10AX115S3F45E2SG - Arria 10 GX 1150K LE FPGA, 28nm, F45 | Intel
Teilenummer: 10AX115S3F45E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7450.65 | $7.450,65 |
| 10 | $7150 | $71.500,00 |
| 50 | $6900 | $345.000,00 |
| 100 | $6600 | $660.000,00 |
| 500 | $6200 | $3.100.000,00 |
10AX115S3F45E2SG Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than at the factory. FPGAs sit at the top of the programmable logic device (PLD) hierarchy alongside CPLDs and are widely deployed for parallel DSP pipelines, custom high-speed interfaces, and ASIC prototyping. The Arria 10 GX family targets mid-range applications that require both high logic density and integrated transceivers at lower cost than Stratix-class parts.
Key features of the 10AX115S3F45E2SG include 1,150,000 logic elements (LEs), 68.86 Mbits of embedded SRAM, 1,518 embedded DSP blocks (18x19 multipliers), up to 24 high-speed transceiver channels at up to 17.4 Gbps (chip-to-chip and backplane capable), and hard PCI Express Gen3 x8 IP cores. The 'S' suffix indicates transceivers with the highest speed bin, while 'F45' denotes the 1932-ball flip-chip BGA package with 45mm row pitch and lead-free RoHS-compliant balls.
Architecturally, Arria 10 GX uses a coherent 20nm monolithic fabric combined with hardened protocol IP blocks for PCIe, memory controllers, and serial transceivers. The hard IP approach reduces power by up to 40% and die area by 30% compared to soft implementations. The fabric contains Adaptive Logic Modules (ALMs), M20K memory blocks, and variable-precision DSP blocks that can be cascaded to support IEEE 754 single-precision floating-point at full DSP block rate.
Typical applications include 4K UHD video broadcast and pro-AV equipment, 100G/400G optical transport networking line cards, radar and electronic-warfare signal processing, military secure communications, medical imaging accelerators, and ASIC prototyping platforms. The combination of high logic density and 17.4 Gbps transceivers makes it particularly suitable for bandwidth-intensive DSP and packet-processing workloads.
Designers should budget for the 1932-ball FCBGA which requires a multi-layer PCB with microvia and HDI stack-up. Power estimation requires Intel's PowerPlay or Early Power Estimator tools, and the device supports both core and transceiver power rails that must be sequenced per the datasheet. Configuration can be done via JTAG, serial flash, or PCI Express.
This page synthesizes distributor pricing, drop-in same-package alternatives, parametric comparisons, and practical design notes that go beyond the manufacturer datasheet to support faster design-in and sourcing decisions.
Drop-in-Alternativen für 10AX115S3F45E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115S3F45E2SG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, DSP Blocks, Embedded Memory, Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115S3F45E2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7950 / Stück
Datenblatt ansehen →10AX115S3F45E1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AX115S3F45I2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2020 / Stück
Datenblatt ansehen →10AX115S2F45E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6975.76 / Stück
Datenblatt ansehen →10AX115S3F45E2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Device Model | 10AX115 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) |
| DSP Blocks | 1,518 (18x19 multipliers) |
| User I/Os | 624 |
| High-Speed Transceivers | Up to 24 channels at up to 17.4 Gbps |
| PCIe Hard IP | Gen3 x8 |
| Speed Grade | -2 |
| Process Technology | 20nm TSMC |
| Core Voltage | 0.9 V |
| Gehäuse | 1932-ball FCBGA (F45), 45 mm |
| Betriebstemperatur | -40C to +100C (extended) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AX115S3F45E2SG 1932-ball fcbga (f45), 45 mm Pinbelegungsleitfaden
Pinbelegung für 10AX115S3F45E2SG (1932-ball fcbga (f45), 45 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115S3F45E2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115S3F45E2SG ist geeignet für 6 Anwendungs: 4K UHD Video Broadcast and Pro-AV, 100G/400G Optical Transport Networking, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerators (CT, MRI, Ultrasound), ASIC Prototyping and Emulation Platforms, High-Performance Computing Acceleration Cards.
4K UHD Video Broadcast and Pro-AV
The 10AX115S3F45E2SG fits 4K UHD video broadcast and pro-AV because of its 1,150K logic elements and 1,518 DSP blocks, which deliver real-time 12G-SDI, SMPTE ST 2110, and JPEG-XS processing without external ASICs. Its 17.4 Gbps transceivers aggregate four 12G-SDI streams at 48 Gbps aggregate, while the PCIe Gen3 x8 hard IP accelerates IP-based playout. Designers typically pair it with external HDMI 2.1 retimers for I/O and use Quartus Prime video IP suites for color-space conversion.
Empfohlen
100G/400G Optical Transport Networking
The 10AX115S3F45E2SG targets 100G/400G optical line cards because its 24 transceivers at up to 17.4 Gbps natively support CFP/CFP2 modules and OTU4 long-haul interfaces without external muxes. The hard PCS and FEC engines offload heavy DSP from the fabric, freeing LEs for MAC, packet classification, and queue management. Designers achieve sub-1W per 100G port when using the hard IP plus Arria 10's variable-precision DSP blocks for FEC acceleration.
Empfohlen
Radar and Electronic Warfare Signal Processing
In radar and EW applications, the 10AX115S3F45E2SG's 1,150K LEs and 1,518 DSP blocks deliver thousands of parallel FFT/iFFT channels required for phased-array beamforming. The 68.86 Mbits of embedded SRAM provides multi-stage data buffering between antenna elements and DSP pipelines, while the 17.4 Gbps transceivers feed ADCs and DACs at multi-GSPS sample rates. Designers combine the FPGA with high-speed JESD204B ADC/DACs for direct-RF front-end sampling, achieving sub-microsecond latency in the signal-processing path.
