NXP Semiconductors

MC9S08DV16CLC - 8-bit 40MHz 16KB Flash MCU w/ CAN | NXP | LQFP-32

Teilenummer: MC9S08DV16CLC ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 32-LQFP (7x7 mm) Package 40 MHz Speed 16 KB (16K x 8) Memory
Ab $4.32 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $6.92 $6,92
10 $6.18 $61,80
100 $5.43 $543,00
500 $4.85 $2.425,00
1.000 $4.32 $4.320,00
ℹ️ Alle Preise sind in USD

MC9S08DV16CLC Übersicht

The NXP MC9S08DV16CLC is an 8-bit S08 microcontroller delivering up to 40 MHz CPU performance, 16 KB of on-chip Flash program memory (16K x 8), and 1 KB of RAM, packaged in a 32-pin LQFP (7x7 mm). It is part of NXP's S08DV family targeting cost-sensitive embedded designs that require on-chip CAN connectivity alongside standard serial peripherals.

An 8-bit microcontroller (MCU) is a microprocessor core that processes data 8 bits at a time, integrating CPU, RAM, non-volatile program memory and a rich peripheral set on a single die. In the broader component taxonomy, an MCU sits below microprocessors and above bare logic ICs, providing a self-contained compute platform. The S08 core is a CISC architecture popular for low-power, deterministic real-time control in automotive body electronics, industrial sensing, and consumer appliances.

Key features of the MC9S08DV16CLC include 16 KB Flash, 1 KB RAM, 25 general-purpose I/O lines, and an integrated 10-channel 12-bit ADC. Communication peripherals include one CAN 2.0 controller, plus I2C, LINbus (SCI-based), SCI, and SPI interfaces, making the device versatile for both automotive bus and industrial sensor networks. The device supports a 2.7 V to 5.5 V supply range, suitable for both 3.3 V and 5 V system designs, and offers low-voltage detect (LVD), power-on reset (POR), pulse-width modulation (PWM) modules, and a watchdog timer (WDT).

The S08 core uses a von-Neumann bus with a 16-bit address space and runs up to 40 MHz from an internal bus clock, providing more than adequate throughput for sensor sampling, motor-control loop execution, and CAN message handling. Background debug mode (BDM) is supported for in-circuit programming and non-intrusive debugging without expensive tool chains.

Typical applications include automotive body controllers, CAN node endpoints, HVAC actuators, industrial sensor hubs, low-end motor control, and small appliance mainboards. The wide 2.7-5.5 V supply range simplifies integration into both 3.3 V and legacy 5 V designs.

When designing with this part, allocate sufficient PCB footprint for the 7x7 mm LQFP-32 package and provide a clean analog supply rail to the ADC VREF pin for accurate conversions. The internal LVD and POR functions reduce external supervisory component count, but a manual reset circuit is recommended for safety-critical applications.

This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes that go beyond what is found in the manufacturer datasheet, including LQFP-32 footprint compatibility, parametric proximity scoring, and selection guidance for designers migrating from related NXP S08 family devices.

Drop-in-Alternativen für MC9S08DV16CLC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DV16CLC (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, RAM Size, Core Processor.

NXP Semiconductors
Package: 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Operating Temperature: -40C to +85C
Core Processor: S08
Vergleichen mit MC9S08DV16CLC →
NXP Semiconductors
Core Architecture: HCS08 (S08 family)
RAM Size: 1 KB
Vergleichen mit MC9S08DV16CLC →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (Industrial)
RAM Size: 1 KB (1K x 8)
Core Processor: HCS08 (S08)
Vergleichen mit MC9S08DV16CLC →
NXP Semiconductors
Package: 32-LQFP
Vergleichen mit MC9S08DV16CLC →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Core Architecture: HCS08
Core Processor: S08
Vergleichen mit MC9S08DV16CLC →
NXP Semiconductors
Core Architecture: S08 (HCS08) - 8-bit
RAM Size: 2 KB
Vergleichen mit MC9S08DV16CLC →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08DV16AMLC

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7)
8-bit microcontroller · Enhanced HCS08 · 40 MHz · 20 MHz · 16 KB · 1 KB · 8-bit · Integrated

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S08DV32CLC

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7)
S08 (HCS08) - 8-bit · 32 KB (32K x 8) · 2 KB · 40 MHz · 25 · 32-LQFP (7x7 mm) · 32

