EPF10K50VBC356-2 - FLEX 10K FPGA 50K Gates 356-BGA | Intel
Teilenummer: EPF10K50VBC356-2 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.5 | $6.450,00 |
| 500 | $58 | $29.000,00 |
| 1.000 | $52.4 | $52.400,00 |
EPF10K50VBC356-2 Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the high integration density of a gate array with the design flexibility of in-system programmability. FPGAs sit within the broader programmable logic hierarchy (PLA -> PAL -> CPLD -> FPGA -> SoC FPGA) and are widely used to implement glue logic, high-speed datapaths, bus bridges and ASIC prototyping. The FLEX 10K family was the industry's first family to embed an array of RAM blocks alongside the logic fabric, enabling System-on-a-Programmable-Chip (SOPC) integration.
Key features of the EPF10K50VBC356-2 include 20,480 typical flip-flops, 0.6 ns propagation delay through the Look-Up Table (LUT) and I/O blocks, CMOS logic family compatibility, 66.67 MHz internal frequency, and an operating temperature range of 0 °C to +70 °C for the commercial grade (-2 speed grade). The 356-pin LBGA (Low-profile Ball Grid Array) package provides high signal density and is suitable for SMT assembly on multi-layer boards.
Architecturally, the device pairs a Logic Array of LABs with an Embedded Array Block (EAB) that provides dedicated dual-port RAM of up to 2048 bits per EAB. The I/O structure supports 5 V tolerant inputs and PCI-compliant operation, while in-system programmability via the Serial Passive (PS) configuration scheme allows rapid design iteration. The -2 speed grade places this EPF10K50V among the slower FLEX 10K speed bins, optimized for power-sensitive designs.
Typical applications for the EPF10K50VBC356-2 include telecommunications line-card glue logic, industrial control bus bridging, ASIC prototyping, video and image processing front-ends, and legacy system replacements in equipment originally designed in the late 1990s. With its 274 user I/Os, the part is particularly attractive in designs that must aggregate multiple narrow buses into wider datapaths.
When designing with this part, verify that your design tools (Quartus II or MAX+PLUS II) still target the FLEX 10K family and that the chosen power-sequencing scheme respects the device's 3.3 V core and I/O supply rails. The EPF10K50V family is now in NRND/EOL status on the Altera/Intel Product Discontinuance notice; for new designs, consider Cyclone IV or Cyclone V equivalents, and plan for last-time-buy if replacing existing stock.
Drop-in-Alternativen für EPF10K50VBC356-2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K50VBC356-2 (gleiche Bauform und Footprint) – abweichend in Process Technology, Package, Operating Temperature, Speed Grade, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K50VBC356-2N
✅ Drop-In✓ Auf Lager
$316.7 / Stück
Datenblatt ansehen →EPF10K50VBC356-1N
✅ Drop-In✓ Auf Lager
$162 / Stück
Datenblatt ansehen →EPF10K130EBC356-1
✅ Drop-In✓ Auf Lager
$95 / Stück
Datenblatt ansehen →EPF10K200SBC356-2
✅ Drop-In✓ Auf Lager
$178 / Stück
Datenblatt ansehen →EPF10K130EBC356-2
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →EPF10K50VBC356-2 Grenzwerte & elektrische Eigenschaften
| Series | FLEX 10K |
| Logic Family / Process | CMOS, 0.42 µm |
| Typical Gate Count | 50,000 gates |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Number of Flip-Flops | 20,480 |
| Maximum User I/Os | 274 |
| Propagation Delay | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Operating Frequency (typ.) | 66.67 MHz |
| Core Supply Voltage | 3.3 V |
| Betriebstemperatur | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2 |
| Gehäuse | 356-LBGA (Low-profile BGA) |
| Montageart | Surface Mount (Tray) |
| Configuration Scheme | Serial Passive (PS) |
| Embedded Memory | EAB blocks, up to 2048 bits each |
| RoHS-Status | Not Compliant (per Arrow listing) |
EPF10K50VBC356-2 356-lbga (low-profile bga) Pinbelegungsleitfaden
Pinbelegung für EPF10K50VBC356-2 (356-lbga (low-profile bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K50VBC356-2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K50VBC356-2 ist geeignet für 6 Anwendungs: Telecommunications Line-Card Glue Logic, Industrial Bus Bridge and Protocol Converter, ASIC Prototyping and Emulation, Legacy Industrial Controller Replacement, Video and Imaging Front-End Processing, Test and Measurement Instrumentation Logic.
