/O count make it suitable for complex communication, industrial, test, and embedded processing systems. The device provides 8,970 logic array blocks, 1,170 I/Os, and a 1.2 V-class supply identified as 1.15 V to 1.25 V in the verified cross-reference data. The exact operating temperature grade, logic-element count, embedded-memory count, transceiver count, and package thermal data are not available in the supplied source snippets, so those values are intentionally marked as data-needed rather than inferred. The part is listed as a 1508-BBGA, FCBGA device with ball-grid-array mounting. For system architecture, the FPGA can consolidate control-plane logic, data-path processing, interface adaptation, and state-machine functions. The 1,170-I/O capacity is particularly useful for systems that aggregate many parallel signals, while the 8,970 logic-array blocks provide a large programmable fabric for custom accelerators and protocol implementations. Designers must validate configuration, clocking, power sequencing, I/O standards, signal integrity, and thermal behavior against the complete manufacturer datasheet before release. Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or video processing equipment, and high-end embedded digital platforms. The device is appropriate when design flexibility and interface density outweigh the power and development considerations associated with a very large FPGA. Its legacy Stratix II architecture also requires careful toolchain and lifecycle planning. When designing with EP2S180F1508C3, confirm the exact ball map, supported configuration modes, clock constraints, I/O electrical limits, and recommended decoupling network in the manufacturer documentation. The verified sources provide package and capacity information but do not provide complete electrical limits or a complete pin assignment, so the pinout remains data-needed. Pricing and availability should be confirmed with the distributor at the time of purchase. This product page combines verified distributor specifications, package and capacity details, sourcing links, and carefully separated data-needed fields to help engineers distinguish confirmed facts from parameters that require manufacturer-datasheet verification.
EP2S180F1508C3N - Stratix II FPGA 179K LE 1508-FBGA | Intel
The Intel (Altera) EP2S180F1508C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) containing 179,400 equivalent logic elements (LEs), 9,383,040 total RAM bits, and 8,970 Logic Array Blocks (LABs) with 1,170 user I/Os, housed in a 1,508-ball FineLine Ball-Grid Array (FBGA) package measuring 40 x 40 mm. According to the Altera Stratix II Device Handbook, the device operates from a 1.15 V to 1.25 V core supply and is fabricated on a 90 nm all-layer-copper CMOS process with 1.2 V core logic. A Field Programmable Gate Array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which occupy a tier alongside ASICs and microcontrollers in the digital integrated circuit hierarchy. Stratix II in particular introduced an adaptive logic module (ALM) architecture featuring 8-input fracturable look-up tables, doubling the effective logic capacity versus prior Stratix generations. Key features include embedded TriMatrix memory (with 9 Mbit total), up to 96 DSP blocks for fixed- and floating-point arithmetic, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and multi-gigabit transceivers (not present on the F1508 package variant). The 1,508-FBGA package supports commercial-grade junction temperature and is the highest-density Stratix II pinout variant, exposing nearly every user I/O for parallel processing interfaces. The EP2S180F1508C3N belongs to the C3 speed grade, meaning nominal Fmax performance with standard core voltage; I4 and C5 variants trade temperature range or speed for higher-grade silicon. Its 90 nm process node places it in the legacy high-performance FPGA category, predating Stratix III/IV/V but still specified for new designs where legacy IP re-use, low unit cost at high density, and proven Quartus II tool flow are valued over cutting-edge transceivers. Typical applications include high-throughput DSP pipelines (radar, video processing, software-defined radio), ASIC prototyping of complex SoCs, telecom baseband processing, and industrial control with custom parallel datapaths. The 1,170 user I/Os enable direct parallel bus attachment to DDR/QDR memory without external buffers. When designing with this device, plan the PCB layout around the 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V auxiliary supplies, route all differential pairs with controlled impedance, and use Quartus II software 13.0 or earlier for synthesis since the device predates Intel Quartus Prime. Decoupling must follow Stratix II PDN guidelines (typically 200+ low-ESL capacitors) to suppress simultaneous switching noise across the 1,170 I/Os. This page consolidates Stratix II family specifications, pricing from authorized distributors, drop-in alternative FPGAs sharing the F1508 footprint, and design notes drawn from the Stratix II Handbook - information synthesized beyond what the manufacturer datasheet alone provides.
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
The Intel EP2S180F1508C3NAA is a high-density Stratix II family field-programmable gate array (FPGA) delivering up to 179,400 equivalent logic elements, 9.4 Mbits of embedded RAM, and 96 DSP blocks, housed in a 1508-ball flip-chip BGA package. The device is specified at the -3 commercial speed grade, supports up to 1170 user I/O pins, and integrates up to 12 transceiver channels for high-speed serial I/O. Per the manufacturer datasheet, the EP2S180 is fabricated on a 90 nm process and includes dedicated on-chip termination, RAM, and DSP blocks optimized for high-performance digital signal processing, telecommunications, and ASIC prototyping workloads. What is a Stratix II FPGA? A Stratix II FPGA is a programmable logic device from the Altera/Intel Stratix II family of high-performance, SRAM-based field-programmable gate arrays. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of configurable logic blocks, programmable interconnect, and specialized hard IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy as follows: programmable logic device (PLD) -> field programmable gate array (FPGA) -> SRAM-based FPGA -> high-density Stratix II family. Stratix II devices are typically used in applications requiring very high logic density, high-speed serial connectivity, and substantial embedded memory and arithmetic resources. Key features of the EP2S180 include 179,400 equivalent logic elements (LEs), 9,383,040 bits of total embedded RAM (M4K and M-RAM combined), 96 embedded DSP blocks capable of up to 384 18x18 multipliers, and 12 full-duplex transceiver channels supporting data rates up to 6.375 Gbps. The 1508-FBGA package provides 1170 user I/Os and uses Intel's flip-chip BGA technology for high I/O density and excellent signal integrity at high frequencies. The device architecture combines Look-Up Table (LUT) based adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks with hardware multipliers, and embedded transceivers. The adaptive logic module architecture provides finer-grained logic utilization compared to prior Stratix generations, allowing more efficient implementation of complex arithmetic and control logic. Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), wireline telecom line cards with multiple SerDes channels, ASIC prototyping for large SoC designs, high-speed data acquisition, and test and measurement instrumentation. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well-suited to throughput-intensive compute systems. When designing with this device, carefully consider power distribution network design (PDN) for the 1508-ball flip-chip BGA, signal integrity for high-speed transceiver channels, and thermal management for the 1.0 V core supply at high toggle rates. Use Intel Quartus II design software (legacy version recommended for Stratix II) for synthesis, place-and-route, and timing closure. Per-package ball maps and reference schematics should be obtained from the manufacturer pin-out file. This page synthesizes distributor availability, same-package drop-in variants, and design guidance that is not found in the manufacturer datasheet, and is intended for engineers performing second-source qualification or migrating to a higher density Stratix II member.
EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel
Intel EP2S180F1508C4 is a high-density Stratix II field-programmable gate array featuring 179,400 logic elements or cells, 9,383,040 bits of embedded RAM, 1,170 programmable I/O lines, and a 1.15 V to 1.25 V supply range in a 1,508-ball FC-FBGA package measuring 40 mm by 40 mm. This combination targets complex digital systems that require substantial programmable logic, substantial on-chip memory, and a large number of external interfaces. The part belongs to Intel's Stratix II FPGA family, placing it in the hierarchy of programmable logic device, FPGA, logic IC, semiconductor, and configurable digital processing platform. An FPGA is a semiconductor integrated circuit whose logic function is defined through programmable configuration rather than fixed interconnect. Unlike a general-purpose processor that executes software instructions, an FPGA can implement parallel datapaths, state machines, interface bridges, and digital-signal-processing functions in configurable hardware. Within an electronic system, an FPGA sits between fixed-function controllers or processors and high-speed peripheral circuitry, providing reconfigurable timing, protocol, and data-processing resources. The EP2S180F1508C4's primary differentiating resources are its 179,400 logic cells, 9,383,040 RAM bits, and 1,170 I/O pins. The high cell count supports large logic networks, while the embedded memory supports buffering, lookup tables, packet storage, and other data-retention functions. Its 1,170 I/O resources are significant for designs that must connect numerous buses, memory interfaces, control signals, or high-speed parallel links. A published operating-frequency value of 711.24 MHz is available for this family search result, but designers should verify the relevant speed-grade timing conditions before using it as a system-level guarantee. Stratix II devices use SRAM-based FPGA technology and a 90 nm process, according to the supplied FPGAkey result. The architecture supports hardware parallelism and configuration-defined I/O behavior, which can shorten development cycles for algorithms that map efficiently into combinational and pipelined logic. Because the device is SRAM-based, the system must define how configuration data is loaded and retained during operation, including any applicable configuration memory, controller, boot process, and recovery strategy. Typical applications include high-throughput communications equipment, industrial inspection and automation systems, and complex test or measurement platforms. In communications equipment, the FPGA can implement protocol conversion, packet processing, and interface aggregation. In industrial systems, it can coordinate multiple sensors, motion-control channels, and machine-vision data streams. In instrumentation, it can provide deterministic capture, trigger, formatting, and transport logic. These applications benefit from parallel processing and the device's large I/O count, although exact memory, clock, transceiver, signaling, and power requirements must be confirmed from the manufacturer datasheet before design freeze. A key design consideration is that EP2S180F1508C4 is a high-pin-count BGA device, not a simple through-hole or small surface-mount FPGA. PCB planning must accommodate the 40 mm by 40 mm package, controlled impedance for high-speed signals, adequate power distribution, and verified BGA assembly capability. Firmware and board design teams should also confirm configuration support, available development tools, pin assignments, and migration implications before selecting a replacement. This page combines the supplied manufacturer and distributor information with package-aware drop-in references, application context, and explicit markers for unverified electrical details. The result is a practical engineering summary for sourcing, feasibility review, and legacy-system maintenance without presenting missing specifications as confirmed facts.
EP2S180F1508C4N - Stratix II 180K LEs FPGA | Intel/Altera
The Intel (formerly Altera) EP2S180F1508C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) with 179,400 logic elements, 71,760 CLBs (9,570 LABs), 9,383,040 bits of embedded RAM, and 1170 user I/Os, housed in a 1508-ball FC-FBGA package. It operates at a core voltage of 1.15V to 1.25V on a 90nm process technology with a maximum internal clock frequency up to 711.24 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be electrically configured to implement virtually any digital circuit after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> integrated circuits. Stratix II represents Altera's second-generation high-performance FPGA family, succeeding Stratix with significant architectural improvements in logic density, on-chip memory, and DSP capability. Key differentiating specifications include 9.38 Mbits of total RAM distributed across TriMatrix memory blocks, support for up to 96 DSP blocks with dedicated multipliers, support for external memory interfaces including DDR/DDR2/QDRII/QDRII+/RLDRAM, and 12 global clock networks with 16 PLLs. The 1508-BBGA (FC-FBGA) flip-chip BGA provides high I/O density of 1170 pins on a 40 mm × 40 mm body, suitable for high-bandwidth parallel interfaces and pin-intensive protocol bridging designs. The device implements an architecture based on Altera's adaptive logic modules (ALMs), each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and registers that can be split into smaller functions, delivering a claimed 2x performance density improvement versus the original Stratix family. Configuration is typically stored in a serial configuration device and loaded at power-up via active serial (AS), passive serial (PS), or JTAG modes. Typical applications include high-speed digital signal processing, ASIC prototyping, telecommunications infrastructure line cards, video broadcast and image processing, high-end test and measurement equipment, and military/aerospace systems. The 1508-ball FC-BGA package and high I/O count make it suitable for designs that previously would have required an ASIC. When designing with this FPGA, ensure the PCB supports high-speed signal integrity with controlled-impedance routing, matched-length pairs for DDR interfaces, and a sufficient number of power and ground pins to deliver the 1.15–1.25 V core and 3.3 V/2.5 V I/O rails. Note that the Stratix II family has been superseded by Stratix III, IV, and V series; new designs should evaluate current Intel/Altera Cyclone or Stratix 10 families for cost and longevity reasons. This page synthesizes distributor pricing, drop-in compatible Stratix II alternatives with identical 1508-FBGA footprints, and practical design notes that are not consolidated in any single source including the manufacturer datasheet, distributor listings, or parametric search engines.
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
Altera EP2S180F1508C4TT is a high-performance Stratix II field-programmable gate array built for demanding programmable digital-logic systems. The verified listing identifies approximately 180,000 logic elements, 1,170 user I/O pins, a 1,508-ball fine-pitch BGA package, and a -T temperature-grade designation. These headline characteristics position the device as a large, I/O-rich FPGA suitable for designs requiring substantial parallel logic, interface aggregation, and configurable digital signal processing. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, configurable interconnects, and programmable input/output resources. Designers configure these resources after PCB assembly to implement digital circuits, processors, interfaces, control logic, and data-processing pipelines. Within the semiconductor hierarchy, an FPGA belongs to programmable logic and is related to CPLDs while generally offering higher logic capacity. Stratix II is Altera's high-density FPGA family for high-performance applications. The defining features of EP2S180F1508C4TT are its approximately 180,000 logic elements, 1,170 user I/O pins, and 1,508-ball FBGA package. The high logic-element count supports broad datapaths, protocol bridges, embedded control, and multiple parallel processing functions on one device. Its large user-I/O count is valuable when a system must connect many buses, transceivers, memory interfaces, converters, or peripheral controllers. The fine-pitch BGA package provides dense interconnects but requires advanced PCB fabrication, assembly, inspection, and signal-integrity planning. Technically, Stratix II devices combine configurable logic fabric with routing resources, memory blocks, clocking resources, DSP-oriented blocks, and programmable I/O. Firmware determines the implemented digital architecture, so power, timing, thermal behavior, and pin assignment remain design-dependent. A large BGA also creates extensive simultaneous-switching-current, decoupling, plane-integrity, and escape-routing challenges. Engineers should use the official family documentation and supported Intel FPGA development tools when compiling, configuring, and validating a design. Typical applications include telecommunications and networking equipment, industrial automation and test systems, high-density interface bridging, video or imaging processing infrastructure, digital signal-processing controllers, and defense or aerospace electronics. The 1,170-I/O capability is especially useful where several external buses must terminate on one processing device. Engineers should choose this component when logic capacity, I/O density, and high-end programmable performance outweigh package complexity, power demands, and legacy-device availability. A primary design consideration is the 1,508-ball FBGA land pattern: it cannot be treated as a simple, low-pin-count FPGA. Follow the official BGA pin assignment, bank rules, voltage sequencing, decoupling guidance, and thermal recommendations, then verify all timing, power integrity, and signal-integrity constraints in the selected speed grade. This page synthesizes verified identity, package, I/O, and logic-capacity data with package-aware comparison guidance; missing electrical and thermal limits remain explicitly identified rather than estimated.
