DSPC56371AF150 - 150 MHz Audio DSP, 80-LQFP | NXP Semiconductors
Teilenummer: DSPC56371AF150 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.25 | $262,50 |
| 100 | $23.95 | $2.395,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $18.75 | $18.750,00 |
DSPC56371AF150 Übersicht
A digital signal processor (DSP) is a specialized microprocessor whose architecture (Harvard-style, with separate program and data buses, and a dedicated multiply-accumulate unit) is optimized for the numeric-intensive, real-time computations required by audio, video, communications and control algorithms. Unlike a general-purpose microcontroller, a DSP performs multiply-accumulate (MAC) operations in a single cycle and supports zero-overhead looping, making it well suited to FIR/IIR filtering, FFTs, and codec post-processing. The DSPC56371AF150 belongs to the DSP56300 family tree (DSP -> DSP563xx -> audio DSP -> 24-bit fixed-point DSP), a hierarchy that frames it relative to both microcontrollers and modern ARM-based audio SoCs.
Key specifications include a 150 MHz core clock, 24-bit data word size, 264 kB on-chip RAM, 384 kB on-chip ROM, integrated Host Interface, I2C, SAI and SPI peripheral set, 3.30 V I/O supply, and the 80-LQFP (14x14) gull-wing surface-mount package. The audio-targeted feature set includes hardware-accelerated Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS, MPEG-2 AAC and other surround codecs, allowing a single chip to handle decoding and post-processing for a multi-channel A/V receiver.
From a system-level perspective, the part is typically paired with a digital audio receiver (DIR), an audio DAC (such as a multi-channel PCM17xx), and a host microcontroller. Power is derived from a low-noise LDO supplying the 1.6 V core and 3.3 V I/O rails, and crystal selection should match the internal PLL to lock the 150 MHz core cleanly. Engineers designing AV receivers and automotive head-units use the DSPC56371AF150 to off-load all real-time audio decoding and bass-management from the application processor.
Typical applications include A/V receivers, home theater in a box (HTiB), surround-sound soundbars, digital-TV audio sub-boards, mini/micro stereo systems, automotive head-unit amplifiers, and aftermarket automotive audio processors. A practical design tip is to keep the PLL reference, host interface and SAI traces length-matched and impedance-controlled to avoid jitter on the SAI clocks feeding downstream DACs.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, helping engineers select, source, and qualify a replacement for the DSPC56371AF150 in active designs.
Drop-in-Alternativen für DSPC56371AF150 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPC56371AF150 (gleiche Bauform und Footprint) – abweichend in Package, Core, Core Clock Frequency, Core Supply Voltage, I/O Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPC56371AF180
✅ Drop-In✓ Auf Lager
$66 / Stück
Datenblatt ansehen →DSPB56371AF150
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13.9 / Stück
Datenblatt ansehen →DSPB56371AF180
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$41.62 / Stück
Datenblatt ansehen →DSPC56371AE150
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPC56371AF150 Technische Daten
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | DSP563xx |
| Core Type | DSP56300 24-bit fixed-point DSP core |
| Core Clock Speed | 150 MHz |
| MIPS | 150 MIPS |
| Data Word Size | 24-bit |
| On-Chip RAM | 264 kB |
| On-Chip ROM | 384 kB |
| Program Memory Type | ROM (mask-programmed) |
| Host Interfaces | Host Interface, I2C, SAI, SPI |
| I/O Supply Voltage | 3.30 V |
| Core Supply Voltage | 1.6 V (typical) |
| Audio Decoders Supported | Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS, MPEG-2 AAC and additional surround codecs |
| Gehäuse | 80-LQFP (14x14 mm), gull-wing |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +85C (industrial) |
DSPC56371AF150 80-lqfp (14x14 mm), gull-wing Pinbelegungsleitfaden
Pinbelegung für DSPC56371AF150 (80-lqfp (14x14 mm), gull-wing-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPC56371AF150.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPC56371AF150 ist geeignet für 6 Anwendungs: Audio/Video Receiver (AVR) Decoder, Home Theater in a Box (HTiB), Automotive Head-Unit Audio Processor, Digital-TV Audio Sub-Board, Mini/Micro Stereo System, Soundbar Audio Processor.
