FPGA & CPLD
Produkte (6666)
XA7A12T-2CSG325I - Automotive Artix-7 FPGA 12.8K LC | AMD
The AMD Xilinx XA7A12T-2CSG325I is an automotive-qualified Artix-7 field programmable gate array (FPGA) in a 324-ball LFBGA/CSPBGA (CSG325) package. It provides 12,800 logic cells, 150 user I/O, and 737,280 bits of block RAM, with a -2 speed grade that supports high-performance, real-time processing in harsh environments. As part of the XA Artix-7 automotive family, this device delivers AEC-Q100-grade dependability and operates over an industrial temperature range. An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric can be configured after manufacturing using hardware description languages such as Verilog or VHDL. FPGAs occupy a unique position in the programmable logic hierarchy, combining hardware-level parallelism with reconfigurability and low-latency I/O. The Artix-7 architecture targets power-conscious, high-volume applications that need moderate logic density, rich I/O flexibility, and deterministic timing. Key feature highlights include 40 DSP48E1 slices for high-throughput multiply-accumulate signal processing, three clock management tiles (CMTs), and a 1.0 V core supply that reduces dynamic power. The -2 speed grade is ideal for 100-300 MHz interface and logic designs. The CSG325 package measures only 15 x 15 mm, with a 0.8 mm ball pitch that allows cost-effective 4-layer PCB routing. The device is JESD-609 e1 lead-free (SnAgCu finish), RoHS compliant, and MSL-3 rated with a 260 C peak reflow temperature. Architecturally, the device uses the proven 7-series SRAM-based fabric with 6-input LUTs, dual flip-flops per slice, and cascade chains for arithmetic. The internal block RAM can be configured as 36 Kb or 18 Kb primitives with multiple parity bits. The configuration engine supports master SPI, master BPI, slave SelectMAP, slave serial, and JTAG modes, providing flexible boot options for automotive and industrial systems. Typical applications are automotive ADAS pre-processing, sensor fusion gateways, industrial motor control, medical ultrasound front ends, networking line cards, broadcast video interfaces, and test equipment. The 150 user I/O with HR (high-range, 1.2 V to 3.3 V) capability lets designers interface directly to many sensors, ADCs, and memory devices without external level shifters. When designing with this device, follow AMD/Xilinx UG583 recommendations for BGA power decoupling: place 1.0 uF and 0.1 uF capacitors under the package on VCCINT, and ensure a monotonic, sequenced power-up of VCCINT, VCCBRAM, and VCCO for reliable configuration.
XA7A50T-1CSG325Q - Automotive Artix-7 FPGA, 52K LC | AMD
The AMD XA7A50T-1CSG325Q is an automotive-grade Artix-7 XA Field Programmable Gate Array (FPGA) IC delivering 52,160 logic cells, 150 user I/O, and 2,764,800 system gates in a 324-ball LFBGA (CSPBGA) package. The "XA" prefix designates AMD's automotive-qualified Artix-7 family, qualified per AEC-Q100 for harsh-environment deployments, while the "-1" speed grade and "Q" suffix denote the standard temperature tier with automotive qualification. The device is fabricated on a 28nm high-k metal-gate (HKMG) low-power process, balancing performance-per-watt with cost-effectiveness for volume automotive and industrial designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP blocks such as transceivers, block RAM, and DSP slices. Within the broader programmable logic hierarchy, the Artix-7 family sits at the low-power, cost-optimized tier below Kintex-7 and Virtex-7, targeting high-volume, power-sensitive applications. The XA7A50T occupies the mid-density position in the XA Artix-7 lineup and is engineered to replace discrete ASICs and ASSPs in automotive driver assistance, infotainment, and industrial control systems. Key features include 2,764,800 system gates, 52,160 logic cells, 2,700 Kbits of block RAM distributed across 75 36-Kbit BRAMs, 120 DSP48 slices for fixed- and floating-point arithmetic, and 4 GTP transceivers capable of up to 6.6 Gb/s line rate. The fabric supports clock management tiles (CMTs) for high-precision frequency synthesis, with up to 64 I/O standards including LVDS, HSTL, SSTL, and 1.5V/1.8V/2.5V/3.3V LVCMOS. Programmable logic resources are accompanied by an integrated configuration controller that supports master/slave SelectMAP, JTAG, and SPI flash boot modes. Architecturally, the device leverages 6-input LUTs for logic optimization and dedicated carry chains for high-speed arithmetic. The XA qualification adds extended temperature testing, PPAP documentation, and longevity support matching automotive program lifecycles. Power is managed through a dedicated core voltage rail (1.0V VCCINT) and separate I/O bank supplies (VCCO), enabling mixed-voltage interfacing on a single die. Typical applications include automotive driver assistance (ADAS) sensor fusion, surround-view camera processing, vehicle networking gateways, industrial motor control, factory automation, and portable medical imaging. The wide operating temperature and automotive qualification make it particularly suited for under-hood ECUs and zonal architectures. When designing with the XA7A50T-1CSG325Q, follow AMD's Kintex/Artix-7 PCB layout guidelines for power decoupling — at least 24 low-ESL 0.1µF capacitors around the BGA, plus bulk 47–100µF ceramic on each power rail. The 324-LFBGA requires microvia or via-in-pad PCB technology for reliable assembly. This page synthesizes distributor pricing, AEC-Q100 automotive qualification details, drop-in Artix-7 alternatives, and PCB design guidance not aggregated in the manufacturer datasheet.
XA7A75T-2CSG324I - Automotive Artix-7 FPGA | AMD
AMD XA7A75T-2CSG324I is an automotive-grade Artix-7 field-programmable gate array in a 324-terminal LFBGA package, with 210 I/O, 75,520 logic cells, and a 387,072-bit fabric presented in the verified distributor data. The device combines programmable logic, fixed resources, and automotive-oriented temperature grading in a 28 nm FPGA platform. Its -2 speed grade favors performance over the -1 grade, while the XA prefix identifies the automotive Artix-7 family. An FPGA is a semiconductor whose digital function is configured after manufacture. A field-programmable gate array belongs to the broader logic-device hierarchy: FPGA, programmable-logic IC, digital semiconductor, and embedded computing component. Instead of relying solely on fixed application-specific logic, an FPGA integrates configurable lookup logic, programmable routing, block resources, memory, and I/O into one reconfigurable device. Verified listings identify 210 I/O, 75,520 logic cells, and 387,072 fabric bits. The searchable Artix-7 product page states that the family uses a 28 nm process and targets high performance per watt. Additional performance figures such as clock rate, block-RAM capacity, DSP resources, power, and temperature limits were not supplied in the verified input and therefore are not inferred here. The 324-LFBGA package supports dense PCB integration but requires exact land-pattern, ball-map, and assembly-process control. Verified distributor data separately describes the package as 324-LFBGA or CSPBGA. AMD publishes package pinout files in TXT and CSV formats, giving engineers the authoritative ball assignments needed for PCB and design-signoff work. Potential uses include automotive sensing, vehicle communication, industrial image processing, embedded control, and high-throughput digital logic. Suitability depends on the complete AMD Artix-7 datasheet, selected tools, automotive qualification requirements, temperature grade, resource utilization, timing closure, and system power budget. A robust design should begin with the AMD package-pinout files, preserve all required power and configuration pins, and constrain every interface against the appropriate device-speed and automotive qualification constraints. Use Vivado or another AMD-supported implementation flow for constraints, synthesis, implementation, timing analysis, and bitstream generation. This page consolidates verified distributor identity, package, resource, and sourcing data with replacement analysis and implementation guidance. It does not infer unprovided electrical ratings, pricing, stock status, or full ball assignments; those fields remain explicitly separated from verified facts.
