EP3C80U484C8 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera
Teilenummer: EP3C80U484C8 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $92.5 | $92,50 |
| 10 | $85.2 | $852,00 |
| 100 | $78.4 | $7.840,00 |
| 500 | $72.1 | $36.050,00 |
| 1.000 | $66.85 | $66.850,00 |
EP3C80U484C8 Übersicht
Key features include 81,264 LEs, 295 configurable I/O pins, 2.81 Mbits of embedded RAM, 244 embedded 18x18 multipliers, four phase-locked loops (PLLs), and a commercial operating temperature grade (0 C to +85 C). The device supports multiple I/O standards including LVDS, SSTL, and LVCMOS, and includes hard IP blocks such as memory controllers and high-speed transceivers (none on this die) to accelerate common system functions.
The Cyclone III family is a programmable logic device that belongs to the broader category of FPGAs (Field Programmable Gate Arrays) within the semiconductor hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit. Cyclone III parts succeed the Cyclone II family with 65 nm process geometry, lower static power (~40% reduction), and higher logic density per dollar. They are widely used as glue logic, co-processors, and rapid-prototyping platforms before ASIC migration.
Architecturally, the EP3C80U484C8 is built on Altera's classic Logic Array Block (LAB) and Adaptive Logic Module (ALM) fabric, with embedded MultiTrack interconnect that routes signals across rows and columns of the device. The 484-ball U484 package is a 1.0 mm pitch FineLine BGA suitable for multilayer PCBs with moderate layer-count designs.
Typical applications include industrial motor control and factory automation, video processing and image aggregation, telecommunications line cards, low-cost software-defined radio front ends, and consumer display controllers. The 81K-LE density comfortably supports mid-complexity state machines, soft processor cores such as Nios II, and hardware-accelerated DSP pipelines.
When designing with the EP3C80U484C8, ensure that the Quartus II design tool (version 13.1 or earlier - newer Quartus versions support it via device support files) is used for synthesis, place-and-route, and timing closure. Decoupling capacitors, multi-phase PLL filtering, and BGA fanout routing should follow Altera's Cyclone III Handbook recommendations for signal integrity.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Cyclone III family, and practical design notes that are not found in a single manufacturer datasheet, giving procurement and design engineers a single source of decision-grade information.
Drop-in-Alternativen für EP3C80U484C8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C80U484C8 (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3C80U484C8N
✅ Drop-In✓ Auf Lager
$190.99 / Stück
Datenblatt ansehen →EP3C80U484C7N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP3C80U484C7
✅ Drop-In✓ Auf Lager
$113.5 / Stück
Datenblatt ansehen →EP3C80U484C6N
✅ Drop-In✓ Auf Lager
$25.1 / Stück
Datenblatt ansehen →EP3C80U484C6
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →EP3C80U484C8 Grenzwerte & elektrische Eigenschaften
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Embedded Memory Bits | 2,810,880 |
| Embedded Memory (M9K Blocks) | 305 |
| Embedded 18x18 Multipliers | 244 |
| PLLs | 4 |
| Maximum User I/O | 295 |
| Process Technology | 65 nm |
| Gehäuse | 484-FBGA (U484) |
| Package Pitch | 1.0 mm |
| Betriebstemperatur | 0 C to +85 C (Commercial) |
| Speed Grade | C8 |
| Supply Voltage - Core | 1.2 V (typical) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
EP3C80U484C8 1.0 mm Pinbelegungsleitfaden
Pinbelegung für EP3C80U484C8 (1.0 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3C80U484C8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3C80U484C8 ist geeignet für 6 Anwendungs: Industrial Motor Control and Factory Automation, Video Processing and Image Aggregation, Telecommunications Line Cards and Protocol Bridging, Low-Cost Software-Defined Radio Front End, Consumer Display Controllers and Video Walls, Embedded Nios II Soft-Processor Platforms.
Industrial Motor Control and Factory Automation
The EP3C80U484C8 fits industrial motor control because its 81,264 logic elements, 244 embedded 18x18 multipliers, and 4 PLLs deliver sufficient fabric for multi-axis field-oriented control (FOC) loops, PWM generation, encoder decoding, and safety logic in a single chip. With 295 user I/Os in the 484-FBGA package, designers can interface directly to quadrature encoders, resolver-to-digital converters, and gate-driver ICs without external logic. The 65 nm Cyclone III low-power architecture reduces junction temperature versus older Cyclone II designs, enabling fan-less operation in sealed IP65 control cabinets. The C8 commercial speed grade supports 100 MHz system clocks with timing margin for cascaded DSP pipelines.
Empfohlen
Video Processing and Image Aggregation
The EP3C80U484C8 suits video processing pipelines because its 244 hardware multipliers enable parallel pixel-rate DSP operations for scaling, color-space conversion, and deinterlacing. The 2.81 Mbits of embedded M9K memory buffers line-scan or frame buffers without requiring external SRAM, and 295 I/Os accommodate parallel RGB/YCbCr buses plus control and synchronization lines. Designers can implement multi-channel video format conversion, edge enhancement, and on-screen display overlay in a single Cyclone III device. The 1.2 V core and 65 nm process keep power low enough for fan-less surveillance or industrial imaging enclosures.