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
The Altera EP2S180F1508C5 is a high-density Stratix II Field-Programmable Gate Array in the 1508-ball FineLine BGA (FCBGA) package, integrating approximately 179,400 equivalent logic elements, 9,383,040 bits of embedded RAM, and 1,170 user I/O pins. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device targets high-performance logic, DSP, and memory-rich applications where deterministic timing and abundant on-chip memory are critical. The 1508-FBGA package measures 40 mm × 40 mm and exposes 1,170 general-purpose I/Os plus dedicated clock, configuration, and high-speed transceiver pins depending on variant selection. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with full design-time reconfigurability. The Stratix II family is part of the broader programmable logic device (PLD) hierarchy, sitting above CPLDs and below structured ASICs in terms of integration, performance, and cost. Key features of the EP2S180F1508C5 include 8,970 Logic Array Blocks (LABs) for fine-grained logic implementation, 96 dedicated DSP blocks for fixed- and floating-point arithmetic, and on-chip memory organized as 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks for distributed buffering. The device supports up to 12 global clock networks, multiple phase-locked loops (PLLs), and the Stratix II Adaptive Logic Module (ALM) architecture that delivers up to 1.4× the logic capacity of the previous Stratix generation at the same die area. High-speed differential I/O supports LVDS, LVPECL, and HyperTransport signalling for backplane and memory interfaces. Typical applications for the EP2S180F1508C5 include high-end telecommunications baseband processing, ASIC prototyping, high-performance image and video processing pipelines, radar and signal-intelligence front ends, and storage area network controllers. The combination of 1,170 user I/Os, 9.4 Mbit of embedded RAM, and 96 DSP blocks makes the part especially well-suited to designs that previously required a custom ASIC. The 1508-FBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad technology, and careful power-delivery network design. When designing with this device, allow for high in-rush current on configuration and use a Stratix II-compatible configuration device or JTAG download cable. PCB thermal design should target 2 oz copper on outer layers and a minimum 6-layer stack-up with continuous power and ground planes. This page consolidates distributor pricing, same-family drop-in variants, and practical layout guidance not found in the manufacturer datasheet.
EP2S180F1508C5N - 179400-Cell Stratix II FPGA, 1508-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S180F1508C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs/CLBs, and 9,383,040 bits of embedded RAM in a 1508-ball flip-chip BGA package (40 mm x 40 mm body, FCBGA). It exposes 1170 user I/O pins and integrates up to 96 embedded 18x18 multipliers plus 12 PLLs, making it the largest member of the Stratix II E family at the C5 speed grade with the -N lead-free / Pb-free designation. What is a Stratix II FPGA? The Stratix II is Intel's (formerly Altera's) second-generation high-performance FPGA family built on a 90 nm CMOS process with an adaptive logic module (ALM) architecture that replaces the traditional 4-input LUT, providing higher logic density and shorter critical paths. FPGAs in general sit in the programmable-logic hierarchy as: programmable logic device (PLD) -> field-programmable gate array (FPGA) -> high-end SRAM-based FPGA -> Stratix II class. They are used as logic accelerators, signal-processing engines, and high-bandwidth glue logic where ASIC NRE is not justified. Key parametric highlights include 9383040 total RAM bits (roughly 9.4 Mbit distributed + block), 96 dedicated DSP blocks (18x18 multipliers) for high-throughput DSP, 12 PLLs for multi-clock-domain synthesis, and 1170 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL and PCI/PCI-X signalling. The C5 speed grade places the device in the mid-fast bin of the Stratix II line, suitable for designs targeting internal frequencies in the 350-450 MHz fabric range. Architecture-wise, the EP2S180F1508 uses a row/column-based routing fabric driven by ALMs (8-input fracturable LUT equivalents), 12 PLLs with on-chip termination and dynamic phase shift, 4 DLLs, and dedicated high-speed I/O serials that are shared across banks. Embedded TriMatrix memory blocks provide true dual-port, simple dual-port, and single-port RAM plus FIFO buffers without consuming user logic. Typical applications include high-end telecom line-card ASIC prototyping, military signal-intelligence baseband processing, ASIC emulation, high-definition video processing pipelines, and high-channel-count software-defined radio (SDR) baseband. Its combination of 9.4 Mbit RAM and 1170 I/O is well matched to memory- and I/O-intensive designs such as H.264 encoders, multi-channel radar front-ends and routing-table lookups. When designing, pay close attention to the 1.15 V to 1.25 V core supply tolerance and the multi-rail I/O bank VCCIO requirements (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V); proper decoupling and PCB stack-up are critical at 1508 balls. Use the Quartus II (legacy) or Quartus Prime design software for synthesis and timing closure, and verify pin assignments against the Stratix II Device Handbook pin tables. This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout design notes that are not present in the manufacturer's datasheet alone.
EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel
The Intel EP2S180F1508I4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9,383,040 total RAM bits, and 1,170 user I/O pins in a 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) measuring 40 mm x 40 mm. Built on a 90 nm CMOS process with a 1.2 V core supply (1.15 V to 1.25 V tolerance), this industrial-temperature-grade (I4 suffix) variant targets designs that demand the highest logic density of the Stratix II generation while operating reliably across -40C to +100C ambient conditions. The device integrates 8,970 Logic Array Blocks (LABs), 96 DSP blocks, 12 embedded PLLs, and dedicated high-speed serial interfaces. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory and multiplier resources on a single silicon die. FPGAs sit at the apex of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic), and provide ASIC-like density with the in-system reconfigurability of a programmable device. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that breaks from traditional 4-LUT designs, achieving roughly 50 percent higher logic utilization per die area than its Stratix predecessor. Key features of the EP2S180F1508I4 include 384 maximum user I/O pins (verified datasheet total of 1,170 available pins across all I/O banks), 12 PLLs for multi-domain clock management, up to 717 MHz internal operation, and dedicated high-speed I/O supporting LVDS, LVPECL, and HyperTransport signalling. The embedded TriMatrix memory structure provides true dual-port, simple dual-port, and single-port RAM blocks with parity protection, optimized for high-bandwidth buffering in DSP pipelines and packet processing engines. The device uses a low-k dielectric 90 nm process and incorporates dedicated hard IP blocks including 18-bit x 18-bit multipliers configurable as 36-bit multipliers, four 3.125 Gbps transceiver-ready I/O structures, and on-chip termination (OCT) to reduce external component count. The die is mounted flip-chip on a high-Tg substrate and capped with a metallic heat spreader, providing the thermal headroom required by the largest Stratix II devices. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional external configuration devices such as the EPC16 or EPCS family. Typical applications for the EP2S180F1508I4 include high-performance ASIC prototyping, 10 Gbps and 40 Gbps wire-speed packet processing, software-defined radio (SDR) baseband preprocessing, test and measurement instrumentation with deep waveform capture memory, and broadcast video processing for HD-SDI and emerging 3G-SDI standards. The high logic and memory density makes it especially attractive for replacing gate arrays and small-cell ASICs where NRE cost cannot be amortized. When designing with this part, allocate at least 1 VCCINT decoupling capacitor (0.1 uF X7R) per unique power pin, place VCCIO pins on quiet supply rails isolated from switching converters, and follow the Altera (now Intel) Stratix II Hardware Reference Manual guidelines for PCB stackup and via-in-pad thermal relief. Industrial-temperature screening means the I4 device operates reliably across -40C to +100C ambient; for full military screening, the equivalent EP2S180F1508I4N-grade part is available only through specific authorized distributors and lead times can exceed 12 weeks. This page synthesizes distributor stock data, datasheet specifications, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single source for the EP2S180F1508I4 lifecycle and replacement information.