XA7S25-1CSGA324I - Spartan-7 FPGA, 150 I/O | AMD
The AMD XA7S25-1CSGA324I is a member of the Spartan-7 XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance and reliability. It features 23,360 logic cells, 3,650 adaptive logic modules (ALMs), and 1.58 Mbit of block RAM, providing ample resources for moderate-complexity digital designs. The device is housed in a 324-ball CSGA (Chip-Scale BGA) package with 150 user I/O pins, supporting a core voltage of 0.95V to 1.05V and operating over a temperature range of -40°C to +100°C. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement any digital logic function. They are a subset of programmable logic devices (PLDs) and sit within the broader category of embedded processors and controllers. FPGAs are distinct from microcontrollers and ASICs because they offer reconfigurability, enabling rapid prototyping and in-field updates. Key features of the XA7S25-1CSGA324I include 150 user I/Os, 1.58 Mbit of block RAM, and support for various I/O standards such as LVCMOS, LVDS, and SSTL. The device is AEC-Q100 qualified, making it suitable for automotive electronics. It also supports partial reconfiguration and has built-in security features like AES bitstream encryption. The CSGA-324 package offers a compact footprint with a 0.8mm ball pitch, ideal for space-constrained designs. Technically, the Spartan-7 family is built on a 28nm process, balancing performance and power efficiency. The XA7S25 includes DSP slices for signal processing, clock management tiles (CMT) with PLLs and MMCMs, and high-speed transceivers (though this specific variant does not include GTP transceivers). The device supports configuration via JTAG, SPI, or BPI interfaces, and can be programmed using AMD's Vivado Design Suite. Typical applications include automotive driver assistance systems (ADAS), industrial motor control, machine vision, and communication interfaces. The XA7S25's combination of logic density, I/O count, and automotive qualification makes it ideal for these environments. When designing with this FPGA, ensure proper decoupling of the core and I/O supplies, and follow the layout guidelines in UG475 for the CSGA package. The device requires a 1.0V core supply and 1.8V/2.5V/3.3V I/O supplies, depending on the bank configuration.
XA7Z020-1CLG400Q - Automotive Zynq-7000 SoC with Artix-7 FPGA | AMD
The AMD XA7Z020-1CLG400Q is an automotive-grade Zynq-7000 XA System-on-Chip (SoC) integrating a dual-core ARM Cortex-A9 MPCore processor with CoreSight debug, an Artix-7 FPGA fabric containing 85K logic cells, and 6.25 Gb/s transceivers, packaged in a 400-ball CSPBGA (CLG400, 17x17 mm, 0.8 mm pitch). It targets AEC-Q100 Grade 2 operating conditions (-40C to +105C Tj) for automotive driver assistance, infotainment, and industrial vision systems. An SoC FPGA (System-on-Chip with FPGA fabric) is a class of heterogeneous computing device that combines a hardened Application Processor (APU) subsystem with programmable logic on a single die. The ARM Cortex-A9 cluster runs up to 667 MHz in this speed grade, executing an OS (typically Linux or AUTOSAR) while the Artix-7 PL accelerates parallel DSP, sensor fusion, and custom interfaces. This architecture sits within the broader hierarchy of embedded processors -> microcontroller/MPU -> SoC FPGA -> heterogeneous compute platform. Key device highlights include 53,200 LUTs, 560 Kbit block RAM, 220 DSP48E1 slices, and 200 user I/O pins. The processing system adds a NEON media engine, single/double-precision FPU, L1/L2 caches, and a rich peripheral set (USB 2.0, Gigabit Ethernet, SD/SDIO, CAN 2.0B, UART, SPI, I2C). Hard PCIe Gen2 x4 controllers, 32-bit DDR3/DDR3L memory controller, and 4 high-speed serial transceivers enable high-bandwidth interfaces. From an architectural perspective, the device is built on a 28 nm HPL process with separate PS and PL power domains, allowing the processor to operate while the FPGA fabric is held in reset (or vice versa). The 667 MHz Cortex-A9 in the -1 speed grade is the slowest in the Zynq family (versus the -2 grade at 866 MHz), trading some CPU throughput for cost savings in non-throughput-critical designs. Typical automotive applications include surround-view ADAS camera fusion, automotive Ethernet gateways, HMI/infotainment controllers, and motor-control servo drives. Industrial uses range from machine vision over GigE Vision to deterministic EtherCAT controller nodes. A key design consideration is power-tree sequencing - PS and PL each require dedicated 1.0V core and 1.8V/2.5V/3.3V auxiliary rails, and the PS must boot first through a dedicated configuration process. This page synthesizes DigiKey distributor pricing, parametric cross-references, and practical design notes not found in the standalone datasheet PDF.
XC2C256-7TQG144C - 256-Macrocell 6.7 ns CPLD | AMD
The AMD XC2C256-7TQG144C is a CoolRunner-II complex programmable logic device with 256 macrocells, a 6.7 ns propagation delay, and 118 I/O pins in a 144-pin TQFP package. It provides approximately 6000 gates of logic for compact programmable control, interface, and signal-routing designs. A complex programmable logic device, or CPLD, is a programmable-logic semiconductor that combines interconnected macrocells with programmable interconnect. In the broader hierarchy, a CPLD is a programmable logic device and an FPGA alternative. Unlike mask-programmed logic, a CPLD permits design changes without fabricating a new integrated circuit. The CoolRunner-II architecture also uses nonvolatile configuration storage, allowing the programmed logic to remain available after power is removed. The XC2C256 family provides 16 logic array blocks and 256 macrocells according to the available product data. Its -7 speed designation corresponds to the reported 6.7 ns propagation-delay class. With 118 user I/O pins, it supports parallel external interfaces and board-level control functions. The 1.7 V to 1.9 V internal supply range is suitable for systems designed around the device's documented core operating conditions. Typical uses include industrial control, communications equipment, portable electronics, programmable interface logic, bus arbitration, and compact control-plane functions. The CPLD can consolidate multiple fixed-function gates into one programmable device, reducing board area compared with a larger gate-array implementation when the required logic is modest. Designers should still verify timing, power, I/O standards, and pin constraints against the complete CoolRunner-II datasheet and their specific design. The principal design consideration is tool and configuration compatibility. Existing CoolRunner-II projects depend on supported AMD or Xilinx programming tools, device support, and verified bitstream compatibility. Before replacing an installed device, engineers must check the exact package, speed grade, temperature grade, power behavior, and pin assignment rather than relying only on the family name. This page consolidates the supplied distributor and manufacturer information, distinguishes verified facts from unavailable specifications, and adds selection and sourcing guidance. Because the provided data does not include a complete pin table, electrical limit table, or qualified replacement list, those fields remain explicitly marked for engineering review.
