5SGXEA3H2F35C2LN - Stratix V GX FPGA, 340K LE | Altera | 1152-FCBGA
Teilenummer: 5SGXEA3H2F35C2LN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4200 | $4.200,00 |
| 10 | $3990 | $39.900,00 |
| 100 | $3780 | $378.000,00 |
| 250 | $3650 | $912.500,00 |
| 500 | $3520 | $1.760.000,00 |
5SGXEA3H2F35C2LN Übersicht
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic architecture can be programmed after manufacturing using a hardware description language (HDL). FPGAs sit in the IC hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. They are used when designers need hardware-level parallelism, reconfigurability, and time-to-market advantages over fixed-function ASICs. The Stratix V family specifically targets high-performance applications such as high-speed serial interfaces, signal processing, and ASIC prototyping.
Key features include 36 transceivers at 14.1 Gbps, 19.456 Mbits embedded memory (approximately 2,432 Kbytes), 2,144 adaptive logic modules (ALMs), 17 DSP blocks at 600 MHz, and a hard PCIe Gen2/3 IP block. The device also integrates 12 PLLs and 24 fractional PLLs for clock management. The -2 speed grade denotes the mid-tier performance bin, while the C2 designator indicates a commercial temperature grade of 0C to +85C, and the LN suffix indicates a lead-free, halogen-free package.
The Stratix V GX architecture uses a TSMC 28nm low-power process and combines a fabric of ALMs with hard IP for transceivers, PCIe Gen3, and external memory interfaces. The 14.1 Gbps transceivers enable protocols such as 10 Gigabit Ethernet, Interlaken, Serial RapidIO, and PCIe Gen3 x8, while the embedded hard memory controllers support DDR3 up to 1600 Mbps. The partial reconfiguration feature allows portions of the fabric to be reprogrammed while the rest continues operating.
Typical applications include 10G/40G Ethernet bridging, ASIC prototyping with deep trace memory, test and measurement equipment with high-speed serial capture, and high-performance DSP systems such as radar baseband processing. The 1152-ball FCBGA package supports the transceiver pinout required for 36 simultaneous serial links.
When designing with this device, allocate thermal budget to the FCBGA package and route the transceiver channels as matched-length differential pairs on the PCB. Quartus II software version 13.0 or later is required for synthesis and place-and-route. Designers transitioning to newer families should evaluate Cyclone V or Stratix 10 for improved power efficiency.
This page synthesizes distributor pricing, drop-in alternatives across the Stratix V EAX3 family, and practical Quartus II design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 5SGXEA3H2F35C2LN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5SGXEA3H2F35C3LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H1F35C2LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H2F35C2L
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H2F35I2LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H3F35C2LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H2F35C1LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5SGXEA3H2F35C2LN Grenzwerte & elektrische Eigenschaften
| Family | Stratix V GX |
| Device Sub-family | 5SGXEA3 (High-Temperature/Hard IP for ASIC Prototyping) |
| Logic Elements | 340,000 |
| Adaptive Logic Modules (ALMs) | 2,144 |
| Embedded Memory | 19,456,000 bits (2,432 Kbytes) |
| DSP Blocks | 17 |
| Transceivers | Up to 36 channels |
| Transceiver Data Rate | Up to 14.1 Gbps |
| Maximum User I/O | 432 |
| PLLs | 12 (plus 24 fractional) |
| Hard PCIe Blocks | Yes (Gen1/Gen2/Gen3) |
| Speed Grade | -2 (mid-tier) |
| Betriebstemperatur | 0C to +85C (C2 commercial) |
| Gehäuse | 1152-ball FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (lead-free, halogen-free LN) |
| Process Technology | TSMC 28nm |
| Configuration Interface | JTAG, EPCS/EPCQ serial flash |
5SGXEA3H2F35C2LN Pin-Konfiguration
| Pin 1 | GPIO — General-purpose I/O bank (A1 column varies by pin map) |
| Pin 1152 | VCC/GND — Power and ground (refer to BGA pin map for exact ball positions) |
Typische Anwendungen
5SGXEA3H2F35C2LN ist geeignet für 6 Anwendungs: 10G/40G Ethernet Bridging and Switching, ASIC Prototyping with Deep Trace Memory, Test and Measurement Equipment, Radar and Sonar Baseband DSP, High-Performance Industrial Imaging, Medical Imaging (Ultrasound Beamforming).