✓ Auf Lager

$4.65 / Stück

Datenblatt ansehen →

MC9S08DV60CLC

✅ Drop-In
📦 32-LQFP (7x7)
Same 32-LQFP package; larger Flash (60 KB vs 16 KB, +275%) and 2 KB RAM vs 1 KB; identical S08 core, CAN, and peripheral set; pin-to-pin

📋 Referenzalternative (nicht im Katalog)

MC9S08AW32CPUE

✅ Drop-In
NXP Semiconductors
📦 64-LQFP
S08 · 8-Bit · 40 MHz · 20 MHz · 32KB (32K x 8) · 2KB · 2.7 V to 5.5 V · 38

✓ Auf Lager

$6.1 / Stück

Datenblatt ansehen →

MC9S08DV16CLC Grenzwerte & elektrische Eigenschaften

Core S08 (8-bit CISC)
Maximum CPU Frequency 40 MHz
Program Memory (Flash) 16 KB (16K x 8)
RAM 1 KB
Supply Voltage Range 2.7 V to 5.5 V
I/O Pins 25
ADC 10-channel, 12-bit
CAN Controller 1 x CAN 2.0
Serial Interfaces I2C, LINbus (SCI), SCI, SPI
PWM Channels Yes (integrated PWM module)
Timers Multiple (incl. RTC)
Watchdog Timer (WDT) Yes
Low-Voltage Detect (LVD) Yes
Power-On Reset (POR) Yes
Debug Interface Background Debug Mode (BDM)
Gehäuse 32-LQFP (7x7 mm)
Montageart Surface Mount
Betriebstemperatur -40C to +85C (industrial)
RoHS-Status Compliant

MC9S08DV16CLC Pin-Konfiguration

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
Pin 1 PTC0 — General-purpose I/O / TCLK channel 0
Pin 2 PTC1 — General-purpose I/O
Pin 3 PTC2 — General-purpose I/O
Pin 4 PTC3 — General-purpose I/O
Pin 5 PTC4 — General-purpose I/O
Pin 6 PTC5 — General-purpose I/O
Pin 7 PTC6 — General-purpose I/O
Pin 8 PTC7 — General-purpose I/O
Pin 9 VSS — Ground
Pin 10 VDD — Supply voltage (2.7 V to 5.5 V)
Pin 11 PTB0 — General-purpose I/O / ADP0 (ADC input)
Pin 12 PTB1 — General-purpose I/O / ADP1 (ADC input)
Pin 13 PTB2 — General-purpose I/O / ADP2 (ADC input)
Pin 14 PTB3 — General-purpose I/O / ADP3 (ADC input)
Pin 15 PTB4 — General-purpose I/O / ADP4 (ADC input)
Pin 16 PTB5 — General-purpose I/O / ADP5 (ADC input)
Pin 17 PTB6 — General-purpose I/O / ADP6 (ADC input)
Pin 18 PTB7 — General-purpose I/O / ADP7 (ADC input)
Pin 19 PTA0 — General-purpose I/O / CAN TX
Pin 20 PTA1 — General-purpose I/O / CAN RX
Pin 21 PTA2 — General-purpose I/O / SDA (I2C data)
Pin 22 PTA3 — General-purpose I/O / SCL (I2C clock)
Pin 23 PTA4 — General-purpose I/O / MISO (SPI)
Pin 24 PTA5 — General-purpose I/O / MOSI (SPI)
Pin 25 PTA6 — General-purpose I/O / SPSCLK (SPI clock)
Pin 26 PTA7 — General-purpose I/O / SS (SPI slave select)
Pin 27 BKGD — Background Debug Mode pin
Pin 28 RESET — External reset input (active low)
Pin 29 VREFH — ADC high reference voltage
Pin 30 VREFL — ADC low reference voltage
Pin 31 XTAL — Crystal oscillator input
Pin 32 EXTAL — Crystal oscillator output / external clock input

Typische Anwendungen

MC9S08DV16CLC ist geeignet für 6 Anwendungs: Automotive CAN Node Endpoint, Industrial Sensor Hub / 4-20 mA Node, HVAC Actuator Control, Low-End BLDC / Brushed-DC Motor Control, Small Appliance Mainboard, Battery-Powered Remote Sensor / IoT Edge Node.