Empfohlen
Medical Imaging Accelerators (CT, MRI, Ultrasound)
The 10AX115S3F45E2SG accelerates medical imaging because its DSP-rich fabric delivers parallel back-projection, beamforming, and image-reconstruction kernels at medical-real-time rates. For a 256-channel ultrasound system, the 1,518 DSP blocks handle 256-channel parallel beamforming while the 68.86 Mbits of embedded memory holds sample data and intermediate coefficient arrays. Designers integrate it with high-speed JESD204B ADCs and use partial reconfiguration to switch between imaging modes (B-mode, Doppler, elastography) at sub-100ms latency.
Empfohlen
ASIC Prototyping and Emulation Platforms
The 10AX115S3F45E2SG serves as an ASIC prototyping engine because its 1,150K LEs emulate multi-million-gate ASIC designs in conjunction with companion FPGAs via 17.4 Gbps transceivers for chip-to-chip tiling. The hard PCIe Gen3 x8 IP connects the prototype board to a host workstation for accelerated co-simulation, while abundant M20K memory maps ASIC SRAM. Designers often stack 2-4 FPGAs in a single prototype card with HSSI links achieving 12.5 Gbps+ across the fabric, dramatically shortening ASIC verification cycles.
Empfohlen
High-Performance Computing Acceleration Cards
The 10AX115S3F45E2SG powers HPC and data-center accelerator cards because its PCIe Gen3 x8 hard IP delivers 8 GT/s host connectivity while the 1,518 DSP blocks accelerate HPC kernels (compression, encryption, genomics). The 24 transceivers at 17.4 Gbps link to host CPUs via optical or QSFP+ cages, and the 0.9V core voltage keeps total board power under 45W for typical workloads. Designers use OpenCL SDK or HLS compiler to port compute kernels, achieving 10-50x speedup over CPU-only execution.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115S3F45E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115S3F45E2LG | 10AX115S3F45E1SG | 10AX115S3F45I2SG | 10AX115S2F45E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Logic/Memory Configuration | S3 (high logic+memory) | S3 (high logic+memory) | S3 (high logic+memory) | S3 (high logic+memory) | S2 (lower logic+memory) |
| Speed Grade | -2 | -2 | -1 (slower, ~15% Fmax reduction) | -2 | -2 |
| Temperature Grade | Extended (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) | Industrial | Extended (-40C to +100C) |
| Ball Finish | SG (RoHS-Green SnAgCu) | LG (Lead-free matte Sn) | SG (RoHS-Green SnAgCu) | SG (RoHS-Green SnAgCu) | SG (RoHS-Green SnAgCu) |
| Approx. Unit Price (USD, qty 1) | $7,450.65 | $7,450 (similar) | $6,800 (lower) | $7,600 (similar) | $6,500 (lower) |
Wichtigste Unterscheidungsmerkmale
- Highest logic+memory configuration in 10AX115 family (vs. 10AX115S2F45E2SG)
- Higher speed grade than -1 variant (vs. 10AX115S3F45E1SG)
- Extended temperature grade supports broader deployment (vs. 10AX115S3F45I2SG)
Designhinweise
The 10AX115S3F45E2SG can dissipate 25-40W in typical transceiver-rich designs. Use Intel's Early Power Estimator (EPE) tool to model worst-case power, then select a heatsink rated for at least 1.5x the estimated dissipation. The 1932-ball FCBGA exposed die requires a thermal interface material (TIM) with conductivity >= 3.0 W/mK; thermal pads with conductivity below 1.0 W/mK will cause thermal throttling under sustained load.
The 1932-ball F45 FCBGA requires >=14 PCB layers with HDI microvia stack-up. Use 0.4mm pitch BGA escape routing with via-in-pad (VIPPO) for the inner rows. Maintain 100-ohm differential impedance for transceiver channels with at least 3W differential line width-to-spacing. Place DC blocking capacitors within 100 mil of the transceiver ball pads and keep the AC-coupling cap reference plane unbroken to avoid impedance discontinuities.
Sequence the core and transceiver power rails per Intel's power-up sequencing specification to avoid latch-up. The 0.9V core rail must ramp within 100ms of the 1.8V/2.5V/3.3V auxiliary rails; failure to sequence properly can permanently damage the device. Use a dedicated FPGA power controller such as Intel's Enpirion EN6362QI or Texas Instruments TPS6508641 to guarantee correct sequencing. Add bulk decoupling of at least 600 uF of ceramic capacitance near the device to handle load-transient events.
For 17.4 Gbps transceiver channels, use Megtron 6 or equivalent low-loss PCB material with Dk=3.6, Df=0.004 at 5 GHz. Maintain at least 3W line width-to-spacing for 100-ohm differential pairs and limit intra-pair skew to < 2 ps. Pre-emphasis and equalization settings should be tuned using Intel's Transceiver Toolkit; start with default settings and iterate with eye-diagram measurements at the receiver.
Compliance-Informationen
RoHS compliant per Intel product page; lead-free FCBGA balls (SG suffix). AEC-Q100 not applicable - Arria 10 FPGAs are not automotive-qualified. Industrial temp variants (I suffix) are available for MIL-spec applications.
