EP3SE80F780I4N - Stratix III E FPGA 80K Cells 780-FCBGA | Intel
Teilenummer: EP3SE80F780I4N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $4037.5 | $40.375,00 |
| 100 | $3825 | $382.500,00 |
| 500 | $3612.5 | $1.806.250,00 |
| 1.000 | $3400 | $3.400.000,00 |
EP3SE80F780I4N Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-defined processors in the design hierarchy. The Stratix III E family specifically targets high-end digital signal processing, wireline communications, and military/aerospace systems where Stratix III GX-style transceiver-equipped cousins are not required.
Key features include 3,200 Logic Array Blocks (LABs), 488 user I/Os, 6.8 Mbit embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, programmable power technology that dynamically scales voltage and frequency per tile, and a comprehensive hard-memory controller subsystem. The 780-ball FCBGA package offers dense board integration with controlled-impedance signal escape, suitable for high-speed parallel interfaces such as DDR3, QDRII+, and RLDRAM II. Multi-gigabit transceivers are absent on the -E sub-family; designs requiring 6 Gbps+ serial links should evaluate Stratix III GX or Stratix IV parts instead.
Architecturally, Stratix III E uses the Altera Adaptive Logic Module (ALM) - an 8-input fracturable LUT that can be partitioned into smaller LUTs to improve logic utilization. Combined with the programmable power technology and 65 nm low-power process, the family delivers high DSP throughput at substantially lower dynamic power than the preceding Stratix II. The device supports configuration via passive serial, fast passive parallel, and JTAG, with on-chip decompression and encryption via the advanced encryption standard (AES).
Typical applications include high-performance digital signal processing for radar and electronic warfare, wireline backplane aggregation, test and measurement instrumentation, ASIC prototyping, and high-end image processing pipelines. Industrial and defense integrators value the combination of large logic capacity, abundant DSP resources, and military-grade temperature support.
When designing with this device, pay close attention to power integrity - the FCBGA requires a multi-layer PCB with dedicated power and ground planes, and decoupling must follow the Stratix III Power Distribution Network design guidelines. Configuration scheme and pin assignments must be locked early in the design cycle because the 780-ball BGA footprint limits PCB rework options.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not collected in a single place by the manufacturer datasheet alone.
Drop-in-Alternativen für EP3SE80F780I4N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SE80F780I4N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Logic Elements, RoHS Status, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SE80F780I4LN
✅ Drop-In✓ Auf Lager
$1280 / Stück
Datenblatt ansehen →EP3SE80F780I4L
✅ Drop-In✓ Auf Lager
$2850 / Stück
Datenblatt ansehen →EP3SE80F780I4
✅ Drop-In✓ Auf Lager
$1620 / Stück
Datenblatt ansehen →EP3SE80F780I3N
✅ Drop-In✓ Auf Lager
$2105 / Stück
Datenblatt ansehen →EP3SE80F780C4N
✅ Drop-In✓ Auf Lager
$1290 / Stück
Datenblatt ansehen →EP3SE110F780I4N
✅ Drop-In✓ Auf Lager
$1850 / Stück
Datenblatt ansehen →EP3SE50F780I4N
✅ Drop-In✓ Auf Lager
$1295 / Stück
Datenblatt ansehen →EP3SE80F780I4N Grenzwerte & elektrische Eigenschaften
| Family | Stratix III E |
| Logic Elements | 80000 |
| Logic Array Blocks (LABs) | 3200 |
| Adaptive Logic Modules (ALMs) | 32000 |
| Total Embedded Memory Bits | 6843392 (approximately 6.8 Mbit) |
| Maximum User I/Os | 488 |
| Process Node | 65 nm |
| Core Supply Voltage | 1.1 V |
| Maximum Fabric Frequency | 450 MHz |
| Gehäuse | 780-ball FCBGA (FineLine BGA) |
| Betriebstemperaturbereich | -40 C to +100 C (Industrial) |
| Transceivers | None (E sub-family; GX adds multi-Gbps transceivers) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| RoHS-Status | Compliant |
| Speed Grade | I4 (fastest industrial speed grade in Stratix III E) |
| Montageart | Surface Mount (BGA) |
EP3SE80F780I4N 780-ball fcbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP3SE80F780I4N (780-ball fcbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SE80F780I4N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SE80F780I4N ist geeignet für 6 Anwendungs: High-Performance DSP for Radar and EW, Wireline Backplane Aggregation, Test and Measurement Instrumentation, ASIC Prototyping, High-End Image Processing, Industrial Control and Automation.
High-Performance DSP for Radar and EW
The EP3SE80F780I4N suits radar and electronic warfare signal chains where 80K logic elements, abundant DSP blocks, and high fabric frequency enable real-time pulse-Doppler processing. With 6.8 Mbit embedded RAM, designers can implement FFT pipelines, moving target indication filters, and beamforming weights without external SRAM. The 780-ball FCBGA supports the LVDS fan-out required to interface ADCs and DACs at 1 Gsps+, while the I4 industrial speed grade sustains 450 MHz fabric operation across -40 C to +100 C.