10G/40G Ethernet Bridging and Switching
The 5SGXEA3H2F35C2LN's 36 transceivers at up to 14.1 Gbps make it ideal for 10 Gigabit Ethernet bridging and aggregation switching applications, where three independent SFP+ ports can run concurrently alongside a 40G QSFP uplink. The -2 speed grade supports the timing margins required for 10GbE XAUI and 10GBASE-R PCS layers with deterministic latency. Placed as the central switching fabric with hard PCIe Gen3 for host CPU interconnect and external DDR3 for packet buffer memory, the device comfortably line-rate forwards at wire speed. Compared with discrete PHY solutions, integration onto a single FPGA reduces board area, BOM cost, and time-to-market.
Empfohlen
ASIC Prototyping with Deep Trace Memory
With 340,000 logic elements and 19.456 Mbits of embedded memory, the 5SGXEA3H2F35C2LN is well suited for ASIC prototyping of mid-complexity SoCs in the EAX3 sub-family's high-temperature variant. The 2,144 ALMs map efficiently to synthesized ASIC gates, while the 17 DSP blocks preserve the arithmetic performance of the target ASIC. Partial reconfiguration allows multiple design revisions to be swapped into a single device during bring-up. Quartus II's TimeQuest timing analyzer correlates well with ASIC SDF back-annotation, simplifying sign-off correlation between FPGA prototype and final silicon.
Empfohlen
Test and Measurement Equipment
The 5SGXEA3H2F35C2LN's 36 high-speed transceiver channels enable multi-channel protocol analyzers and bit-error-rate testers (BERT) that capture and process data from PCIe Gen3, USB 3.1, SATA, and SAS links. The embedded memory of 19.456 Mbits provides storage for state-event logs and pattern-matching lookup tables. The hard PCIe Gen3 block can be reconfigured as a PCIe Gen2 x4 endpoint for instrument-to-host streaming at line rate. Operating across 0C to +85C, the device is suitable for bench and lab use, though the I-grade variant is preferred for field-deployable test equipment.
Empfohlen
Radar and Sonar Baseband DSP
The 17 DSP blocks at 600 MHz multiply-accumulate performance in the 5SGXEA3H2F35C2LN are optimized for radar and sonar pulse-compression and beamforming algorithms. The 14.1 Gbps transceivers link directly to ADCs sampling at GSPS rates, while the embedded memory hosts large FFT window buffers. The -2 speed grade satisfies the timing of pipelined FFT implementations without cascading multiple devices, reducing system latency by 50 to 100 nanoseconds compared with multi-FPGA architectures. For phased-array antenna interfaces, the transceiver-enable signal synchronizes across multiple EAX3 devices with deterministic alignment.
Empfohlen
High-Performance Industrial Imaging
In industrial vision systems for defect detection on PCB assembly lines or semiconductor wafers, the 5SGXEA3H2F35C2LN processes 4K image streams at 60 fps through its 14.1 Gbps transceivers and integrates preprocessing such as histogram equalization, gamma correction, and on-the-fly template matching in fabric. The 432 user I/Os drive a Camera Link interface directly, while the 19.456 Mbits of embedded memory buffer full-resolution frames for inspection. Compared with PC-based CPU/GPU processing, FPGA-based preprocessing reduces downstream traffic by 5-10x, lowering system cost and improving throughput. The C2 commercial temperature grade covers typical factory floor conditions.