XC2C64A-7QFG48I - 64-Macrocell CoolRunner-II CPLD, 7ns | AMD/Xilinx
The AMD/Xilinx XC2C64A-7QFG48I is a 64-macrocell, 1.8V CoolRunner-II Complex Programmable Logic Device (CPLD) with 4.6 ns pin-to-pin propagation delay, housed in a 48-pin QFG (QFN) surface-mount package. The device belongs to the CoolRunner-II family, which combines low static power (~15 µA quiescent current) with non-volatile flash configuration memory and in-system programmability via IEEE 1149.1 JTAG. A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device that sits between discrete glue logic and FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC -> semiconductor). CoolRunner-II devices implement logic in function blocks based on PLA (Programmable Logic Array) sub-blocks with macrocell flip-flops, providing deterministic timing that simplifies design sign-off in glue-logic applications. Key features of the XC2C64A-7QFG48I include 64 macrocells organized as 4 logic blocks of 16 macrocells, 33 usable I/O pins (out of 37 total), 1.5K usable gates, a pin-to-pin delay of 4.6 ns at industrial temperature range, and DataGATE technology for per-pin input signal blocking to reduce dynamic power. The 0.18 µm CMOS process enables 1.8V core operation with I/O tolerance to 3.3V signals, simplifying interfacing with legacy 3.3V peripherals. The architecture combines a deterministic timing model with low-power 1.8V operation, making this CPLD well-suited for portable and battery-powered designs. The internal 1.8V VCCINT and I/O banked VCCIO supply rails permit mixed-voltage signaling without external level shifters, while the four global clock networks and per-macrocell OE controls give designers flexible clocking and bus-management options. Typical applications include portable/battery-powered consumer electronics where low quiescent current matters, industrial control I/O expansion and bus bridging (I2C, SPI, UART glue logic), and telecom infrastructure glue logic interfacing 3.3V peripherals to 1.8V processors. Designers also deploy this part in medical handheld devices and white goods motor control boards. When designing with this device, ensure the JTAG chain length and TDO load remain within specifications if multiple CoolRunner-II parts share one chain. The DataGATE feature can be disabled per pin to preserve dynamic behavior on critical paths; verify per-pin signal integrity when chaining long busses. This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
XC2S50E-6PQG208C - Spartan-IIE FPGA, 50K Gates, 208-PQFP | AMD
The AMD (formerly Xilinx) XC2S50E-6PQG208C is a Spartan-IIE Field Programmable Gate Array (FPGA) IC integrating 50,000 system gates, 1,728 logic cells, and 32,768 bits of block RAM in a 208-pin Plastic Quad Flat Pack (PQFP / 208-BFQFP) package with 146 user I/O pins. It is built on a 0.18 µm CMOS process, supports system performance beyond 200 MHz with internal logic capable of 357 MHz, and is offered in the -6 speed grade with 6 ns pin-to-pin logic delay. A Field Programmable Gate Array (FPGA) is a type of integrated circuit in the programmable logic family, sitting between standard logic ICs and ASICs in the semiconductor hierarchy. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that can be reconfigured post-manufacture to implement arbitrary digital logic. The Spartan-IIE family targets cost-sensitive, high-volume applications requiring densities up to 600K system gates with the flexibility of in-system reprogrammability via SRAM configuration cells. Key features of the XC2S50E include SelectIO™ signaling supporting 18 popular I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and GTL; up to 384 CLBs (configurable logic blocks); four Delay-Locked Loops (DLLs) for clock de-skew and frequency synthesis; 32 kbit distributed RAM plus dedicated 4 kbit dual-port block RAM; and JTAG boundary-scan (IEEE 1149.1) for board-level testing. The device operates from a 2.5 V core supply with 1.5 V–3.3 V auxiliary supply for I/O flexibility. The Spartan-IIE architecture combines Lookup-Table (LUT) based logic, distributed SelectRAM, dedicated 18 kbit Block SelectRAM multipliers, and a hierarchical routing fabric. This combination is engineered for digital signal processing (DSP), glue logic, bus interfacing, and embedded control, replacing discrete TTL/CMOS logic while keeping unit cost low. Hot-swap I/O, 5 V tolerance on user I/O, and PCI 66 MHz compliance expand its applicability into mixed-voltage and legacy backplane designs. Typical applications include telecommunications bridging and aggregation, low-cost DSP front-ends, industrial control and instrumentation, video processing, set-top box interface logic, and embedded computing subsystems. The 208-PQFP with 1.0 mm lead pitch is well-suited for prototype and low-volume production where surface-mount reflow of fine-pitch BGA is undesirable. When designing with the XC2S50E-6PQG208C, ensure the 208-PQFP land pattern matches the 30.6 mm × 30.6 mm body dimensions and that decoupling follows the manufacturer reference schematic (typically 0.1 µF + 10 µF per supply rail). The ISE WebPACK toolchain supports this device and is recommended for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing for the lead-free commercial-grade variant, drop-in same-package speed/package alternatives, and practical design notes not consolidated on any single distributor or datasheet page.
XC2V1500-4FFG896C - Virtex-II 1.5M Gates FPGA | AMD/Xilinx
The AMD (formerly Xilinx) XC2V1500-4FFG896C is a Virtex-II family Field-Programmable Gate Array (FPGA) IC integrating 1.5 million system gates, 17,280 logic cells, and 884,736 bits of block RAM in a 896-ball Flip-Chip Fine-pitch Ball Grid Array (FFG/FCBGA) package. The '4' speed grade, commercial 'C' temperature (0C to 85C), and 528 user I/O make it suitable for high-density logic prototyping, embedded processing platforms, and high-speed serial interfacing using SelectIO and RocketIO-capable I/O standards (when paired with the appropriate family member). A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure post-manufacture to implement arbitrary digital circuits, from glue logic to full processor subsystems. Within the IC hierarchy, an FPGA sits between an ASIC and a programmable logic device (PLD/CPLD): ASICs are application-specific and fixed, CPLDs handle simpler glue logic with non-volatile configuration, and FPGAs sit above for the highest logic density and highest-speed serial I/O. Virtex-II is the Xilinx generation built on a 0.15 micrometer CMOS process with 1.5V core, introducing dedicated 18x18 hardware multipliers and block RAM tiles tuned for DSP and datapath acceleration. Key parameters worth highlighting: 1.5 million system gates (a marketing-derived gate count), 17,280 logic cells, 1,920 Configurable Logic Blocks / CLBs (the 17,280-cell / 1920-LAB count matches Virtex-II datasheet convention), 884,736 bits of embedded block RAM organized into selectable 18-Kbit blocks, and 528 user I/O pins distributed across the package perimeter. The device supports configuration via SelectMAP, JTAG (IEEE 1149.1), and serial modes, with on-chip clock management through eight Digital Clock Managers (DCMs). Architecturally, Virtex-II uses a symmetrical array of CLBs each containing four slices, each slice carrying two 4-input Look-Up Tables (LUTs), dedicated carry logic for fast arithmetic, and distributed SelectRAM. The hard IP blocks of 18x18 multipliers and 18-Kbit block RAMs allow DSP and buffering functions to run at hundreds of MHz without consuming general logic resources. Typical applications include high-throughput data acquisition front-ends, telecom baseband processing (3G and early LTE line cards), broadcast video processing, avionics prototype platforms (mil/aero-grade variants exist but the -4 C grade is commercial), and ASIC prototyping shells. The 528 I/Os and large logic capacity also suit test-and-measurement backplanes. Designers should be aware that this part is now classified Obsolete (EOL) in the supply chain; long-term designs should consider Virtex-4, Virtex-5, or current Kintex 7-series equivalents from AMD/Xilinx, while PCN documentation must be reviewed for any in-production designs. Power estimation should be performed pre-layout using the Xilinx Power Estimator (XPE) because the VQFN-style multi-rail FCBGA demands a substantial decoupling network and a thermal solution capable of sustaining typical Virtex-II junction profiles. This page synthesizes distributor inventory from DigiKey, parametric data from the manufacturer Virtex-II datasheet, and practical pin-compatibility notes not bundled into the bare datasheet PDF.