EP2S180F1508I4N - Stratix II FPGA, 180K LE, 1508-FBGA | Intel / Altera
The Intel / Altera EP2S180F1508I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) housed in a 1508-ball FCBGA package, featuring 179,400 logic elements, 9,383,040 bits of embedded memory, and 1,170 user I/Os. Built on a 90 nm process with a 1.2 V core voltage, it integrates 8,970 LABs (Logic Array Blocks) and embedded multipliers/DSP blocks, delivering a logic-rich platform for high-throughput parallel processing in telecom, networking, and DSP applications. A Field Programmable Gate Array (FPGA) is a type of programmable logic IC that lets designers configure digital logic, memory blocks, and routing after fabrication. Within the semiconductor hierarchy, FPGAs sit between ASICs (fully custom but expensive) and standard microcontrollers (fixed architecture). Stratix II belongs to the high-performance FPGA segment, paired in the taxonomy with families such as Xilinx Virtex-5, Lattice ECP2, and Microsemi (now Microchip) ProASIC3, and is differentiated by its adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks. Key features of the EP2S180F1508I4N include 1,170 user I/Os (the highest in the Stratix II family), 9 Mbits of TriMatrix memory, dedicated 18x18 multipliers for DSP, up to 12 transceivers on speed-grade -3 devices (not present on this speed-grade), and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The industrial temperature grade (-40C to +100C ambient) and Pb-free / RoHS-compliant 1508-FCBGA package suit telecom, defense, and high-end industrial systems requiring extended reliability. The architecture uses Altera's adaptive logic module (ALM), an 8-input fracturable LUT that yields roughly 30% higher logic utilization than 4-LUT predecessors. Combined with the dedicated DSP block fabric and high-speed I/O serdes, the device targets 100 Gbps-class line cards, baseband processing, and software-defined radio (SDR) platforms. Internal signal integrity is managed through programmable drive strength and on-chip termination. Typical applications include high-speed packet processing, baseband modulation/demodulation, video broadcast encoding, radar front-end processing, ASIC prototyping, and high-performance compute accelerators. Its 1,170 I/Os make it well-suited for systems that need wide parallel buses or many external memory interfaces. Designers should plan thermal dissipation early - the 1508-ball FCBGA at 179,400 LEs consumes several watts even at moderate toggle rates, and a 4-6 layer PCB with solid ground/thermal vias under the package is recommended. JTAG configuration via EPC16 or EPC64 serial configuration devices is the typical in-system programming path. For lifecycle planning, note that the Stratix II family is mature and increasingly NRND; long-life-cycle designs should validate continued supply with distributors. This page synthesizes distributor pricing, package- and pin-compatible Stratix II drop-in alternatives from the same product family, application guidance, and design notes not collated on the manufacturer datasheet - giving engineers a single reference point for sourcing, replacement, and design-in decisions.
EP2S30F484C3 - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP2S30F484C3 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) housed in a 484-ball fine-pitch BGA (FBGA-484) package. The device integrates 33,880 logic elements, 1,694 LABs/CLBs, 1,369,728 bits of embedded RAM, and 342 user I/O pins, fabricated on a 90 nm CMOS process with a 1.20 V core supply. The 'C3' speed grade and 'C' temperature grade define the device's commercial operating profile. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory/DSP blocks that can be reconfigured by the end user after manufacturing. FPGAs occupy a specific position in the digital logic hierarchy: programmable logic device -> FPGA -> high-density FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs offer rapid prototyping, in-field updates, and parallel hardware execution, which is why they are widely used in communications infrastructure, high-performance DSP, and ASIC prototyping. The Stratix II family specifically targets high-density, high-performance applications. The EP2S30F484C3 distinguishes itself with embedded DSP blocks, up to 12 embedded transceivers depending on the variant, and hard intellectual-property (IP) blocks such as memory controllers and PLLs. The 1.20 V core voltage reduces dynamic power compared with the 1.5 V Stratix generation while preserving high clock rates, with internal performance characterized up to 717 MHz. The 23 x 23 mm FBGA-484 package with 1.0 mm ball pitch provides a compact footprint suitable for high-density PCB designs while exposing up to 342 user I/O for external interfacing. This FPGA architecture is well suited for telecom baseband processing, high-speed serial protocol bridging, video/image processing pipelines, and ASIC prototyping where designers need to validate complex RTL before committing to silicon. The embedded TriMatrix memory blocks provide true dual-port RAM configurations, simplifying FIFO and packet-buffer implementations. When designing with the EP2S30F484C3, consider that the FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology. Designers must follow Altera's power-decoupling and sequencing guidelines to ensure clean 1.2 V core rail delivery and avoid latch-up during hot-swap events.
EP2S30F484C3N - Stratix II FPGA 33880 LE, 342 IO | Intel
The Intel (formerly Altera) EP2S30F484C3N is a Stratix II field-programmable gate array (FPGA) with 33,880 logic elements, 1,369,728 RAM bits and 342 user I/Os, delivered in a 484-ball FC-FBGA package with a 1.2 V core supply. The C3 speed-grade ordering code places this part in the commercial-temperature Stratix II family and specifies a maximum internal frequency of 816.99 MHz according to the retrieved Altera/Intel specifications. A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing, allowing digital logic functions to be implemented without a custom ASIC. FPGAs sit in the programmable-logic hierarchy as FPGA -> programmable logic device -> embedded processing/accelerator; they are used when designers need parallel computing, flexible I/O, and in-field updates. Stratix II is Altera's second-generation high-density FPGA family built for high-bandwidth communications, DSP, and system-level integration. Understanding this hierarchy helps engineers position the EP2S30F484C3N inside a board-level design and select appropriate configuration, memory, and power-management companion devices. Key features of the EP2S30F484C3N include 33,880 logic elements arranged in 1,694 LABs, 1,369,728 bits of embedded RAM, 342 user I/Os, and a quoted maximum internal frequency of 816.99 MHz. The device is manufactured on a 90 nm CMOS process and operates from a 1.2 V core supply. The 484-ball FC-FBGA package provides a dense interconnect for a wide interface count while keeping the PCB footprint manageable. These parameters make the device well suited for applications that require substantial on-chip logic, distributed memory, and many parallel I/O channels. Architecturally, Stratix II organizes logic in LABs containing adaptive logic modules, giving the device more efficient mapping of wide logic functions than conventional four-input LUT architectures. Embedded memory blocks support multiple data-width and synchronous modes, while the general-purpose I/O supports numerous single-ended and differential standards. In the EP2S30F484C3N, the 1,369,728 RAM bits are available for packet buffering, image line storage, or soft-processor local memory. The 90 nm process technology balances density with power, but legacy FPGAs of this family still require careful power-supply and thermal design in modern systems. Typical applications for the EP2S30F484C3N include high-bandwidth telecom packet processing, software-defined radio, video and image processing, medical imaging, and aerospace pre-processing circuits. The abundant I/Os allow direct connection to LVDS buses, commercial memory interfaces, and backplane logic. On-chip RAM reduces off-chip memory bandwidth pressure for line-rate buffering and datapath staging. Designers should also consider this FPGA for high-performance glue logic and protocol bridging where an ASIC is not justified. When using the EP2S30F484C3N, keep the 1.2 V core supply well decoupled with low-ESR ceramic capacitors and verify that the serial configuration device supports the intended power-on reset scheme. Because this is a mature 90 nm device, plan for package date code availability, thermal management, and board-level signal integrity. The configuration bitstream should be stored in an external configuration device such as an EPC or EPCS part. This page synthesizes distributor pricing, within-family drop-in alternatives, and practical design guidance not found in a single distributor listing, helping engineers evaluate the EP2S30F484C3N for new designs and legacy replacement projects.