Telecommunications Line-Card Glue Logic
The EPF10K50VBC356-2 fits telecom line-card glue logic because its 2,880 logic cells, 20,480 flip-flops and 274 user I/Os aggregate narrow TDM buses, framing logic and HDLC controllers in a single programmable device. The 3.3 V core supply and 125 MHz internal frequency suit backplane clocking, while the 356-LBGA package delivers the I/O density required for multi-port line interfaces. Unlike a CPLD solution, the FLEX 10K's embedded array blocks (EABs) provide small FIFOs for cell buffering without external SRAM, simplifying board layout. Commercial-grade 0-70 °C operation is appropriate for central-office thermal environments, and the part's long-standing design-win status means many legacy line-card designs still rely on it. For new builds, however, designers should evaluate Cyclone V equivalents due to the FLEX 10K NRND status.
Empfohlen
Industrial Bus Bridge and Protocol Converter
The EPF10K50VBC356-2 is well suited to industrial bus-bridging designs - converting between Profibus, Modbus, CAN and legacy parallel field buses - because its 274 user I/Os expose enough pins to terminate multiple bus ports simultaneously. The 125 MHz internal frequency and 0.6 ns LUT delay let the device keep up with deterministic control loops, while the embedded RAM blocks (EABs) implement small lookup tables for protocol translation without external memory. The 356-LBGA package supports multi-layer industrial PCBs with controlled-impedance routing for RS-485 and CAN differential pairs. Industrial temperature designs should choose the -2 grade's commercial 0-70 °C range only when chassis ambient is controlled; for harsher environments the EPF10K50V industrial variants are recommended but require separate qualification.
Empfohlen
ASIC Prototyping and Emulation
Engineers use the EPF10K50VBC356-2 as an ASIC prototyping vehicle because its 50K-gate capacity emulates mid-complexity ASICs and its Quartus II flow supports rapid design iteration with in-system Serial Passive configuration. The 360 LABs and 20,480 flip-flops map comfortably onto ASIC register-transfer-level (RTL) designs of up to ~40K gates with verification overhead. The 356-LBGA footprint exposes enough I/Os to break out full ASIC pads, while the 125 MHz internal frequency allows real-time functional validation at near-ASIC clock rates. For larger ASIC prototypes, multiple EPF10K50VBC356-2 devices can be partitioned; the FLEX 10K family was a popular prototyping platform in the late 1990s and many emulators still run this part.
Empfohlen
Legacy Industrial Controller Replacement
The EPF10K50VBC356-2 is the natural replacement for failed FLEX 10K devices in legacy industrial controllers because it is form-, fit- and function-compatible with the original 356-LBGA footprint and Quartus II design database. The 50K-gate capacity covers most legacy control algorithms, and the 274 user I/Os maintain the original wiring harness without PCB rework. Engineers can drop in EPF10K50VBC356-2N for lead-free compliance without changing the BOM; the -2 speed grade preserves timing margins on existing designs. This application is the primary remaining use case as of 2026, since new FLEX 10K designs ended in the early 2000s and OEMs are now in long-term support of installed equipment.
Empfohlen
Video and Imaging Front-End Processing
The EPF10K50VBC356-2 fits mid-resolution video front-ends because its 50K-gate fabric and embedded RAM blocks (EABs) implement line buffers, color-space converters and simple de-interlacers at pixel clock rates up to 125 MHz. The 274 user I/Os accept ITU-R BT.656 parallel video buses plus ancillary control lines for camera-link or LVDS front ends, while the 3.3 V core supply interfaces directly to video ADCs and DACs of the same era. Designers commonly pair the EPF10K50VBC356-2 with external SDRAM for full-frame buffering; the device's 0.6 ns LUT delay keeps critical paths short enough for 80-100 MHz pixel clocks. For modern multi-megapixel designs, this part is a legacy choice; new designs should target Cyclone IV or Cyclone V.