Audio/Video Receiver (AVR) Decoder
The DSPC56371AF150 is the primary surround-decoder DSP in mid-range A/V receivers. Its mask-ROM firmware accelerates Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS and MPEG-2 AAC in hardware, off-loading the main application processor. The 150 MIPS throughput supports 7.1-channel decode plus bass management and room-correction post-processing in real time. Compared with a software-only solution on an ARM SoC, the dedicated 24-bit MAC architecture consumes less MIPS per channel and deterministically meets multi-channel latency budgets. The 80-LQFP (14x14 mm) footprint is the standard AVR mainboard land pattern and the SAI interface streams 8-channel PCM directly to a multi-channel DAC such as the PCM1690.
Empfohlen
Home Theater in a Box (HTiB)
HTiB systems rely on a single DSP to handle multi-channel decode, channel routing, bass management and speaker time-alignment. The DSPC56371AF150 fits this role because its 384 kB ROM holds the entire Dolby/DTS codec suite, eliminating the need for external program memory and reducing BOM cost. At 150 MIPS it can decode a 5.1-channel bitstream while simultaneously running an FIR-based crossover and DC protection on each channel. Designers pair it with a small host MCU for user-interface and source-selection, and use the I2C port to send volume and tone-control commands. The 80-LQFP surface-mount package is suitable for low-cost four-layer FR4 HTiB mainboards.
Empfohlen
Automotive Head-Unit Audio Processor
Automotive head units need a robust audio DSP capable of running decoder, up-mixer and active-crossover algorithms in a thermally challenging environment. The DSPC56371AF150's 80-LQFP package, industrial operating temperature range, and on-chip Dolby/DTS firmware make it a proven choice for OEM and aftermarket head-unit designs. The SAI interface streams TDM audio to the output DACs, while the SPI port communicates with the head-unit's main MCU for volume, fader and source control. Compared with newer ARM Cortex-A based audio SoCs, the DSPC56371AF150 offers deterministic real-time behavior and license-free access to the codec suite baked into its ROM.
Empfohlen
Digital-TV Audio Sub-Board
In a digital-TV chassis, an audio sub-board off-loads all surround decoding and post-processing from the main SoC. The DSPC56371AF150 handles MPEG-2 AAC and Dolby Digital Plus bitstreams from the broadcast stream, applies dynamic-range compression, and outputs a stereo down-mix (or full 5.1) over SAI to the TV's internal speakers or HDMI-ARC transmitter. The 264 kB on-chip RAM provides ample buffer space for up to 250 ms of audio delay-lip-sync correction. Designers keep the DSP isolated on a separate PCB region with its own low-noise LDO for the 1.6 V core to avoid digital switching noise coupling into the audio path.
Empfohlen
Mini/Micro Stereo System
Compact stereo systems need to add virtual-surround processing to two physical speakers while preserving stereo imaging. The DSPC56371AF150's Pro Logic IIx and DTS Neo:6 up-mixers run on the 150 MIPS core, producing a wide soundstage from stereo sources. The Host Interface accepts compressed audio from the system's main MCU, and the I2C port is used for EEPROM bootstrap of customer-specific tuning coefficients. The 80-LQFP (14x14) package fits in the small PCBs of micro-system mainboards and the 3.3 V I/O simplifies interface to low-cost Class-D amplifiers.