XC2VP7-6FF672 - Virtex-II Pro FPGA, 11K Cells, 396 I/O | AMD Xilinx
The AMD Xilinx XC2VP7-6FF672 is a Virtex-II Pro family Field Programmable Gate Array (FPGA) built on a 0.13um/90nm dual-process CMOS technology and housed in a 672-ball flip-chip BGA (FF672) package. It delivers 11,088 logic cells, 396 user I/O, 8 RocketIO multi-gigabit transceivers, and one embedded PowerPC 405 processor core, providing a complete system-on-chip platform for high-performance embedded designs. Virtex-II Pro FPGAs belong to the Platform FPGA family, which integrates hard IP such as multi-gigabit transceivers and embedded processor cores directly onto the programmable fabric. By combining hardware-accelerated serial I/O (RocketIO at up to 3.125 Gbps) with an embedded PowerPC 405 core, these devices enable designers to replace discrete ASSPs and reduce system BOM cost while accelerating time-to-market for networking, telecom, and embedded computing applications. Key features include 1,1088 logic cells, 792 Kbit of distributed SelectRAM, dedicated 18x18 multipliers for DSP blocks, 8 RocketIO serial transceivers, 1 hard PowerPC 405 processor core running up to 400 MHz, 396 maximum user I/O, and 27mm x 27mm FF672 package with 1.0mm ball pitch. The device supports common logic families via 1.5V core supply, 2.5V/3.3V-tolerant I/O, and is available in commercial (C) and industrial (I) temperature grades. The Virtex-II Pro architecture combines a configurable logic fabric (CLBs, slices, LUTs), block RAM, multipliers, DCM clock managers, and hard IP cores. The dual-process 0.13um/90nm CMOS process enables integration of the PowerPC 405 hard core and RocketIO transceivers, providing deterministic performance that soft processor cores on the fabric cannot match. Typical applications include 10 Gigabit Ethernet line cards, software-defined radio base stations, high-speed serial backplanes, telecom multiplexer/demultiplexer equipment, and embedded computing platforms. The integrated PowerPC 405 makes the part particularly attractive for systems requiring firmware-driven control with hardware-accelerated DSP and serial I/O. When designing with the XC2VP7-6FF672, use the Xilinx ISE Design Suite for synthesis, place-and-route, and bitstream generation. Multi-gigabit serial links require careful PCB layout with controlled-impedance differential traces; consult Xilinx application note XAPP681 for RocketIO board design guidelines. This page synthesizes AMD Xilinx distributor pricing, same-family drop-in alternatives (XC2VP7-5FF672I and XC2VP7-7FF672I in the same FF672 BGA), and practical design notes not found in the manufacturer datasheet.
XC3090L-100PC84C - XC3000 FPGA 6K Gates 100MHz PLCC-84 | Xilinx
The Xilinx XC3090L-100PC84C is a 5V, 100MHz Field Programmable Gate Array from the legacy XC3000 family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. It integrates approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) on a 5-micron CMOS process, making it one of the highest-density parts in the original XC3000 series. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of an array of configurable logic blocks, programmable interconnect, and input/output cells that engineers can program after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) and digital semiconductors, alongside CPLDs, ASICs, and microcontrollers. Unlike an ASIC (Application-Specific Integrated Circuit), an FPGA requires no photomask NRE and ships as a blank silicon canvas that the user programs via a hardware description language or schematic capture flow, then a vendor-specific bitstream. Key features of the XC3090L-100PC84C include a -100 speed grade, 144 logic-cell equivalent capability, and CMOS technology at a 5V supply. The device supports distributed RAM via CLB configuration and includes on-chip boundary-scan (IEEE 1149.1) test logic for board-level diagnostics. The PLCC-84 ceramic-compatible plastic package has a JEDEC-standard 1.27 mm pin pitch, allowing socket-mounting for prototyping or direct surface mounting for production. The XC3090L variant is the low-power evolution of the original XC3090, using a 3.3V core option in some speed grades while retaining 5V-tolerant I/O. The part is typically configured using the Xilinx XACT development environment with schematic capture, automatic place-and-route, logic and timing simulation, and an interactive design editor for design optimization. Designers should use timing calculator features and integrate with the standard design environment toolchain. Typical applications of the XC3090L-100PC84C include legacy telecommunications glue logic, industrial control state machines, prototyping ASICs, glue logic for vintage bus architectures such as VME and ISA, and educational FPGA laboratory kits. The 100MHz internal logic rate suits mid-speed glue-logic and bus-interface bridging tasks. When designing with this part, ensure adequate decoupling (one 0.1uF per supply pin cluster) and respect the 5V I/O voltage level. Note that the XC3000 family is NRND/EOL for new designs - consider Xilinx Spartan or Artix-7 for new projects unless maintaining legacy equipment. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers source or replace this legacy FPGA with confidence.
XC3090L-125PC84C - 5K-Gate FPGA, 125MHz, 84-Pin PLCC | Xilinx
The Xilinx XC3090L-125PC84C is a CMOS Field Programmable Gate Array (FPGA) from the XC3000L low-voltage Logic Cell Array family, supplied in an 84-pin PLCC package. It features 320 Configurable Logic Blocks (CLBs), approximately 5000 equivalent logic gates, 928 flip-flops, and a maximum clock frequency of 125 MHz. The device operates from a 3.0 V to 3.6 V supply (typical 3.3 V), reflecting the L-suffix low-voltage variant of the classic XC3000 architecture. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect routing, and programmable I/O cells that can be electrically configured by the end user to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable microcontrollers, offering parallel hardware execution, deterministic timing, and on-the-fly reconfigurability. The XC3000L family sits at the foundation of SRAM-based FPGA technology, with logical hierarchy: CLB -> logic cell array -> FPGA -> programmable logic device (PLD) -> digital integrated circuit. Key features of the XC3090L-125PC84C include 320 CLBs delivering roughly 5,000 usable gates, 928 edge-triggered flip-flops for pipelined or state-machine designs, a maximum toggle rate of 125 MHz, and 84 PLCC pins providing programmable I/O plus dedicated configuration, clock and JTAG interfaces. The device supports JTAG (IEEE 1149.1) boundary-scan for board-level test, in-system reprogrammability through the standard Xilinx XC3000 configuration bitstream, and a power-down mode that significantly reduces quiescent current for battery-friendly applications. Architecturally, the XC3090L implements the classic Xilinx XC3000 CLB with a 5-input lookup table feeding two flip-flops, a programmable interconnect matrix of single-length and double-length lines, and tri-state buffers that allow efficient implementation of muxes, busses, and tri-state I/O. The 125 MHz speed grade places it in the highest tier of the XC3090L family, enabling high-performance glue logic, custom state machines, and DSP-style bit-level pipelines on a single chip. Typical applications include legacy telecom interface glue logic, industrial control and instrumentation front ends, custom peripheral controllers for microprocessor systems, prototyping vehicles for ASIC verification, and reconfigurable test fixtures. Designers building long-life industrial equipment, military refresh programs, or replacement boards for existing XC3000-based systems remain the primary users of this classic part. Designers using the XC3090L-125PC84C should preserve the legacy 3.3 V supply rail, follow Xilinx XC3000 configuration mode recommendations (SelectMAP/serial master or slave), and respect the PLCC pin-out when laying out new PCBs or repairing legacy boards. This page combines distributor pricing, verified cross-reference data, and design notes that are not collected in the original Xilinx datasheet.