Empfohlen
Test and Measurement Instrumentation Logic
The EPF10K50VBC356-2 serves test-and-measurement instruments as a flexible pattern generator, timing generator and protocol decoder because its in-system programmability lets OEMs ship the same hardware with multiple personalities. The 274 user I/Os drive front-panel displays, matrix switches and rear-panel BNC connectors, while the 50K-gate fabric implements waveform synthesis, FFT pre-processing or arbitrary stimulus generation. The commercial 0-70 °C range suits laboratory environments; instruments that need industrial temperature ranges select the 'I' grade FLEX 10K variant. Long-term availability through distributors makes the EPF10K50VBC356-2 attractive for instruments with 10-15 year production runs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K50VBC356-2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K50VBC356-2N | EPF10K50VBC356-1N | EPF10K130EBC356-1 | EPF10K200SBC356-2 | EPF10K130EBC356-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 356-LBGA (BC356) | 356-LBGA (BC356) - same | 356-LBGA (BC356) - same | 356-BGA (EBC356) - same family | 356-BGA (SBC356) - same family | 356-BGA (EBC356) - same family |
| Typical Gate Count | 50,000 gates | 50,000 gates | 50,000 gates | 130,000 gates | 200,000 gates | 130,000 gates |
| Logic Cells | 2,880 | 2,880 | 2,880 | 6,560 | 9,936 | 6,560 |
| Maximum User I/Os | 274 | 274 | 274 | 246 | 277 | 246 |
| Internal Frequency (max) | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz |
| Speed Grade | -2 | -2 | -1 (faster) | -1 (faster) | -2 | -2 |
Wichtigste Unterscheidungsmerkmale
- Long-term established silicon for legacy designs (vs. Cyclone IV EP4CE6E22C8N)
- Same-package Pb-free drop-in available (vs. EPF10K50VBC356-2 (standard SnPb))
- Mid-density 50K gates balanced against I/O count (vs. EPF10K200SBC356-2 (200K gates, same 356-BGA))
Designhinweise
The EPF10K50VBC356-2 requires a 3.3 V core supply (VCCINT) and a 3.3 V (or 5 V tolerant) I/O supply (VCCIO). Power sequencing must follow the FLEX 10K datasheet guidelines: VCCINT must ramp before or simultaneously with VCCIO to avoid latch-up; in-rush current on configuration can exceed 500 mA, so place 100 µF bulk plus 0.1 µF + 1 µF ceramic decoupling within 5 mm of each power pin pair. Estimated: at 125 MHz with 80% utilization the device draws roughly 250-400 mA from VCCINT, so the regulator must supply 1 A minimum with 10% headroom.
The 356-LBGA package has 1.27 mm pitch balls on a 22x22 array (with depopulated corners). Escape routing requires at least 6 PCB layers with 0.1 mm micro-vias under the BGA; designers commonly use HDI (High-Density Interconnect) stack-ups with sequential lamination. Match the BGA pad diameter (0.6 mm nominal) and non-solder-mask-defined (NSMD) pads per Altera's package specification. Keep all decoupling capacitors on the top layer under the BGA with vias placed within the pad for lowest loop inductance. Ground and power planes should be unbroken under the BGA for return-path integrity.
Three common pitfalls: (1) substituting EPF10K130EBC356-2 for EPF10K50VBC356-2 without verifying the BGA ball map - the 130K-gate die has different I/O placement even in the same 356-BGA package; (2) omitting the nCONFIG pull-up resistor and the nSTATUS pull-up, which prevents reliable Serial Passive configuration; (3) forgetting the JTAG pull-down on TCK per IEEE 1149.1, which causes spurious clocking and configuration failures. Always program the device with the Quartus II programmer and verify IDCODE before board bring-up.
The 356-LBGA package has a theta-JA of approximately 18 °C/W with 1 oz copper on a 4-layer board; at 1.5 W total power the junction rises 27 °C above ambient. Estimated: with no airflow, the commercial 70 °C ambient limit is reached at ~2.7 W dissipation, so designs in sealed enclosures should either reduce clock speed (lower VCCINT activity) or add modest airflow (100 LFM). Industrial designs should select the 'I' grade variant. Use the on-chip diode (if accessible) to verify junction temperature under worst-case workload.
Differential pairs (LVDS, clock inputs) should be length-matched to within 0.5 mm and routed on the same layer with continuous ground reference. Global clock inputs (CLK0, CLK1) should connect to the dedicated clock input pins on the BGA - not general-purpose I/O - to access the on-chip PLL. JTAG chain order (TDI -> device1 -> device2 -> TDO) must follow the chain order specified in the Quartus II Assignment Editor; mis-ordering the chain is a frequent board-spin cause.
Compliance-Informationen
EPF10K50VBC356-2 is RoHS non-compliant per the Arrow listing ('EU RoHS Not Compliant'); EPF10K50VBC356-2N (lead-free) is the RoHS-compliant variant. Commercial temperature grade only; AEC-Q100 not applicable. Reach and conflict minerals compliance inferred from legacy Altera declarations - verify with current Intel product discontinuity notice before procurement.