Empfohlen
Medical Imaging (Ultrasound Beamforming)
The 5SGXEA3H2F35C2LN's parallel DSP and high-speed transceivers suit ultrasound beamforming front-ends, where 64-channel sampling at 40 MSPS produces aggregate bandwidth exceeding 2.5 Gbps. The 17 DSP blocks implement filter- and beamforming pipelines that back-scan thousands of scan lines per frame without host intervention. The 0C to +85C operating temperature, combined with the FCBGA-1152 package's thermal headroom, supports the 25-30W TDP typical of fully-loaded beamforming designs. Caution: medical designs must validate the long-term Altera component-discontinuance program and select alternative sources or migration paths to Stratix 10 in advance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5SGXEA3H2F35C2LN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5SGXEA3H2F35C3LN | 5SGXEA3H1F35C2LN | 5SGXEA3H2F35C2L | 5SGXEA3H2F35I2LN | 5SGXEA3H3F35C2LN | 5SGXEA3H2F35C1LN |
|---|---|---|---|---|---|---|---|
| Package | FCBGA-1152 | FCBGA-1152 | FCBGA-1152 | FCBGA-1152 | FCBGA-1152 | FCBGA-1152 | FCBGA-1152 |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 340,000 | 340,000 | 340,000 | 340,000 | 340,000 | 340,000 | 340,000 |
| Speed Grade | -2 | -3 (slower) | -1 (faster) | -2 (same) | -2 (same) | -3 | -1 (fastest) |
| Temperature Grade | C2 (0C to +85C, commercial) | C2 (commercial) | C2 (commercial) | C2 (commercial) | I2 (-40C to +100C, industrial) | C2 (commercial) | C2 (commercial) |
| Transceivers | Up to 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps | 36 channels, 14.1 Gbps |
| Embedded Memory | 19.456 Mbits | 19.456 Mbits | 19.456 Mbits | 19.456 Mbits | 19.456 Mbits | 19.456 Mbits | 19.456 Mbits |
| Hard PCIe | Gen1/2/3 | Gen1/2/3 | Gen1/2/3 | Gen1/2/3 | Gen1/2/3 | Gen1/2/3 | Gen1/2/3 |
| Lead-Free/Halogen-Free (LN) | Yes (LN suffix) | Yes (LN) | Yes (LN) | No (non-LN) | Yes (LN) | Yes (LN) | Yes (LN) |
| Single-unit Price (USD, as of 2026-10-14) | $4,200 | ~$3,700 (lower) | ~$5,200 (higher) | ~$4,180 (slightly lower) | ~$4,650 (higher) | ~$3,650 | ~$5,300 (highest) |
Wichtigste Unterscheidungsmerkmale
- Mid-tier -2 speed grade balances performance and price (vs. 5SGXEA3H2F35C3LN (speed grade -3))
- Commercial temperature grade with full operation 0C to +85C (vs. 5SGXEA3H2F35I2LN (industrial I2))
- LN suffix guarantees lead-free and halogen-free compliance (vs. 5SGXEA3H2F35C2L (non-LN))
- 36 transceivers at 14.1 Gbps for high-density multi-link designs (vs. 5SGXEA3H2F35C2LN vs 5SGXEA3H2F35C2LN in EAX3 vs GS variant)
Designhinweise
Estimated: a fully-loaded 5SGXEA3H2F35C2LN with 36 active transceivers and 60% logic utilization dissipates 20 to 28W. With the FCBGA-1152 package theta_JA of approximately 12 C/W (with air cooling and standard 4-layer PCB), junction temperatures rise 240-330C above ambient. A heatsink with at least 3 C/W thermal resistance OR forced-air airflow is mandatory for production deployments.
Route all 36 transceiver channels as matched-length differential pairs (intra-pair skew less than 150 fs, inter-pair skew less than 1500 UI). Use continuous reference ground planes on layers L2 and L5 with vias spaced no more than 200 um apart. Place AC-coupling capacitors 200 mm from the device ball. For PCIe Gen3 compliance, meet the 85-ohm differential impedance target within +/-10% across all clock and data pairs.
Estimated: the Stratix V requires 0.85V core, 0.95V PLL analog, 1.5V transceiver analog, and 1.8V-3.3V IO supplies. Total input current at full load is approximately 18A on the core rail. Use a 4-phase or interleaved buck regulator with at least 25A capacity, and dedicate one 0.1uF + 22uF ceramic + 47uF tantalum capacitor stack per FPGA ball on the core rail. Power sequencing must follow the Stratix V handbook specifications: 0.85V core must monotonically rise to value within 10 ms before any IO supply ramps.
Do not configure transceiver channel pins as GPIO - this is a common Quartus II error that latches at POR. Additionally, do not enable partial reconfiguration unless the partial configuration pin (PR_REQUEST, PR_READY, PR_DONE, PR_ERROR) are properly assigned in the Quartus pin-planner. The JTAG pin states during configuration affect the multi-device chain - ensure IDCODE capture settings match the chain order. Failure to comply erases the Stratix V configuration image and can cause POR cycles.
Stratix V is now classified as a mature product family with reduced support from Intel. New designs should consider Cyclone V for cost-sensitive applications or plan a migration path to Stratix 10 for future-proofing. Validate long-term supply with the Intel product-discontinuance schedule before committing to production.
Compliance-Informationen
RoHS compliant and lead-free per Altera (now Intel) Stratix V product family certifications. LN suffix indicates halogen-free, also compliant with IEC 61249-2-21. Not AEC-Q100 qualified (FPGA is not automotive). MSL3 moisture sensitivity level requires pre-bake prior to reflow.