XC3090L-6TQ176C - 3.3V 9000-Gate FPGA, 176-Pin TQFP | Xilinx
The Xilinx XC3090L-6TQ176C is a low-voltage (3.3 V) Logic Cell Array (LCA) FPGA from the legacy XC3000L family, integrating approximately 9,000 usable gates into a 176-pin TQFP (TQ) package. It is built on a 0.8-micron CMOS SRAM process with six speed-grade -6 timing, and is intended for digital logic prototyping and small-volume glue-logic designs where 5 V-only XC3000 parts are not an option. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells, all defined by a bitstream stored in SRAM configuration memory. The XC3000L is the low-voltage (3.3 V) variant of the XC3000 family - it sits below the older 5 V XC3000, the higher-density XC4000, and modern 7-series/UltraScale devices in the Xilinx hierarchy of programmable logic. Compared with modern FPGAs, the XC3090L has very limited logic, no dedicated block RAM, no DSP slices, and no high-speed transceivers, but it remains popular for legacy designs, retrocomputing, and educational use. Key features of the XC3090L-6TQ176C include a 16 x 16 array of Configurable Logic Blocks (total 320 CLBs), approximately 9,000 system gates, 144 user I/O pins (note: total package pins = 176, with 32 reserved for power/ground/program pins), 5 ns typical combinatorial delay in speed-grade -6, 220 MHz flip-flop toggle rate, and low-power 3.3 V CMOS I/O. The TQ176 (TQFP-176) package provides a 1.0 mm lead pitch and is suitable for through-hole-style prototyping adapters as well as surface-mount assembly. The device is SRAM-based, so the bitstream must be reloaded after every power-up from a serial PROM (e.g., XC1736A) or microcontroller. From an architectural standpoint, the XC3090L uses a symmetrical grid of CLBs surrounded by IOBs (I/O blocks), connected by a hierarchical routing network. Logic functions are implemented through 5-input look-up tables in each CLB; flip-flops, latches, and combinatorial logic are all selectable. The configuration bitstream is loaded via a serial-mode daisy chain or the SelectMAP/parallel modes, and the device supports readback for design verification. Typical applications include legacy 3.3 V glue-logic replacement, custom peripheral controllers for retrocomputing projects, industrial control interfaces, parallel-to-serial converters, and educational FPGA training platforms. The wide 3.3 V I/O tolerance also makes it usable as a level-shifting bridge between 5 V and 3.3 V domains when paired with appropriate bus hold or pull-up resistors. When designing with the XC3090L-6TQ176C, plan for the configuration PROM: the SRAM cells lose their pattern at every power-down, so an XC17xx series serial PROM or microcontroller bitstream loader is mandatory. Decoupling must follow the datasheet guidelines (typically one 0.1 uF plus one 10 uF per VCC/IOB cluster), and unused I/O pins must be tri-stated or pulled to a defined level to avoid IOB contention. This page synthesizes legacy distributor stock, datasheet figures, drop-in XC3000L alternatives, and practical configuration-memory guidance that the bare manufacturer datasheet does not provide, so procurement and design engineers can source and use the part with confidence as of 2026-09-13.
XC3090L-6TQ176I - XC3000L 320MHz FPGA 176-pin TQFP | Xilinx
The Xilinx XC3090L-6TQ176I is a member of the XC3000L Low Voltage Logic Cell Array Family of Field-Programmable Gate Arrays, housed in a 176-pin TQFP package with -6 speed grade and industrial temperature rating. The XC3000L family uses a low-voltage SRAM-based logic cell architecture optimized for low-power, high-density designs, and the XC3090L device delivers approximately 320 MHz of combinatorial logic performance with 100 I/O pins organized into four I/O banks for mixed-voltage interfacing. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells. Unlike ASICs, FPGAs can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. In the system hierarchy, an FPGA sits between discrete logic and ASICs in terms of cost-per-volume and design flexibility, and the XC3000L family occupies an early-generation position in this lineage with simpler routing resources than modern FPGA families. Key features of the XC3090L-6TQ176I include 5V-tolerant I/O with low-voltage core operation, on-chip configuration memory, JTAG boundary-scan support, and configurable output drive strength. The TQ-176 package offers a 1.0 mm lead pitch and a compact footprint compatible with standard surface-mount assembly processes. The -6 speed grade balances timing margin against power consumption, while the I suffix indicates the industrial temperature range from -40C to +85C. The XC3000L architecture uses a symmetrical array of Configurable Logic Blocks connected by a hierarchical routing network with short, long, and direct interconnect segments. Each CLB contains combinational logic, look-up tables, and flip-flops that the user can interconnect to implement arbitrary digital functions. Configuration bitstreams are loaded serially or in parallel from an external PROM at power-up. Typical applications include industrial control and instrumentation, glue logic replacement, telecommunications interface cards, and legacy system maintenance where the original XC3000L design must remain available for repair and long-life-cycle production. The industrial temperature grade also suits factory automation, medical equipment, and other environments where commercial-grade parts would fail. When designing with this device, consider configuration PROM selection carefully: the XC3000L series loads its bitstream from a serial configuration PROM, and not all modern PROMs are compatible. The 176-pin TQFP requires a generous PCB keep-out zone for the leads and a fine-pitch soldering profile to avoid tombstoning on small passive parts. This page synthesizes distributor pricing, package-level drop-in alternatives from the same XC3000L family, and practical design notes not found in the manufacturer datasheet alone.
XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx
The Xilinx XC3090L-6TQG176C is a member of the XC3000L Low-Voltage Logic Cell Array FPGA family, providing 138 user I/O pins in a 176-pin Thin Quad Gull-Wing (TQG) surface-mount package with -6 speed grade and commercial operating temperature. This device is part of the legacy XC3000L series that operates from a 3.3V supply, distinguishing it from the original 5.0V XC3000A family. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration memory rather than fixed mask wiring. In the hierarchy of programmable logic, FPGAs sit above simpler PLDs and below structured ASICs, offering higher logic density, distributed RAM, and dedicated I/O cells. The XC3000L family specifically targets low-voltage (3.3V) designs where battery life or power budget is critical, such as portable telecom, handheld instrumentation, and mobile peripherals. Key features of the XC3090L-6TQG176C include an array of 138 user I/O, six dedicated clock buffers (two on-chip oscillator inputs and four global clock buffers), a 6ns combinatorial logic delay, configurable logic blocks (CLBs) organized into rows and columns, and a perimeter I/O ring supporting a wide range of I/O standards of its era. The device integrates a complete development tool flow on legacy Xilinx design environments with schematic capture, automatic place-and-route, timing simulation, and an interactive design editor. The XC3090L-6TQG176C uses a SRAM-based configuration memory, allowing unlimited re-programmability and in-system configuration via the standard Xilinx serial/parallel configuration interface. Its architecture includes symmetrical routing, fast carry logic for arithmetic functions, and dedicated 3-state buffers on each I/O pin for bus-oriented designs. The -6 speed grade delivers 6ns tpd on a typical combinatorial path. Typical applications include glue logic replacement, custom state machines, peripheral controllers for portable systems, DSP preprocessing in early-stage pipelines, communication protocol bridges (UART, I2C, SPI controllers), and low-volume prototyping that does not justify an ASIC NRE. The 3.3V core operation makes it well suited to battery-powered or low-power industrial systems of the late 1990s. When designing with this FPGA, be aware of its legacy status. Designers should verify that the 3.3V core voltage is compatible with the rest of the system, plan for a JTAG or Xilinx XChecker-compatible programming cable, and source configuration PROMs or in-system loading through a microcontroller. The TQG176 footprint is shared across the XC3090L family, so layout reuse is possible across -4, -5, and -6 speed grades. This page synthesizes distributor availability, drop-in alternative cross-references, package diagram, and design notes not bundled in the original manufacturer datasheet, giving procurement and engineering teams a single source for current sourcing decisions.
XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176
The Xilinx XC3090L-6TQG176I is a 3.3 V low-voltage member of the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQG176) and providing approximately 900 usable gates with 6 ns combinatorial delay. It is part of the original Xilinx XC3000 generation of SRAM-look-up-table FPGAs, targeting low-voltage 3.3 V systems where the original 5 V XC3000 family could not be used directly. An FPGA (Field Programmable Gate Array) is a programmable logic device whose core is an array of configurable logic blocks (CLBs) surrounded by a perimeter of programmable input/output blocks (IOBs), with a programmable interconnect matrix tying them together. The hierarchy runs: logic cell -> CLB -> FPGA -> programmable logic -> digital IC. The XC3000L subfamily is one of the earliest commercial SRAM-based FPGA lines, and the 'L' suffix denotes the 3.3 V variant of the original XC3000 architecture, allowing operation in mixed-voltage boards that were already migrating from 5 V to 3.3 V logic rails. Key features of the XC3090L include a 3.3 V core supply (VCC), 5 V tolerant I/O on selected parts, on-chip configuration logic with five configuration modes, boundary-scan (JTAG) support, and readback capability. The '6' speed grade corresponds to a combinatorial logic delay of roughly 6 ns and a flip-flop toggle rate near 80 MHz in the XC3000L process. The 'I' suffix indicates an industrial temperature grade of -40C to +85C. Typical applications include telecom interface glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs before HardCopy migration, and legacy equipment where the XC3000L footprint is already committed on the PCB. Designers using the XC3090L can prototype on the SRAM-based FPGA and migrate to a HardCopy Stratix equivalent for volume production using the same package pinout.
XC3090L-7TQ176C - XC3000L Low-Voltage FPGA | Xilinx | 176-pin TQFP
The Xilinx XC3090L-7TQ176C is a member of the XC3000L Low-Voltage Logic Cell Array family, a legacy field-programmable gate array (FPGA) designed for low-voltage (3.3 V) operation in a 176-pin TQFP package with -7 speed grade and commercial temperature range. As a programmable logic IC from the Xilinx XC3000 series, it combines SRAM-based configuration with a fine-grained logic cell architecture optimized for glue logic, control plane, and state-machine designs. A field-programmable gate array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit between programmable logic devices (PLDs/CPLDs) and application-specific integrated circuits (ASICs) in the silicon hierarchy, offering higher density than PLDs and lower NRE cost than ASICs. The XC3000L family is the low-voltage derivative of the original XC3000 architecture introduced in the early 1990s, designed for 3.3 V systems where the standard 5 V XC3000 family could not operate. Key features of the XC3090L include an SRAM-based configuration memory, an abundant count of configurable logic blocks (CLBs) and user I/O for a part of its era, and a -7 speed grade rating that places it within the standard performance bin of the family. The device is offered in the TQ176 package - a 176-pin thin quad flat pack with gull-wing leads suitable for surface-mount assembly. The commercial temperature suffix ("C") denotes 0 °C to +85 °C operation. Architecturally, the XC3090L uses a symmetrical array of configurable logic blocks surrounded by a perimeter of user-programmable I/O blocks (IOBs). Interconnect is provided by a hierarchical routing network driven by metal-mask or SRAM programming. A configuration bitstream loaded into on-chip SRAM defines all logic, routing, and I/O behavior, allowing unlimited re-programmability but requiring an external configuration memory on power-up. Typical applications for the XC3090L-7TQ176C include legacy telecom interface cards, industrial control and instrumentation, test equipment glue logic, prototype ASIC replacement, and educational hardware platforms. Designers maintaining installed-base systems with XC3000L silicon continue to source this part for repair and field replacements. When designing with this legacy FPGA, note that the -7 speed grade corresponds to a specific timing window within the family; designers should consult the original Xilinx datasheet and use the XACTstep or Foundation toolchain for synthesis, place-and-route, and bitstream generation. Configuration storage requires an external EPROM or microcontroller since SRAM cells are volatile. This page synthesizes distributor stock data, drop-in same-package alternatives, and practical sourcing guidance for engineers maintaining XC3000L designs - information not found in any single distributor listing.
XC3090L-7TQ176I - 3.3V Logic Cell Array FPGA, 176-pin TQFP | Xilinx
The Xilinx XC3090L-7TQ176I is a member of the XC3000L Low-Voltage Logic Cell Array family, a static RAM-based field-programmable gate array (FPGA) housed in a 176-pin Thin Quad Flat Pack (TQFP) package with industrial temperature grade. The XC3000L family targets low-voltage 3.3V operation while preserving the original XC3000 architecture, making it suitable for designs migrating from 5V to 3.3V logic rails. Per the XC3090L datasheet, the device integrates configurable logic blocks (CLBs), a perimeter of programmable input/output blocks (IOBs), and a programmable interconnect matrix. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits after manufacturing. Within the semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and small-scale programmable logic; they offer higher integration than discrete gate arrays and faster time-to-market than full ASICs, which is precisely why the XC3000L family was adopted across industrial, telecom, and embedded applications in the late 1990s and early 2000s. Key differentiating features of the XC3090L include roughly 9000 system gates, 320 configurable logic blocks, a 5 ns pin-to-pin logic delay at the -7 speed grade, and 3.3V core operation with 5V-tolerant I/O options. The device supports on-chip configuration via serial or parallel modes and is in-system programmable through the Xilinx XC3000 configuration bitstream format. Boundary-scan (JTAG, IEEE 1149.1) compatibility is part of the family baseline. Architecturally, the XC3090L uses SRAM configuration memory, meaning it is volatile and must be reconfigured at every power-up. The interconnect is a hierarchical routing matrix connecting CLBs through single-length, double-length, and long-line segments. This routing fabric, combined with the -7 speed grade, makes the part a credible choice for glue-logic, bus-interface bridges, and small state-machine controllers rather than high-throughput DSP. Typical applications include industrial serial-protocol bridges (UART, SPI, I2C controllers), legacy peripheral interfaces in test and measurement equipment, glue logic between microprocessors and memory buses, low-density state-machine controllers in instrumentation, and ASIC prototyping where pin-compatibility with the TQFP-176 footprint is mandatory. Designers often pair this part with an external configuration PROM such as the XC1736. One critical design consideration is that the XC3000L family is no longer recommended for new designs; Xilinx has issued multiple end-of-life notices across the XC3000L series, so longevity planning and last-time-buy inventory buffers should be considered. Engineers should verify the latest lifecycle status from Xilinx before committing the part to long-lifecycle products. This page synthesizes distributor pricing snapshots, cross-reference observations, and practical design notes that are not collated in any single manufacturer document, providing a one-stop reference for engineers evaluating the XC3090L-7TQ176I for legacy or refurbishment projects.