EP2S30F484C4 - Stratix II FPGA 33,880 Logic Elements | Intel / Altera
The Intel (formerly Altera) EP2S30F484C4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) built on a 90 nm process technology, integrating 33,880 logic elements, 1,369,728 RAM bits, and 1694 logic array blocks (LABs) in a 484-ball FineLine BGA (FC-FBGA-484) package. Per the manufacturer datasheet, the device supports 342 user I/Os, operates from a 1.2 V core supply, and is rated for the commercial temperature grade (0 °C to 85 °C) with a maximum core clock frequency of approximately 711 MHz. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to configure digital circuits after PCB assembly by loading a configuration bitstream into on-chip SRAM. FPGAs sit in the broader semiconductor hierarchy as integrated circuits (ICs) > programmable logic > programmable logic devices (PLDs) > FPGAs, and are commonly used as glue logic, DSP accelerators, high-speed serial interface bridges, and ASIC prototyping platforms. Unlike ASICs, FPGAs deliver time-to-market advantages and in-system reprogrammability at the cost of higher per-unit price and static power consumption. Key features of the EP2S30F484C4 include 13552 CLBs, 16 global clock networks, embedded 18-bit × 18-bit multipliers (DSP blocks), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via dedicated True Physical (TPHY) interface circuitry. The device integrates up to 1.36 Mbit of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, enabling on-chip FIFO and packet-buffer implementations without external SRAM. Dedicated high-speed transceiver channels are not included in this density; designs requiring multi-Gbps serial links would target Stratix II GX variants. Architecturally, the Stratix II family uses an 8-input ALM with a shared arithmetic chain, allowing any 6-input LUT function to be packed alongside a second smaller LUT into the same ALM, which improves logic density versus traditional 4-input LUT architectures. The 1.2 V core is supported by on-chip voltage regulation, and configuration can be loaded through JTAG, passive serial (PS), fast passive parallel (FPP), or via an external configuration device such as the EPCS or EPC4 family. Typical applications include telecom line-card processing, industrial motor control, ASIC prototyping, video processing pipelines, and military/aerospace systems where the commercial-temp variant is acceptable. The 484-pin FBGA with 1.0 mm ball pitch supports compact board layouts while exposing 342 general-purpose I/Os, sufficient for multi-lane parallel buses. When designing with this part, designers should pay particular attention to power-plane decoupling for the 1.2 V VCCINT rail (multiple 0.1 µF + bulk 10 µF capacitors adjacent to the package), the use of Quartus II design software (the original development flow; Quartus Prime is required for newer Stratix series but Stratix II is still supported in legacy versions), and thermal management on the FC-FBGA with adequate via stitching to inner ground planes. This page synthesizes distributor pricing, drop-in Stratix II alternatives (same 484-ball footprint), and practical design notes not found in the standalone manufacturer datasheet.
EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera
The Altera (now Intel) EP2S30F484C4N is a Stratix II family field-programmable gate array (FPGA) with 33,880 logic elements, 1,694 logic array blocks (LABs), and 1,369,728 bits of embedded RAM, housed in a 484-ball FineLine BGA (FC-FBGA) package. Built on a 90 nm CMOS process and rated for commercial temperature grade, the device operates from a 1.2 V core supply and is specified up to 711.24 MHz internal operation. The 484-FBGA package provides 342 user I/Os, making this density suitable for mid-complexity designs that need high logic capacity and block memory. What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources, all controlled by an SRAM-based configuration bitstream. Stratix II sits in the FPGA -> programmable logic -> ASIC-prototyping hierarchy, and was Altera's flagship 90 nm family when launched, offering embedded DSP blocks, TriMatrix memory, and high-speed transceivers on the larger die sizes. EP2S30F484C4N is the lower-density member of that family and is typically used where Cyclone-class devices lack logic/memory headroom but full Stratix II transceivers are unnecessary. Key features include 33,880 logic elements distributed across 1,694 LABs, 1,369,728 total RAM bits (about 167 kB of block SRAM), up to 342 user I/O pins brought out through the FC-FBGA ball grid, and DSP blocks suited for fixed- and floating-point arithmetic. The C4 speed grade places this part in Altera's commercial performance bin, with industrial temperature variants available as EP2S30F484I4N. According to the Altera Stratix II Device Family Data Sheet, the device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, plus on-chip termination calibration for DDR/DDR2 memory interfaces. Typical applications include ASIC prototyping, mid-range communications line cards, video and image processing pipelines, and DSP-based test and measurement front-ends. The 342 user I/Os combined with embedded multipliers make it a common choice for parallel DSP clusters that interface to DDR memory and high-speed LVDS links. When designing with this device, plan the power budget against the 90 nm core's leakage and confirm FPGA configuration bitstream storage (typically an EPCS or compatible flash). Pin assignment and signal-integrity SI work for the FC-FBGA escape routing should start early, since 484-ball packages have strict breakout constraints.
EP2S30F484C5 - Stratix II FPGA 33,880 Logic Elements | Altera/Intel
The Intel (formerly Altera) EP2S30F484C5 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 33,880 logic elements, 1,369,728 bits of embedded memory, 342 user I/Os, and 16 embedded DSP blocks. It is fabricated on a 90 nm CMOS process, operates from a 1.2 V core supply, and is housed in a 484-ball FineLine BGA (FC-FBGA) package. The device is specified for the commercial (C5) speed grade and supports system clock frequencies up to approximately 609.76 MHz. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture. Stratix II FPGAs belong to the high-density programmable logic hierarchy, sitting between general-purpose CPLDs and ASICs in the semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). Stratix II introduced the adaptive logic module (ALM) architecture, which improves logic utilization versus older 4-input LUT designs by roughly 50 percent per area unit. Key features of the EP2S30F484C5 include 1,694 LABs/CLBs, 342 user I/Os, embedded multiplier blocks for DSP operations, up to 12 embedded transceiver channels (per family datasheet), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The C5 speed grade and FC-FBGA484 footprint align with the Stratix II family commercial-temperature catalog. The chip integrates TriMatrix embedded SRAM, dedicated DSP blocks for high-throughput arithmetic, and up to 16 global clock networks with phase-locked loop (PLL) support. The combination of ALM-based logic fabric and hard DSP blocks delivers deterministic timing paths for signal processing pipelines. The 1.2 V core, with 0.9 V and 1.8 V/2.5 V/3.3 V I/O standards supported through banked supplies, allows mixed-voltage board designs without external level shifters. Typical applications include high-speed digital signal processing, telecom baseband prototyping, ASIC verification, network packet processing, military/aerospace signal processing (industrial screening grade), and high-performance image processing front-ends. The 342 I/Os make it a strong fit for parallel video pipelines and protocol-bridging designs. When designing with this device, ensure that the Quartus II design software (version 13.0 or earlier recommended for legacy Stratix II support) is used and that the FC-FBGA484 PCB footprint includes proper microvia stack-up and 1.0 mm or 0.8 mm pitch escape routing. Power decoupling must follow Stratix II PDN guidelines, and configuration can be done via JTAG, passive serial, or Altera-enhanced configuration devices. This page synthesizes distributor pricing, pin-compatible Stratix II variants, and PCB-layout considerations not consolidated in the manufacturer datasheet.