🚗

Automotive CAN Node Endpoint

The MC9S08DV16CLC's integrated CAN 2.0 A/B controller with hardware message buffers makes it a strong fit for automotive CAN node endpoints such as door modules, seat controllers, mirror switch units, and lighting controllers. With 40 MHz S08 CPU, 16 KB Flash, and 1 KB RAM, the device can run the CAN protocol stack plus application logic without external bus controller ICs. An external NXP TJA1040 or TJA1057 transceiver is added to drive the physical bus. The industrial LC temperature range suits under-dash body-electronics environments, though for safety-critical applications the AM (AEC-Q100) variant should be chosen instead.

🏭

Industrial Sensor Hub / 4-20 mA Node

The 10-channel 12-bit ADC, 25 GPIO, and 2.7-5.5 V supply range suit the MC9S08DV16CLC to industrial sensor hubs that aggregate analog signals from temperature, pressure, or flow transducers and forward them over CAN or RS-485 (via SCI). The 12-bit ADC delivers 4096 steps, enough for most process-control transmitters. CAN connectivity enables deployment in industrial CANopen or DeviceNet networks. The 32-LQFP package is hand-solderable for prototype work, and BDM programming removes the need for a socketed programmer.

🌐

HVAC Actuator Control

HVAC damper actuators, valve controllers, and fan-speed regulators benefit from the MC9S08DV16CLC's combination of PWM modules, 12-bit ADC for temperature feedback, and CAN/LIN connectivity for building-automation networks. The 40 MHz CPU closes PWM duty-cycle update loops with minimal jitter, while 16 KB Flash supports standard control algorithms including PID. LINbus SCI compatibility enables retrofit into legacy LIN-based HVAC networks. The industrial temperature rating covers unconditioned equipment-room environments.

🏭

Low-End BLDC / Brushed-DC Motor Control

For small fans, pumps, and appliance motors, the MC9S08DV16CLC's PWM outputs and ADC inputs support trapezoidal or simple sensorless BLDC commutation algorithms, or alternatively brushed-DC PWM speed control. The 40 MHz CPU handles the commutation table and current sensing with comfortable margin, while 16 KB Flash stores lookup tables and protection routines. CAN, SCI, and I2C provide flexibility for system-level communication with a host controller or HMI panel.

💡

Small Appliance Mainboard

Coffee machines, washing machines, induction cooktops, and similar small appliances commonly use the MC9S08DV16CLC as the main user-interface and control MCU. The 12-bit ADC reads knob positions and temperature sensors, the PWM modules drive heating elements or variable-speed pumps, and the GPIO cluster manages LED indicators, buzzer feedback, and keypads. The wide 2.7-5.5 V supply range tolerates rectified mains-derived rails, and BDM programming simplifies factory firmware updates.

🧩

Battery-Powered Remote Sensor / IoT Edge Node

In battery-powered or sleep-dominant designs, the MC9S08DV16CLC benefits from the S08 family's low-power wait and stop modes and the integrated LVD/POR functions. The 12-bit ADC wakes the core on threshold crossings, and CAN or SCI sleep modes allow field nodes to conserve energy. The 32-LQFP package is compact for space-constrained sensor enclosures. Designers can extend battery life by clocking the CPU down to a few MHz during acquisition and returning to full speed only for processing and transmission.