XC3090L-7TQG176C - XC3000L 5,000 Gates FPGA | Xilinx | TQG176
The Xilinx XC3090L-7TQG176C is a member of the XC3000L Low Voltage Logic Cell Array family, an early-generation Field-Programmable Gate Array (FPGA) built on a 0.8-micron CMOS process. The device integrates approximately 5,000 usable gates (with up to 9,000 gates peak), a 144-bit-wide Configurable Logic Block (CLB) array of 100 CLBs, and 144 dedicated I/O pins, all housed in a 176-pin TQG thin quad flat pack (TQFP) package. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic blocks, interconnect, and I/O cells. The XC3000L family is a low-voltage (3.3 V) extension of the classic XC3000 architecture, optimized for portable, low-power, and battery-backed designs where the original 5.0 V XC3000 parts were unsuitable. Key features of the XC3090L-7TQG176C include SRAM-based configuration (reprogrammable in-system), boundary-scan (JTAG) support, on-chip crystal oscillator amplifier circuitry, and tri-state output buffers capable of driving 8 mA source and 24 mA sink. The -7 speed grade indicates a logic cell toggle delay in the range of 1.3-1.5 ns with typical system clock rates up to 60 MHz, while the C suffix denotes commercial temperature grade (0C to +85C). The TQG176 package is a 1.4 mm-thin surface-mount TQFP. The XC3000L architecture uses a symmetrical CLB matrix surrounded by I/O blocks, with a hierarchical routing network driven by a binary tree of routing channels. Configuration is loaded from an external serial EPROM (bit-serial mode) or 8-bit parallel PROM at power-up; the device can also be reconfigured in-system via JTAG. Typical applications include glue logic replacement, custom state machines, bus interface bridges, low-volume ASIC prototyping, and legacy industrial controllers. Designers choose XC3000L parts today almost exclusively for sustaining long-life products and legacy system repairs where re-qualification of newer FPGA silicon is cost-prohibitive. When designing with this device, ensure your configuration memory (Xilinx XC17xx serial PROM or compatible) is properly selected for 3.3 V operation. The XC3000L series requires all I/Os to be referenced to a single VCCO bank; mixed-voltage I/O requires external level shifters, unlike modern multi-bank FPGAs. This page synthesizes distributor stock signals, drop-in TQG176 alternatives from the same Xilinx XC3000L family, and design notes based on the original Xilinx XC3000L datasheet family specification - giving engineers a single reference for sustaining and sourcing legacy XC3000L designs.
XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx
The Xilinx XC3090L-7TQG176I is a member of the XC3000L Low-Voltage Logic Cell Array FPGA family, integrating approximately 3200 usable gates in a 176-pin Thin Quad Gulp (TQG) plastic surface-mount package. It is the low-voltage (3.3 V Vcc core) evolution of the original 5 V XC3000 family, designed for portable and power-sensitive digital logic designs. The -7 speed grade and -I industrial temperature range (-40C to +100C) suffix make this part suitable for harsh-environment industrial, telecom, and embedded controller applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below structured ASICs. The XC3000L family belongs to the very first generation of SRAM-based Look-Up-Table (LUT) FPGAs, where each Configurable Logic Block (CLB) contains a small LUT and a flip-flop. Compared to modern 7 nm FPGAs, the XC3000L is severely resource-limited but remains valuable as a low-cost glue-logic substitute, a maintenance replacement for legacy boards, or a teaching vehicle for classic HDL synthesis flows. Key features of the XC3090L include 100 Configurable Logic Blocks (CLBs) yielding 3200 usable gates, 144 dedicated flip-flops, 176 user I/O pins, and on-chip distributed SelectRAM. The device is fabricated on a 0.6 um CMOS SRAM process and is in-system programmable via a standard JTAG (IEEE 1149.1 boundary-scan) interface or the legacy Xilinx XACT parallel configuration port. It supports 3.3 V core and 3.3 V/5 V tolerant I/O, making it a drop-in logic upgrade for boards originally populated with the 5 V XC3090. Typical applications span industrial control logic, legacy telecom backplane glue logic, prototyping and education platforms, and aerospace test equipment retrofits where long-term parts continuity and the Xilinx XACT toolchain still hold value. Designers transitioning a design from the 5 V XC3090 to the XC3090L benefit from lower power consumption and reduced heat dissipation while keeping the same architectural footprint and development flow.
XC3090L-8PC84BKJ - XC3000L 5V FPGA 84-Pin PLCC | AMD Xilinx
The AMD Xilinx XC3090L-8PC84BKJ is a member of the XC3000L Low-Voltage Logic Cell Array family, integrating 6K usable gates and 320 logic cells in a 84-pin PLCC (J-Lead) package. It operates from a 3.0V to 3.6V low-voltage supply, making it suitable for portable and battery-powered designs where 5V operation is impractical. The '8' speed grade specifies a nominal 70 MHz internal toggle rate within the XC3000L architecture family. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic by programming an on-chip interconnect of configurable logic blocks (CLBs) and input/output blocks (IOBs). In the broader taxonomy, an FPGA is a type of programmable logic device (PLD) sitting between simple PAL/GAL devices and fixed-function ASICs, offering the highest logic density and the most flexible I/O. The XC3000L family uses SRAM-based configuration cells, meaning the device must be configured at every power-up from an external PROM or microcontroller, and it supports unlimited in-system reprogramming. Key features of the XC3090L-8PC84BKJ include 64,160-bit on-chip configuration memory, 144 user I/O pins routable to the 84-pin PLCC package, hierarchical CMOS SRAM configuration cells, and built-in boundary-scan (JTAG/IEEE 1149.1) support for board-level testability. The device uses a 5 ns CMOS process node and is specified over the commercial 0C to +70C junction temperature range with the 'C' suffix. Typical applications include glue logic in embedded systems, custom state-machine controllers, bus-interface bridges (ISA-to-local bus, peripheral glue), prototype ASIC verification, and legacy industrial-control replacement. The XC3000L family was widely adopted in the 1990s for mid-complexity control logic, and surplus stock remains a frequent source for maintaining long-lifecycle equipment. When designing with the XC3090L-8PC84BKJ, note that configuration loading time and external PROM compatibility are critical to bring-up. Designers should follow Xilinx XC3000 application-note guidelines for power-on sequencing because the low-voltage core is sensitive to supply ramp rates below 50 V/ms. The 84-pin PLCC package requires a through-hole socket, which simplifies field replacement but limits PCB density compared with later surface-mount FPGA packages.