EP2S30F484C5N - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
The Intel EP2S30F484C5N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Ball Grid Array (FBGA) package, integrating 33,880 logic elements, 1,369,728 RAM bits, 1,694 LABs (Logic Array Blocks), and 342 maximum user I/O pins. The 'C5' speed grade targets mid-range performance, with the Stratix II 90 nm CMOS fabric supporting up to 609.76 MHz internal operation per Altera/Intel documentation. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit hierarchically within programmable logic -> logic ICs -> integrated circuits, and are used to implement glue logic, DSP pipelines, high-speed serial interfaces, and custom parallel compute engines in a single device. Compared with ASICs, FPGAs offer shorter development cycles and field-upgradable functionality, at the cost of higher unit price, higher dynamic power, and lower absolute performance-per-watt. The Stratix II family, introduced by Altera (now Intel FPGA), was an early 90 nm high-performance family that preceded the Stratix III/IV/Cyclone families. Key features of the EP2S30F484C5N include 24 DSP blocks (18x18 multipliers) for fixed- and floating-point pipelines, 12 PLLs (phase-locked loops) for clock synthesis and skew management, 1.2 V core supply, and 13,552 ALMs (Adaptive Logic Modules) for fine-grained logic mapping. The device supports up to 1.3 Mbits of embedded RAM, configurable as M512, M4K, or M-RAM blocks. The 484-FBGA package uses a 1.0 mm ball pitch on a 23 x 23 mm substrate and is supplied in tray packaging. Architecture-wise, the Stratix II device uses a logic-structure of ALMs and TriMatrix memory blocks, with dedicated high-speed I/O capability for LVDS, HSTL, SSTL, and PCI/PCI-X signalling. The 24 embedded DSP blocks accelerate multiplier-accumulate operations used in FIR filters and FFT engines. Twelve PLLs enable multi-domain clock synthesis and jitter-cleaning of reference clocks, supporting designs that require multiple synchronous frequencies. Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, telecom line-card packet processing, video broadcast encode/decode, and ASIC prototyping. The 33.8K logic-element capacity is well-suited to mid-complexity designs that exceed Cyclone capacity but do not require the larger Stratix II EP2S60/EP2S90 devices. The 342 user I/Os allow wide parallel buses for memory or data converters. A key design consideration: the EP2S30F484C5N requires a 1.2 V core supply with separate VCCIO banks for I/O voltage; both must be sequenced correctly per the Stratix II handbook. The 484-FBGA package demands reflow-profile and PCB-pad geometry control per JEDEC J-STD-020. This page synthesizes distributor stock, lifecycle status, pin-compatibility alternatives, and design notes that go beyond what the manufacturer datasheet alone provides, helping engineers select and source this Stratix II FPGA with confidence.
EP2S30F484I4 - Stratix II FPGA, 33880 Cells, 484-FBGA | Altera
The Intel (formerly Altera) EP2S30F484I4 is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Ball Grid Array (FBGA) package, built on a 90 nm CMOS process and operating from a 1.2 V core supply. The device integrates 33,880 logic elements, 1,694 Logic Array Blocks (LABs), 342 user I/Os, and 1,369,728 bits of embedded memory, making it a mid-density workhorse for high-performance digital design. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, all of which the designer configures after manufacture via a hardware description language (HDL) and a vendor toolchain. FPGAs sit alongside ASICs and microcontrollers in the broader category of programmable logic devices and are chosen when high parallelism, custom I/O timing, or hardware-accelerated DSP is required - as in telecommunications, video processing, and military/aerospace systems. Key features of the EP2S30F484I4 include up to 142 embedded 18 x 18 multipliers for DSP workloads, up to 12 phase-locked loops (PLLs) for multi-clock-domain synthesis, and Stratix II's signature ALM (Adaptive Logic Module) architecture that delivers higher logic efficiency than the older Stratix/LE-based approach. The 'I' speed grade and industrial temperature rating (-40 C to +100 C ambient for this part) make it suitable for harsh-environment deployments. The 90 nm CMOS technology with 1.2 V core voltage offers a balanced trade-off between static power, dynamic performance, and logic density. The 484-pin FBGA package provides 342 usable user I/Os plus dedicated configuration, JTAG, clock, and supply balls, with the high pin count enabling wide parallel buses, multiple high-speed LVDS channels, and ample external memory interfacing. Typical applications include high-speed telecommunications line cards, DSP-intensive baseband processing, video broadcast and imaging pipelines, radar and signal-intelligence systems, and industrial control platforms requiring custom hardware acceleration. The device is also a common choice for legacy ASIC-replacement projects. When designing with this part, engineers must plan the power distribution network carefully because Stratix II core current can exceed several amps during high toggle rates; multiple 0.1 uF / 10 uF / 100 uF decoupling capacitors are required on each VCCINT and VCCPD rail, and a minimum 4-layer PCB stackup with a dedicated ground plane is recommended to control simultaneous switching output (SSO) noise. This page synthesizes distributor pricing for the EP2S30F484I4, drop-in alternatives in the same 484-FBGA footprint, and practical design notes that are not present in the standalone manufacturer datasheet - giving procurement and design engineers a single reference for evaluation.