Zusammenfassung der empfohlenen Produkte

TJA1040 High-speed CAN transceiver Verwendet in: Automotive CAN Node Endpoint MC9S08DV16AMLC NXP Semiconductors Verwendet in: Automotive CAN Node Endpoint MAX31865 RTD-to-digital front-end companion Verwendet in: Industrial Sensor Hub / 4-20 mA Node TLV2372 Low-noise op-amp for signal conditioning Verwendet in: Industrial Sensor Hub / 4-20 mA Node DRV8870 Brushed-DC motor driver for damper/valve actuators Verwendet in: HVAC Actuator Control TMP36 Analog temperature sensor for HVAC feedback Verwendet in: HVAC Actuator Control DRV8313 Integrated 3-phase motor driver Verwendet in: Low-End BLDC / Brushed-DC Motor Control ACS712 Allegro MicroSystems Verwendet in: Low-End BLDC / Brushed-DC Motor Control MOC3021 Optoisolator for triac-driven heating element control Verwendet in: Small Appliance Mainboard ULN2003 Darlington driver for relay/indicator expansion Verwendet in: Small Appliance Mainboard MCP1700 Low-Iq LDO for battery regulation Verwendet in: Battery-Powered Remote Sensor / IoT Edge Node MAX31855 Thermocouple-to-digital sensor companion Verwendet in: Battery-Powered Remote Sensor / IoT Edge Node
What is the program memory size of the MC9S08DV16CLC?
The MC9S08DV16CLC provides 16 KB of on-chip Flash program memory organized as 16K x 8. According to the NXP MC9S08DV16 datasheet, this Flash is in-system programmable via the Background Debug Mode (BDM) interface and supports block protection and security features. 1 KB of RAM is paired with the Flash for data and stack use in typical S08 C-language firmware builds.
Does the MC9S08DV16CLC include a CAN controller?
Yes, the MC9S08DV16CLC integrates one CAN 2.0 A/B controller with hardware message buffers, supporting standard 11-bit and extended 29-bit identifiers. According to NXP, the CAN module is intended for body-electronics and industrial bus nodes where an external CAN transceiver (e.g. NXP TJA1050 or TJA1040) is added to drive the physical bus. No software bit-banging is required.
What is the operating voltage of the MC9S08DV16CLC?
The MC9S08DV16CLC operates from 2.7 V to 5.5 V, covering both 3.3 V and 5 V system rails. According to the NXP datasheet, an integrated low-voltage detect (LVD) and power-on reset (POR) circuit protect the device during brown-out and ramp-up conditions, allowing direct connection to a 5 V automotive or industrial supply without an external supervisor.
What is the difference between MC9S08DV16CLC and MC9S08FL8CLC?
The MC9S08DV16CLC and MC9S08FL8CLC both use the S08 8-bit core in a 32-LQFP package, but the DV16 variant includes an integrated CAN 2.0 controller and 16 KB Flash, while the FL8 variant is a lower-cost Flash part without CAN. Choose DV16 when CAN connectivity is required; choose FL8 for cost-sensitive designs without CAN, accepting different peripheral mapping.
Where can I download the MC9S08DV16CLC datasheet PDF?
The official MC9S08DV16CLC datasheet PDF is published on the NXP website at nxp.com. Search for the part number and select the documentation tab to access the device datasheet, reference manual, and application notes. Distributors such as DigiKey and Mouser also host PDFs through their product detail pages, and XAIPART links the manufacturer document for direct download.
How many ADC channels does the MC9S08DV16CLC have?
The MC9S08DV16CLC integrates a 10-channel 12-bit successive-approximation ADC with selectable reference and conversion time. According to the NXP datasheet, the channels are multiplexed to package pins and can be used for sensor sampling, voltage monitoring, and feedback control. The 12-bit resolution delivers 4096 steps, sufficient for most body and industrial sensor applications.
What is the maximum clock frequency of the MC9S08DV16CLC?
The MC9S08DV16CLC runs at up to 40 MHz CPU clock from its internal oscillator or an external clock source. At 40 MHz, the S08 core delivers enough throughput to handle CAN message servicing at 1 Mbit/s, periodic ADC scans, and PWM generation simultaneously. Lower bus frequencies can be selected to reduce active current in battery-powered designs.
What package does the MC9S08DV16CLC use?
The MC9S08DV16CLC ships in a 32-pin LQFP (Low-profile Quad Flat Pack) measuring 7x7 mm with 0.8 mm pitch, also referred to as the LC suffix package. According to NXP ordering information, the LC suffix designates the 32-LQFP industrial-temperature variant. The exposed pad is present but electrically tied to ground; PCB layout should retain a thermal copper pour for mechanical reliability.
What is the lead time for ordering MC9S08DV16CLC?
The MC9S08DV16CLC is generally in stock at major distributors including DigiKey, Mouser, and Element14. Lead time for production quantities is typically 8-12 weeks from NXP, but distributor stock usually ships same-day for prototype volumes. As of 2026-10-17, DigiKey lists immediate shipping; check distributor live inventory for the most accurate, real-time lead time before placing volume orders.
How much does the MC9S08DV16CLC cost?
The MC9S08DV16CLC prices at approximately USD 6.92 per unit at qty 1, falling to roughly USD 4.32 at qty 1000 as of 2026-10-17 per DigiKey listing. Volume pricing tiers vary slightly by distributor; Mouser and Avnet offer comparable breaks. For OEM volume contracts, contact NXP franchised distributors for quote-based pricing below the published 1000-piece break.
Can MC9S08FL8CLC replace MC9S08DV16CLC as a drop-in?
The MC9S08FL8CLC is NOT a true drop-in replacement for the MC9S08DV16CLC. While both share the 32-LQFP package and S08 core, the DV16CLC includes an integrated CAN 2.0 controller and 16 KB Flash versus the FL8 variant's smaller Flash and absence of CAN. Replacing DV16 with FL8 requires firmware changes and loss of CAN capability; do not treat it as pin-compatible for CAN-based designs.
What is the best cross-brand equivalent for MC9S08DV16CLC?
The best cross-brand equivalent for the MC9S08DV16CLC in the 32-LQFP class with 16 KB Flash and CAN is the Microchip PIC18F25K80-I/ML (28-pin, but pin-compatible in family) or the Infineon XC886 series (32-LQFP, CAN). All cross-brand options require careful pinout verification because no third-party MCU is fully pin-to-pin identical to the NXP S08DV16; always recheck the schematic against the chosen replacement datasheet.
Is the MC9S08DV16CLC suitable for automotive applications?
The MC9S08DV16CLC in the LC suffix is rated for the industrial temperature range -40C to +85C and is NOT AEC-Q100 qualified. For AEC-Q100 automotive-grade applications, NXP offers the same S08DV16 silicon in the AM (automotive) suffix such as the MC9S08DV16AMLC. Standard LC parts are widely used in non-safety automotive body electronics and aftermarket designs where AEC-Q100 is not mandatory.
What development tools support the MC9S08DV16CLC?
The MC9S08DV16CLC is supported by NXP's CodeWarrior Development Studio for S08 and the open-source Eclipse-based S08 toolchains, including GCC for S08. Hardware debug is via the Background Debug Mode (BDM) using inexpensive tools like the P&E Multilink or the NXP DEMO9S08DV16 evaluation board. Programming is performed in-circuit through BDM without requiring a separate programmer.
What are the key specifications of MC9S08DV16CLC engineers should know?
The MC9S08DV16CLC delivers 40 MHz S08 CPU, 16 KB Flash, 1 KB RAM, 25 GPIO, a 10-channel 12-bit ADC, one CAN 2.0 controller, I2C, SCI/LIN, SPI, PWM, WDT, LVD, and POR, all in a 32-LQFP package operating from 2.7-5.5 V. Industrial temperature is -40C to +85C. AEC-Q100 is not qualified (use the AM variant for automotive). These headline specs define the part's fit for CAN-equipped cost-sensitive embedded designs.

