M2GL010-VF400
M2GL010-VF400 - 12K LEs, 195 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VF400 is an IGLOO2 low-density flash FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. It is identified as a 400 VFBGA device in distributor data and uses 0.8 mm ball pitch according to the supplied Hotenda result. The device is intended for programmable logic, I/O expansion, signal conversion, bridging, system management, communications, industrial, medical, defense, and aviation applications.
An FPGA is a programmable semiconductor containing configurable logic, memory, and I/O resources that can be reconfigured after manufacture. Microchip positions the IGLOO2 family for general-purpose functions such as bridging, I/O expansion, data conversion, secure connectivity, video or image processing, and system management. The M2GL010 device is the smallest density shown in the supplied IGLOO2 datasheet result, which covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 variants.
The verified distributor information identifies the M2GL010-VF400 as an IGLOO2 FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. Other verified commercial data reports 2,528 pieces in stock at Heisener, a unit price of $37.1987, and a lead time to be confirmed, with an estimated delivery window of October 12 through October 17. These commercial figures are source-specific and should be reconfirmed before procurement.
The 400-LFBGA package provides a high pin count for systems that require extensive programmable I/O, making the device suitable for parallel interfaces, control logic, protocol bridges, and mixed signal interface conditioning. The supplied pin-description user guide is the appropriate reference for ball assignments, bank information, and package details. The manufacturer product page states that the M2GL010 is in production.
A practical design must confirm the exact temperature grade, voltage requirements, configuration method, supported I/O standards, clocking resources, and bank constraints before layout begins. The 400-ball package also requires careful ball-out planning, escape routing, power-plane integrity, and manufacturing capability appropriate for fine-pitch BGA assembly. Do not infer those electrical limits from the distributor summaries alone.
This page consolidates the verified Microchip and distributor references, compares the available same-footprint ordering variants, and separates confirmed commercial information from parameters that still require manufacturer-datasheet confirmation. Use the official IGLOO2 datasheet and pin-description guide for sign-off design decisions.
The M2GL010-VF400 combines a compact low-density IGLOO2 FPGA platform with a high-pin-count 400-LFBGA package. Its 12K logic elements and 195 I/O position it for embedded control, interface conversion, protocol bridging, system management, and communications infrastructure where deterministic programmable logic is useful. Microchip's product page identifies the M2GL010 family as in production and describes IGLOO2 devices as flash FPGAs for general-purpose logic, I/O expansion, conversion, communications, industrial, medical, defense, and aviation markets. The verified distributor record specifies a 400-LFBGA package, 195 I/O, and 12K logic elements, while another distributor result describes the package as 0.8 mm ball pitch. Because the supplied data does not provide complete AC, DC, timing, pin-level, or environmental specifications, those values are not guessed here.
The IGLOO2 architecture is a flash-programmable FPGA family intended to provide reconfigurable logic, memory, and I/O resources within a compact device. In system terms, an FPGA sits below programmable logic devices, digital logic ICs, and semiconductors, while providing higher implementation flexibility than a fixed-function controller. Microchip identifies the family for general-purpose functions including bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied IGLOO2 datasheet result covers multiple M2GL densities, including M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150, with the target device being the M2GL010 density.
The verified feature set for this exact ordering code is its 12K logic-element count, 195 I/O, and 400-LFBGA package. The high I/O count is the key implementation feature for systems requiring many external connections, parallel data paths, or interface translation. The package also changes board-level manufacturing requirements compared with a leaded device: the design must account for 400 balls, fine-pitch escape routing, via-in-pad or via structures where appropriate, and controlled assembly. The supplied data does not state the exact I/O standards, I/O voltage, maximum clock frequency, memory bits, configuration interface, or operating-temperature grade, so those values require confirmation from the official datasheet.
Microchip's product page lists the M2GL010 as in production. This makes it a relevant candidate for new low-density FPGA designs, provided that the selected temperature, package, qualification, and lifecycle requirements match the system. The product-family page describes IGLOO2 devices as suitable for communications, industrial, medical, defense, and aviation markets. These are application domains, not proof that the exact M2GL010-VF400 ordering code has every corresponding qualification. The ordering suffix, grade, and compliance qualification must be checked separately.