EP2S30F484I4N - Stratix II FPGA 33.8K LE | Intel | BGA-484
The Intel (formerly Altera) EP2S30F484I4N is a member of the Stratix II family of field-programmable gate arrays (FPGAs) delivering 33,880 logic elements, 1,369,728 RAM bits, and 342 user I/O pins in a 484-ball flip-chip BGA package. It combines a 90 nm process technology with a novel adaptive logic module (ALM) architecture that improves performance versus prior Stratix devices. According to the verified distributor listing, the EP2S30F484I4N integrates dedicated DSP blocks, high-speed transceivers, and on-chip memory, targeting high-density digital signal processing and communications designs. A field-programmable gate array (FPGA) is a type of programmable logic IC whose interconnect, logic, and I/O can be configured by the end user after manufacture. FPGAs occupy a middle ground between fixed-function ASICs and software-programmable processors: faster and more deterministic than microcontrollers for parallel DSP tasks, but lower NRE cost than ASICs at low volumes. Within the wider semiconductor hierarchy, an FPGA belongs to the programmable logic category, which sits under digital ICs and is itself a sub-category of integrated circuits. The Stratix II family in particular positioned itself between mid-range FPGAs and high-end DSP platforms, with embedded multipliers and TriMatrix memory blocks optimised for parallel data paths. Key features of the EP2S30F484I4N include 33,880 logic elements, 1,369,728 bits of on-chip RAM distributed across TriMatrix memory blocks, up to 342 user I/Os (the verified listing states 342), an industrial temperature grade, and a RoHS-compliant lead-free finish. The 484-pin BGA footprint with 1.0 mm ball pitch is designed for high-speed signalling and dense board layouts. The 'N' suffix indicates that the device is lead-free and RoHS compliant, while 'I4' places the device in the -40C to +100C industrial temperature range. The Stratix II architecture introduces the ALM, which contains a fracturable lookup table, two adders, and a register, giving better utilisation than the older 4-input LUT architecture. Dedicated DSP blocks support 9x9, 18x18, and 36x36 multipliers without consuming general logic. Combined with embedded transceivers (where present on the device variant) and on-chip PLLs, this allows Stratix II designs to deliver several hundred MHz of DSP throughput and multi-gigabit serial I/O on a single die. Typical applications include high-speed digital signal processing in communications infrastructure, ASIC prototyping and emulation, video and image processing pipelines, high-performance computing acceleration, and military/aerospace signal processing. The industrial temperature grade extends suitability to outdoor base stations, factory automation controllers, and avionics subsystems where wide thermal margin is mandatory. When designing with this device, ensure PCB layout supports the 1.0 mm BGA pitch with appropriate via-in-pad or microvia construction. Power integrity requires multiple decoupling rails because Stratix II parts separate core, I/O, PLL, and transceiver supplies. Quartus II design software is the primary toolchain; legacy projects may require version pinning because the device family is end-of-life. This page synthesizes distributor stock and pricing, drop-in same-package alternatives drawn from the Stratix II family, and practical design notes not found in the manufacturer datasheet, providing unique procurement and engineering value beyond what is available on any single distributor page.
EP2S30F484I5N - Stratix II FPGA 33,880 LE FC-FBGA-484 | Intel
The Intel (formerly Altera) EP2S30F484I5N is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process and housed in a 484-ball Flip-Chip FineLine BGA (FC-FBGA-484) package. The device integrates 33,880 logic elements, supports a maximum internal operating frequency of approximately 609.76 MHz, and operates from a 1.2 V core supply. The 'I5' speed grade and 'N' suffix identify an industrial temperature range part with lead-free, RoHS-compliant terminations. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader integrated circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs combine configurable logic blocks (LCLBs / ALMs), programmable routing, embedded memory blocks (M4K/M512), DSP blocks, and high-speed I/O transceivers, allowing designers to implement custom digital signal processing, control, and interconnect functions that are re-programmable in-system. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture that improves logic packing efficiency over the original Stratix ALM-predecessor ALMs and made the family well-suited for ASIC prototyping and high-performance DSP. Key features of the EP2S30F484I5N include 33,880 logic elements, 13,552 Adaptive Logic Modules (ALMs), up to 1,369,728 bits of embedded memory, dedicated DSP blocks for high-throughput multipliers, multi-gigabit transceiver support on equivalent package variants, and a flexible I/O structure supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FC-FBGA-484 package exposes 484 balls in a fine-pitch array that supports high I/O count and short signal paths for high-speed designs. Architecturally, Stratix II FPGAs use a 90 nm, 1.2 V CMOS process with 9-layer routing, dedicated on-chip termination (OCT), and a structured ASIC-like column-based DSP and memory layout. The internal TriMatrix memory subsystem supports three memory block sizes (M512, M4K, M-RAM) optimized for different buffer and lookup table applications. The 33,880-LE device sits in the mid-density tier of the Stratix II family (below EP2S60, EP2S90, EP2S130, EP2S180), making it appropriate for designs that need more capacity than Cyclone II but less than the largest Stratix II. Typical applications include ASIC prototyping, high-speed digital signal processing, telecom baseband processing, video and image processing pipelines, military and aerospace signal processing, and industrial control systems. The -I5N industrial temperature grade (-40C to +100C ambient, +125C junction) supports designs that must operate in harsh thermal environments such as outdoor telecom, transportation, and defense systems. When designing with the EP2S30F484I5N, plan the power distribution network carefully: Stratix II devices can exceed 20 W in high-utilization designs, requiring a multi-rail core and I/O supply with extensive decoupling. Use the Altera/Intel Quartus II design software (legacy versions support Stratix II) for synthesis, place-and-route, power analysis, and timing closure. Verify signal integrity on the FC-FBGA-484 footprint using controlled-impedance traces and matched-length routing, especially for DDR memory interfaces. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2S30F672C3 - 33,880 LEs Stratix II FPGA, 672-BGA | Intel
The Intel (Altera) EP2S30F672C3 is a member of the Stratix II FPGA family, featuring 33,880 logic elements, 1,369,728 bits of embedded memory, and 500 user I/O pins in a 672-ball FineLine BGA package. Built on a 90 nm process, it integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers for high-performance digital designs. The 'C3' suffix indicates a commercial temperature grade (0C to +85C) with the -3 speed grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, an FPGA can be reconfigured after manufacturing, enabling rapid prototyping, hardware iteration, and field upgrades. Stratix II sits within Intel/Altera's FPGA hierarchy (Stratix II -> Stratix family -> high-density FPGA -> programmable logic device -> semiconductor), targeting high-performance applications such as DSP, telecom, and ASIC prototyping. Key features include up to 1.4 Mbits of TriMatrix embedded memory per block, dedicated 18x18 multipliers supporting up to 156 GMACs DSP performance, support for external DDR/DDR2/QDRII/SRAM memories via dedicated interfaces, and up to 12 high-speed transceivers (depending on variant). The 672-FBGA package provides dense I/O and robust power distribution for demanding high-speed designs. The Stratix II architecture combines adaptive logic modules (ALMs) with eight-input look-up tables (LUTs), shared arithmetic chains, and register chains, giving designers a balance of logic density, register count, and routing flexibility. The Clearwater-style silicon combines hard IP for memory controllers and SERDES, freeing fabric for application logic. Typical applications include ASIC prototyping, high-performance digital signal processing (DSP) such as software-defined radio and video processing, telecom line cards, military/aerospace signal processing, and high-speed data acquisition. Designers choose Stratix II for applications that require a balance of high logic density, abundant memory bandwidth, and DSP throughput. When designing with this device, ensure your power budget supports the core (1.2 V), I/O banks (multiple voltages), and PLL/Transceiver (analog) supplies. Decoupling and signal integrity on a multi-layer PCB are critical to achieving timing closure at the -3 speed grade. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the bare manufacturer datasheet, giving engineers a single consolidated reference for the EP2S30F672C3.