Empfohlen
Soundbar Audio Processor
Premium soundbars use a dedicated DSP to drive multi-driver arrays with beam-forming, virtual-surround and bass-management algorithms. The DSPC56371AF150's combination of 150 MIPS throughput, integrated Dolby/DTS firmware, SAI multi-channel interface, and 80-LQFP package supports a 5.1 virtual-surround soundbar with up to 8 amplified channels. The on-chip ROM holds the licensing royalties-free for the OEM, which is a major BOM cost advantage versus a software-only implementation. Designers route the SAI clocks and frames to multiple Class-D amplifier ICs in parallel, with one master clock distributed from the DSP's PLL output.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPC56371AF150 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPC56371AF180 | DSPB56371AF150 | DSPB56371AF180 | DSPC56371AE150 |
|---|---|---|---|---|---|
| Package | 80-LQFP (14x14) | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 150 MHz | 180 MHz | 150 MHz | 180 MHz | 150 MHz |
| MIPS | 150 MIPS | 180 MIPS | 150 MIPS | 180 MIPS | 150 MIPS |
| Data Word Size | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit |
| On-Chip RAM | 264 kB | 264 kB | 264 kB | 264 kB | 264 kB |
| On-Chip ROM (Codec Firmware) | 384 kB | 384 kB | 384 kB | 384 kB | 384 kB |
| Silicon Revision | AF (C-version) | AF (C-version) | AF (C-version) | AF (C-version) | AE (older) |
| I/O Supply Voltage | 3.30 V | 3.30 V | 3.30 V | 3.30 V | 3.30 V |
Wichtigste Unterscheidungsmerkmale
- Faster 180 MHz core speed grade in same package (vs. DSPC56371AF180)
- Pb-free tape-and-reel packaging for high-volume assembly (vs. DSPB56371AF150)
- C-revision silicon with full 384 kB codec ROM (vs. DSPC56371AE150)
Designhinweise
Estimated: at 150 MHz with 1.6 V core and typical 80 mA core current, core power dissipation is approximately 1.6 V * 0.080 A = 128 mW. Add the 3.3 V I/O draw (typical 30 mA) for another ~100 mW, so total board dissipation is around 230 mW. Use a low-noise LDO such as LM1117-1.6 (or equivalent) for the core rail; do NOT share the core LDO with digital switching circuitry. Decouple each supply pin with a 100 nF X7R ceramic plus a 10 uF bulk capacitor placed within 5 mm of the package.
The SAI (serial audio interface) clocks and frames are LVTTL-level signals that drive downstream DACs and ADCs. Route them on the top layer with a continuous ground reference underneath, length-match clock-to-data within 25 mm, and place a 33 ohm series-termination resistor at the DSP end if the trace exceeds 50 mm. Keep the PLL reference crystal within 5 mm of the XTAL pins and surround it with a ground guard ring; long XTAL traces will inject jitter into the 150 MHz core clock and degrade audio THD+N.
Estimated: total power dissipation of approximately 230 mW (see power note) at 85 C ambient with theta_JA of approximately 50 C/W for the 80-LQFP package gives a junction temperature rise of about 11.5 C, leaving comfortable headroom under the 125 C Tj limit. For automotive under-hood applications with 105 C ambient, prefer the DSPC56371AF180 only if system airflow is provided; otherwise add a small copper heatsink pad under the exposed lead frame of the LQFP.
Do NOT confuse the DSPC56371AF150 (C-revision, 384 kB ROM) with the older DSPC56371AE150 (AE-revision, smaller ROM and different peripheral mapping). The two are NOT pin-for-pin equivalent despite sharing the 80-LQFP footprint. Also, do not load a DSP56374 firmware image onto the DSP56371 - the on-chip codec libraries are mask-programmed and only the matching silicon revision will decode correctly. Always reference the manufacturer's errata document before locking the schematic.
Compliance-Informationen
Compliance status not present in the verified web data. AF100 / AF150 part numbers in NXP/Freescale nomenclature typically denote non-AEC-Q100 industrial-grade silicon; the -Q1 suffix is required for AEC-Q100 automotive qualification. Pb-free and RoHS status should be confirmed from the manufacturer product page or distributor lot documentation before use in consumer/automotive end products.