Empfohlen
Telecommunications Line Cards and Protocol Bridging
The EP3C80U484C8 is well-matched to telecommunications line-card applications because its high logic density supports custom packet processing, TDM bus bridging, and clock-domain crossing between backplane SERDES and parallel system interfaces. Four PLLs generate the multiple low-jitter clocks required by E1/T1, Ethernet GMII, or POS-PHY interfaces, and 295 I/Os accommodate wide parallel buses plus JTAG, I2C management, and LED status. The 484-FBGA package's 1.0 mm pitch is compatible with standard 8-layer telecom backplane stack-ups.
Empfohlen
Low-Cost Software-Defined Radio Front End
The EP3C80U484C8 fits SDR front-end applications because its 244 18x18 multipliers handle wide-band digital down-conversion, channelization, and FIR filtering at rates up to ~260 MHz. 2.81 Mbits of M9K memory provides coefficient and sample buffering, and 4 PLLs synthesize the multiple sample-rate clocks needed for ADC and DAC interfacing. Designers can implement digital up/down conversion, AGC, and simple modulation/demodulation in fabric, leaving the host processor to handle higher-layer MAC and protocol stacks.
Empfohlen
Consumer Display Controllers and Video Walls
The EP3C80U484C8 supports consumer display-controller and video-wall applications because 81,264 LEs accommodate scaling, rotation, and bezel-correction pipelines for multiple HDMI/DVI inputs feeding tiled LCD outputs. The 295 I/Os handle parallel LVDS interfaces to TFT panels plus I2C, SPI, and GPIO for backlight and touch coordination. The low-power 65 nm Cyclone III process keeps total board power within consumer thermal budgets without active cooling. Designers commonly pair this part with external HDMI receivers and TFT timing controllers.
Empfohlen
Embedded Nios II Soft-Processor Platforms
The EP3C80U484C8 is ideal as a host for Altera Nios II soft processors because its 81,264 LEs easily accommodate a 32-bit Nios II/f core with caches, peripherals, and custom accelerators in fabric. 2.81 Mbits of embedded memory serve as tightly-coupled instruction and data store, and 295 I/Os expose Ethernet MACs, USB device controllers, and SD-card interfaces implemented in soft IP. Designers can boot the Nios II from on-chip ROM and execute RTOS workloads such as FreeRTOS or uClinux for industrial IoT gateways.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3C80U484C8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3C80U484C8N | EP3C80U484C7N | EP3C80U484C7 | EP3C80U484C6N | EP3C80U484C6 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (U484) | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 |
| Speed Grade | C8 | C8 | C7 (faster) | C7 (faster) | C6 (fastest) | C6 (fastest) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 |
| Embedded Multipliers (18x18) | 244 | 244 | 244 | 244 | 244 | 244 |
| Maximum User I/O | 295 | 295 | 295 | 295 | 295 | 295 |
| Lead-Free Finish | Standard (leaded) | Yes (N suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- Highest-density Cyclone III in the 484-ball BGA package (vs. EP3C55U484C8N)
- Same die and package as multiple speed-grade variants (vs. EP3C80U484C7N)
- More embedded multipliers than lower-density Cyclone III parts (vs. EP3C40U484C8N)
Designhinweise
The Cyclone III EP3C80U484C8 operates on a 1.2 V core supply (VCCINT) plus separate VCCIO banks for I/O voltage flexibility. Altera's Cyclone III Device Handbook recommends decoupling each VCCINT pin with a 0.1 uF ceramic cap placed within 100 mils of the pin, and a bulk 22-47 uF tantalum or polymer cap per power plane. VCCAUX and VCCPD have separate filtering requirements - sharing a single ferrite between them risks PLL jitter and configuration-mode corruption.
The 484-ball FineLine BGA at 1.0 mm pitch requires 4 mil (0.1 mm) trace-and-space rules with microvia-in-pad stack-up for reliable breakout. Fan-out should use a dog-bone pattern on the top layer with vias-in-pad only when cost permits laser-drilled microvias. Signal-integrity simulations should be run on DDR or LVDS interfaces spanning more than 2 inches to validate matched-length routing. Reference the Cyclone III Handbook pin-out table for the U484 ball-map before finalizing schematic symbols.
Common pitfalls when designing with the EP3C80U484C8 include: (1) leaving JTAG TCK floating during configuration, which can cause intermittent configuration failures; (2) not tying MSEL pins correctly to select the configuration mode (AS, PS, or JTAG); (3) forgetting to connect nCONFIG, nSTATUS, and CONF_DONE to the Altera-recommended pull-up resistors; (4) ignoring the I/O bank VCCIO restrictions - mixing 3.3 V and 2.5 V standards in the same bank will damage the part. Always cross-check the schematic against AN 521: Using the Configuration Files for Cyclone III Devices.
Compliance-Informationen
Lead-free option available via EP3C80U484C8N suffix. RoHS compliance per Altera/Intel product declaration. AEC-Q100 not applicable - FPGAs are not automotive-qualified as bare devices.