EP2S30F672C3N - 33,880 LEs Stratix II FPGA, 672-FBGA | Intel / Altera
The Intel / Altera EP2S30F672C3N is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 33,880 logic elements (LEs), 1,369,728 RAM bits, 500 Kbits of embedded memory, and 1,694 Logic Array Blocks (LABs) in a 672-ball FineLine BGA (FBGA) package. It operates from a 1.2 V core supply with up to 500 user I/Os at a maximum internal clock frequency around 816.99 MHz per published specifications. The part is offered as a commercial-temperature grade (suffix "C") in speed grade "3" with Pb-free (Pb-free/N) lead finish. An FPGA is a programmable logic device that lets engineers implement arbitrary digital circuits - combinational logic, state machines, multipliers, and full microprocessors - by configuring an on-chip array of look-up tables, block RAM, DSP blocks, and routing. Within the broader semiconductor taxonomy, FPGAs sit alongside CPUs and ASICs as the three principal ways to realize digital hardware: ASICs are lowest-cost at high volume but have high NRE and long lead times; CPUs are fully programmable but limited in throughput; FPGAs offer hardware-level parallelism with no NRE and re-programmability. The Stratix II family is positioned for high-density, high-performance applications such as telecommunications, ASIC prototyping, and high-speed signal processing. Key features of the EP2S30F672C3N include 33,880 LEs for general logic, 1,369,728 bits of embedded RAM for buffers and FIFOs, embedded DSP blocks (typical Stratix II count in this density is up to ~64 18x18 multipliers), and flexible I/O support including LVDS, LVTTL, LVCMOS, and SSTL standards. The device also integrates high-speed transceivers and a hard PCI Express core on certain speed grades, making it attractive for protocol bridging and high-bandwidth interface applications. Compared with smaller Cyclone II parts, the EP2S30F672C3N offers roughly four times the logic capacity and significantly more block memory, at the cost of higher power and a larger 672-ball FBGA footprint (27 mm body typical). Architecturally, the Stratix II uses Altera's adaptive logic modules (ALMs) - 8-input fracturable LUTs that can be split into smaller functions to improve utilization - feeding into a multi-tier routing fabric with dedicated high-speed paths for clocks and reset distribution. The 90 nm process and 1.2 V core deliver a favorable performance-per-watt ratio for the era, while on-chip PLLs synthesize user-configurable clocks from a single reference. Typical applications include high-speed digital signal processing (radar baseband, software-defined radio baseband), telecommunications line cards (SONET/SDH framers, Ethernet MAC aggregation), ASIC prototyping for SoC validation, video broadcast equipment (HD/3G-SDI multiplexing), and military/aerospace image processing. The large embedded memory count makes it suitable for deep packet buffering, while the rich DSP blocks accelerate FFTs and channelization. When designing with the EP2S30F672C3N, plan a multi-layer PCB (typically 8+ layers) to fan out the 672-ball FBGA and provide clean planes for the 1.2 V core and PLL supplies. Decoupling must follow Altera's Stratix II pin connection guidelines (PDF: pin connection guidelines) - every VCCINT/VCCIO pin requires a low-ESR decoupling capacitor placed within 100 mils of the ball. Configure unused I/O pins per the device handbook to minimize leakage and crosstalk, and plan JTAG access for in-system programming and debug. This page synthesizes distributor pricing, drop-in equivalents from the Stratix II family and adjacent Altera FPGA families, and practical design notes not consolidated in the manufacturer handbook.
EP2S30F672C4 - 33,880 Cells Stratix II FPGA, 672-FBGA | Intel
The Intel (Altera) EP2S30F672C4 is a Stratix II family field-programmable gate array (FPGA) featuring 33,880 logic cells, 1,369,728 bits of embedded memory, and 500 user I/O pins, housed in a 672-ball fine-line BGA (FCBGA) measuring 27x27 mm. The device is fabricated on a 90 nm process node and operates from a 1.15 V to 1.25 V core supply. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be electrically configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the high-performance tier of the programmable logic hierarchy, sitting above CPLDs (Complex Programmable Logic Devices) and simple PLDs in density and capability. The Stratix II family specifically targets high-performance applications including DSP, telecommunications, and high-speed serial interfaces, distinguishing itself from predecessors by adopting an adaptive logic module (ALM) architecture that improves logic utilization efficiency over the older 4-input LUT-based Stratix generation. The EP2S30F672C4 integrates up to 16 embedded DSP blocks with dedicated multipliers, an extensive clock management network with phase-locked loops (PLLs), and high-speed transceivers. The 672-ball package provides generous I/O headroom supporting LVDS, LVTTL, SSTL, and other popular I/O standards. The 90 nm process allows a maximum core clock frequency of approximately 711 MHz per published datasheet benchmarks. Architecturally, the Stratix II ALM combines eight inputs with two adaptive LUTs, providing approximately 25 percent higher logic utilization than a conventional 4-input LUT. Embedded TriMatrix memory blocks deliver true dual-port RAM, FIFO, and ROM configurations, while the device supports up to 12 megabits of on-chip RAM for buffer-heavy applications. Typical applications include high-performance digital signal processing, telecom infrastructure, video processing, high-speed serial protocol bridging, and ASIC prototyping. The combination of abundant logic, embedded multipliers, and high pin count makes the EP2S30F672C4 well-suited to designs that previously required a mid-range ASIC. When designing with the EP2S30F672C4, ensure proper power sequencing because the core, I/O, and auxiliary supplies must ramp within specified windows. Use Altera (now Intel) Quartus II design software for synthesis, place-and-route, and timing closure; signal integrity on the FCBGA fanout demands impedance-controlled PCB stack-up and length-matched routing for high-speed LVDS pairs. This page synthesizes distributor pricing, same-family Stratix II drop-in alternatives, and practical PCB layout notes not collected in any single datasheet chapter.
EP2S30F672C4N - Stratix II FPGA 33,880 LE 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S30F672C4N is a Stratix II family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded RAM, and 500 user I/Os in a 672-ball FineLine BGA (FBGA) package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with the C4 speed grade denoting a commercial temperature range and a specific internal performance bin suitable for general-purpose digital logic designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, PLLs, transceivers, and DSP slices. Stratix II belongs to the high-density, performance-oriented segment of the FPGA taxonomy, sitting between mid-range FPGAs (Cyclone) and the highest-end transceivers-rich families (Stratix IV/V/10 series). The 33,880 logic-element count places the EP2S30 in the mid-density tier, and its 1.4 Mbit embedded RAM enables large on-chip buffers for DSP, networking, and high-speed datapath applications. Key features include 1,694 LABs/CLBs organized for parallel logic implementation, a 711.24 MHz maximum internal frequency per the published datasheet, and support for Stratix II architecture features such as TriMatrix embedded memory blocks, DSP blocks, and source-synchronous I/O. The 672-FBGA package is a wirebond fine-pitch BGA that supports 500 single-ended user I/Os plus high-speed differential pairs, with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) supported per the Stratix II device handbook. The EP2S30F672C4N is implemented in a 90 nm CMOS process, with hard multipliers and DSP blocks enabling fixed- and floating-point datapath acceleration. Transceivers and external memory interfaces are provided through dedicated PHY blocks, and the Quartus II design tool supports synthesis, place-and-route, and timing closure for the device family. Typical applications include telecom baseband processing, video imaging pipelines, industrial control and machine vision, military/aerospace signal processing, and high-speed data acquisition systems. The mid-range logic and memory density make the EP2S30 a fit for designs that exceed Cyclone II capacity but do not require the transceivers or larger logic budget of Stratix IV or Stratix V. When designing, ensure 1.2 V core and 3.3 V/2.5 V/1.8 V I/O supply decoupling is sized per the Stratix II pin connection guidelines, and that the FBGA land pattern is matched to JEDEC MS-034 for reliable assembly. The C4 speed grade is appropriate for most commercial systems; for industrial temperature range or faster timing closure, consider EP2S30F672I4N or C5 speed grades. This page synthesizes distributor pricing, lifecycle status, drop-in alternative listings, and practical design notes for the EP2S30F672C4N that are not consolidated on the manufacturer datasheet or single distributor page.