Typical implementation uses include interface bridging, parallel-to-serial conversion, I/O expansion, control-plane logic, data acquisition front ends, and system-management functions. In these designs, the FPGA's 195 I/O allow external buses and protocols to be mapped through configurable logic, while the 12K logic-element density is intended for moderate control and datapath complexity rather than unrestricted high-end processing. The exact timing margin, supported standards, and power performance depend on the selected I/O bank, clock configuration, voltage, and operating grade.
The primary design consideration is that the 400-LFBGA package requires disciplined power, clock, and signal-integrity planning. Confirm the complete pinout, bank voltages, configuration pins, clock pins, ground distribution, and decoupling requirements in the manufacturer pin-description guide before schematic capture. Keep sensitive clock and interface routes short, provide continuous return paths, and validate the design with the manufacturer's recommended FPGA design flow. Do not use the distributor snippets as a substitute for the complete electrical datasheet.
This page synthesizes verified manufacturer status, package identity, logic capacity, I/O count, distributor inventory, pricing, and the available ordering references. It also adds practical selection and design guidance that is not present in a raw distributor listing. For purchasing, request a current quote and stock confirmation; for engineering, use the official IGLOO2 datasheet and packaging user guide for all release-critical specifications.
The M2GL010-VF400 is a 12K-logic-element, 195-I/O IGLOO2 flash FPGA in a 400-LFBGA package, and Microchip lists the M2GL010 family as in production. It is suitable for programmable logic, interface bridging, I/O expansion, protocol conversion, system management, communications, industrial control, medical equipment, defense, and aviation designs where configurable hardware is useful. The verified distributor data identifies 2,528 pieces at Heisener at a unit price of $37.1987 and reports lead time to be confirmed; pricing and availability are as of the supplied search snapshot dated 2026-10-23. The package result states 0.8 mm ball pitch and 400 VFBGA. Engineering values not present in the supplied sources are marked for data collection rather than estimated.
An FPGA is a configurable digital semiconductor that combines programmable logic, memory, and input/output resources. A low-density flash FPGA such as IGLOO2 can implement fixed control logic, data paths, and interface functions that would otherwise require multiple fixed-function devices. Microchip describes IGLOO2 devices as useful for general-purpose bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied family datasheet result covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 devices, confirming that M2GL010 belongs to a broader low-density device family.
The target's confirmed commercial features are 12K logic elements, 195 I/O, and a 400-LFBGA package. The package result additionally specifies 0.8 mm ball pitch and 400 VFBGA. These figures make the device relevant where a high number of external connections and moderate programmable logic density are needed. They do not establish the exact I/O voltage, supported interface standards, maximum operating frequency, embedded-memory capacity, configuration pins, or temperature grade; those values must come from the official datasheet and pin-description guide.
Microchip's product page states that M2GL010 is in production. The IGLOO2 family page identifies communications, industrial, medical, defense, and aviation as target markets, while also listing Gigabit Ethernet, dual PCI Express control planes, bridging, I/O expansion, conversion, video or image processing, system management, and secure connectivity as representative use cases. Availability in those markets does not automatically mean that the exact ordering code has the required automotive, military, or space qualification. Qualification and temperature grade must be confirmed independently.
A practical implementation can place the FPGA between sensors, processors, memories, transceivers, and external connectors. The 195 I/O provide a large pin budget for buses, control signals, and protocol interfaces, while the 12K logic-element count supports moderate finite-state machines, packet handling, data alignment, and control logic. The 400-LFBGA package requires a high-density board layout with careful escape routing, power distribution, thermal analysis, and assembly capability. The design should be checked against the manufacturer's pinout, bank rules, configuration procedure, and recommended decoupling before PCB release.
The most important selection trade-off is flexibility versus integration. Compared with a small MCU or fixed-function logic device, the FPGA provides reconfigurable parallel interfaces and hardware-level timing control. Compared with a larger or higher-density FPGA, the M2GL010 offers a smaller logic resource budget while retaining many I/O and package options. The exact speed, power, reliability, and lifecycle commitments should be taken from the current Microchip documentation rather than inferred from the distributor summary.
This page combines verified product identity, family positioning, package information, commercial availability, and procurement context with engineering guidance for FPGA integration. It is intended to accelerate initial selection and sourcing, while clearly separating confirmed facts from parameters that still require official-datasheet confirmation.
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