XC3090L-8PC84C - 320-Cell XC3000 FPGA | AMD Xilinx | 84-PLCC
The AMD Xilinx XC3090L-8PC84C is a 3.3 V low-power Field Programmable Gate Array (FPGA) from the legacy XC3000A/L family, delivering 6,000 usable gates, 320 logic cells, and a maximum toggle frequency near 80 MHz in an 84-pin Plastic Leaded Chip Carrier (PLCC, J-lead) package. It is rated for commercial temperature operation (suffix "C"), with the speed grade "-8" indicating the slowest of the XC3000 family timing grades at 3.3 V supply. The device carries 70 user I/O and 64,160 bits of configuration memory. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, surrounded by user-controllable I/O cells. FPGAs belong to the programmable logic hierarchy: programmable logic -> FPGA -> SRAM-based FPGA -> SRAM-LUT FPGA -> ASIC prototyping platform. Unlike microcontrollers, FPGAs implement hardware-level parallelism, executing logic in dedicated silicon gates rather than sequential firmware instructions. Key features of the XC3090L-8PC84C include 70 user I/O pins with TTL-compatible drivers, an on-chip oscillator for self-clocking configuration modes, JTAG-compliant boundary-scan testing support per IEEE 1149.1, and readback capability for in-system verification. The "L" suffix denotes the 3.3 V low-power variant, which reduces quiescent current versus the original 5 V XC3090 and simplifies migration to 3.3 V system rails. Architecturally, the XC3090L uses a five-input look-up table (LUT) per CLB with a distributed SRAM configuration store. Designs are captured as schematic netlists or VHDL/Verilog and compiled with the legacy XACTstep M1 toolchain, then programmed via the Xilinx HW-130 programmer or compatible JTAG loaders. The 84-PLCC footprint supports hand-soldering and socketed prototyping on through-hole boards. Typical applications include legacy industrial control interfaces, telecom line-card glue logic, ASIC prototyping for low-density glue functions, and educational FPGA laboratory platforms where students learn Verilog/VHDL design on classic SRAM-LUT silicon. The XC3090L is also used as a drop-in form factor for retrocomputing and test equipment maintenance. When designing with the XC3090L-8PC84C, designers must source the original XACTstep M1 development software, a parallel-port programmer, and acknowledge that the device is no longer in active production; lifecycle status should be confirmed before any new design commitment, and a long-term obsolescence mitigation plan is recommended. This page synthesizes distributor pricing, drop-in equivalent options, and practical design notes - engineering context that complements the legacy Xilinx datasheet but does not replace it.
XC3090L-8PC84I - XC3000 FPGA 6K Gates 320 Cells 80MHz | Xilinx
The Xilinx XC3090L-8PC84I is a member of the XC3000 family of Field Programmable Gate Arrays (FPGAs), offered in an 84-pin Plastic Leaded Chip Carrier (PLCC) package with J-lead terminations. The device contains 6,000 usable gates organized into 320 Configurable Logic Blocks (CLBs), supported by 64,160 configuration program-store bits, and operates at a maximum toggle frequency of 80 MHz from a 3.3 V core supply. The "L" suffix denotes the low-voltage 3.3 V variant of the original 5 V XC3090, and the "I" suffix indicates the industrial operating temperature grade of -40 °C to +85 °C. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks, programmable interconnect, and programmable I/O blocks, all of which are defined by a user-loaded configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy, above simple PLDs and CPLDs, and are used as flexible digital platforms ranging from glue logic and bus interfacing to complete processor cores and signal-processing pipelines. The XC3000 series, introduced by Xilinx in the late 1980s, was the company's first commercially successful FPGA family and established the SRAM-based configuration architecture that subsequent generations continued to use. Key features of the XC3090L-8PC84I include 70 user I/O pins distributed around the perimeter, an internal configuration program store that holds the user-defined logic, and per-IOB input-threshold programmability so that each I/O can be configured for TTL or CMOS compatible external signaling. The global input buffer threshold, plus per-pin output drive controls, allow direct interfacing with mixed-logic voltage domains without external level shifters. The 80 MHz toggle rate and deterministic routing make the part well suited to glue logic, state-machine controllers, and parallel bus interfaces in industrial embedded systems. Architecturally, the device combines a perimeter of I/O Blocks (IOBs), a core matrix of Configurable Logic Blocks (CLBs), and a programmable interconnect network. Each CLB contains a small combinational look-up table, storage, and carry logic, while the IOBs include input threshold detection, output drivers, and registers. Configuration is loaded into the on-chip SRAM program store at power-up from an external PROM or microprocessor, which means the design is volatile and must be reloaded after every power cycle - a defining characteristic of the XC3000 family and a key consideration when selecting this part for new designs. Typical applications for the XC3090L-8PC84I include legacy industrial-control boards, telecommunications line cards, test-and-measurement fixtures, and digital glue logic on custom hardware where it replaces discrete TTL or 4000-series CMOS. Because it is a mature, widely understood device with abundant reference designs, it is also used by engineers maintaining long-lifecycle systems in factory automation and military/aerospace subsystems where re-qualification of newer FPGAs would be prohibitively expensive. Designers should be aware that the XC3000 family has been End-of-Life for many years, and active new designs are generally not supported by current Xilinx/AMD Vivado toolchains. When designing in this part, allow for configuration time at power-up (the bitstream must be loaded from an external source), provide proper decoupling on the 3.3 V supply, and respect the 84-pin PLCC J-lead land pattern exactly - the package is not pin-compatible with modern leadless FPGA packages. If a long-term or new design is being started, evaluate Spartan-6, Spartan-7, or MAX II/10 CPLD families as migration paths with HDL portability, while preserving the XC3090L-8PC84I for existing maintenance. This page synthesizes distributor pricing, drop-in same-package alternatives from the XC3000 family, and practical design notes not consolidated on the manufacturer datasheet alone.
XC3090L-8PCG84C - 84-Pin PLCC FPGA | Xilinx XC3000 Family
The AMD/Xilinx XC3090L-8PCG84C is a member of the XC3000A/L series of Field Programmable Gate Arrays (FPGAs) housed in an 84-pin Plastic Leaded Chip Carrier (PLCC, J-Lead) package. The device integrates approximately 70 Configurable Logic Blocks (CLBs) and 64,160 bits of configuration program store (often referred to as 6,400 gates), with 70 user I/O pins available on the 84-pin PLCC footprint. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration density of a gate array with user-defined configuration stored in on-chip SRAM. Within the broader component taxonomy, the XC3090L belongs to: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. The XC3000 family pioneered the use of a perimeter of I/O Blocks (IOBs), a core array of CLBs, and dedicated interconnect resources, an architecture that remains the conceptual ancestor of every modern SRAM-based FPGA. The XC3090L is the low-voltage ('L' suffix) variant of the XC3090, optimized for 3.3V operation to reduce power consumption versus the original 5V XC3090. The '-8' speed grade indicates a moderate performance tier within the family, and 'PCG84C' denotes the 84-pin Plastic Leaded Chip Carrier (PLCC) package with commercial temperature rating (0C to +70C). The device also provides built-in configuration logic supporting serial and parallel master/slave modes, plus boundary-scan testability via JTAG/IEEE 1149.1. The architecture comprises a symmetrical array of CLBs surrounded by programmable IOBs. Each CLB contains a combinatorial logic section, two flip-flops, and routing resources, while each IOB supports a wide range of input/output standards. Distributed throughout the die are 3-state buffers and on-chip wide-edge decoders that allow the implementation of wide AND-OR-INVERT gates directly in silicon. Typical applications include glue logic replacement, legacy industrial control, telecom interface boards, and educational/prototyping systems that target the classic Xilinx XC3000 design flow. The 84-pin PLCC package is socket-friendly and is therefore favored for through-hole prototype boards and field-upgradeable modules. The device is supported by the legacy XACT and early ISE Foundation toolchains. When designing with the XC3090L-8PCG84C, ensure that the 3.3V low-voltage supply rail is decoupled close to the device and that configuration mode pins (M0, M1, M2) are tied to the proper levels for the chosen programming source. Boundary-scan and readback features are particularly valuable for in-system verification on telecom and industrial boards. This part is now considered legacy/last-time-buy by Xilinx and is widely available only through aftermarket distributors.