Empfohlen
Wireline Backplane Aggregation
Telecom backplanes aggregating multiple lower-rate links into 10G+ trunks benefit from the EP3SE80F780I4N's abundant logic, embedded memory controllers, and 488 user I/Os. DDR3 and QDRII+ memory interfaces can be implemented with the hard memory controllers, simplifying board design. Note that the E sub-family lacks multi-gigabit transceivers, so SERDES aggregation requires external PHY devices. The 65 nm low-power process keeps per-channel power manageable in dense shelf designs.
Empfohlen
Test and Measurement Instrumentation
Test equipment such as protocol analyzers, arbitrary waveform generators, and logic analyzers leverage the EP3SE80F780I4N for parallel processing of high-speed sample streams. The 488 user I/Os accommodate many parallel channels, while 32K ALMs and 6.8 Mbit embedded RAM provide state-machine and buffer capacity. Industrial temperature support allows deployment in production test racks. JTAG-based configuration simplifies firmware updates during validation phases.
Empfohlen
ASIC Prototyping
ASIC prototyping on FPGAs is a primary use of the Stratix III E family. The EP3SE80F780I4N, with 80K logic elements and 488 I/Os, accommodates mid-complexity ASIC prototypes that map across one or two FPGAs. Pin compatibility across the EP3SE80F780 family (and up to EP3SE110F780) lets prototyping platforms reuse the same 780-ball PCB footprint across multiple logic-capacity targets. Altera's Synopsys ASIC Compiler and Mentor Precision support pin-multiplexing flows for multi-FPGA partitioning.
Empfohlen
High-End Image Processing
Real-time image processing pipelines for medical imaging, machine vision, and broadcast video use the EP3SE80F780I4N to implement filter chains, color-space converters, and motion estimators. DSP blocks accelerate convolution and FFT operations, while 6.8 Mbit embedded memory holds line buffers and coefficient tables. The 780-ball FCBGA comfortably handles the LVDS and DDR2/3 interface bandwidth needed for camera-link and HDMI inputs.
Empfohlen
Industrial Control and Automation
High-end industrial controllers, including programmable automation controllers (PACs) and motion-control systems, benefit from the EP3SE80F780I4N's deterministic fabric and rich IP catalog for EtherCAT, Profinet, and SERCOS III masters. The industrial temperature grade supports factory-floor deployments. Embedded DSP blocks enable closed-loop control algorithms at microsecond update rates, while 488 I/Os interface to multiple encoders, sensors, and drive interfaces.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SE80F780I4N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SE80F780I4LN | EP3SE80F780I3N | EP3SE110F780I4N | EP3SE50F780I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 80000 | 80000 | 80000 | 110000 | 50000 |
| Speed Grade | I4 (fastest industrial) | I4 | I3 | I4 | I4 |
| Embedded Memory Bits | 6843392 (~6.8 Mbit) | 6843392 | 6843392 | ~9.4 Mbit | ~4.4 Mbit |
| Maximum User I/Os | 488 | 488 | 488 | 488 | 488 |
| Logic Array Blocks (LABs) | 3200 | 3200 | 3200 | 4400 | 2000 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- Highest industrial speed grade available on 80K-LE Stratix III E (vs. EP3SE80F780I3N)
- Mid-density sweet spot for cost-sensitive DSP designs (vs. EP3SE110F780I4N)
- Industrial temperature support not available on C-suffix parts (vs. EP3SE80F780C4N)
Designhinweise
The 780-ball FCBGA requires a 1.0 mm pitch PCB land pattern with microvia-in-pad or stacked-via escape to inner signal layers. Plan for at least 8 PCB layers with two dedicated solid power planes and two dedicated ground planes. Per the Stratix III PDN guidelines, place 0.1 uF and 0.01 uF decoupling capacitors on every eight power-ball group, plus bulk 22 uF to 47 uF ceramic capacitors within 100 mils of the package. Series termination resistors on LVDS and DDR signals must be placed within 200 mils of the BGA ball.
Estimated: at full fabric utilization (80% toggle rate, 50% logic), the EP3SE80F780I4N can dissipate 6-8 W. With the FCBGA theta_JA near 12 C/W (still air) and 6 C/W with 200 LFM airflow, junction temperature rises 36-72 C above ambient. Enable Programmable Power Technology (PPT) to power down unused LABs. Apply a heatsink with thermal interface material for sustained high-activity designs.
LVDS and DDR3 interfaces on the EP3SE80F780I4N must follow the Stratix III device handbook pin assignment tables - the I/O bank structure imposes dedicated PLL clock pin placement and DQ/DQS grouping. Use Altera's Quartus II pin planner to validate fly-by and T-branch topologies before board layout. Allow 2-3 PCB spin iterations to close SI margins on 533 Mbps DDR3 interfaces.
Do not confuse the E sub-family with GX - the EP3SE80F780I4N has no multi-gigabit transceivers, so attempting to instantiate an altgx megafunction will fail. Configuration mode selection (Passive Serial vs FPP vs JTAG) must be set via MSEL pins per datasheet, and the configuration flash must be sized for the bitstream plus any factory update margin.
Compliance-Informationen
RoHS compliance confirmed via Intel/Altera product certification documents. Last-time-buy lifecycle status does not affect RoHS compliance but limits future supply.