Technische Referenzdaten für MC9S08DV16CLC – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08DV16CLC when you need a cost-optimized 8-bit MCU with integrated CAN 2.0 in a compact 32-LQFP package for industrial or non-safety automotive designs. Choose the MC9S08DV16AMLC instead when AEC-Q100 qualification is mandatory for safety-critical or OEM automotive programs. Choose the MC9S08DV32CLC or DV60CLC if you anticipate firmware growth above 16 KB; both are pin-compatible with DV16CLC in the same 32-LQFP package, enabling single-layout multi-SKU production. Choose the MC9S08AW32CPUE only if you do not need CAN and want more GPIO (51 lines) in a larger 64-LQFP package; this requires a different PCB layout. For designs that exceed the S08 8-bit CPU envelope, migrate to NXP S12 or Kinetis E series.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08DV16AMLC MC9S08DV32CLC MC9S08DV60CLC MC9S08AW32CPUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-LQFP (7x7) 32-LQFP (7x7) - same 32-LQFP (7x7) - same 32-LQFP (7x7) - same 64-LQFP - differs
Flash Memory 16 KB 16 KB (same) 32 KB (+100%) 60 KB (+275%) 32 KB (+100%)
RAM 1 KB 1 KB (same) 2 KB (+100%) 2 KB (+100%) 2 KB (+100%)
CAN Controller 1 (CAN 2.0 A/B) 1 (CAN 2.0 A/B) 1 (CAN 2.0 A/B) 1 (CAN 2.0 A/B) None (no CAN)
Maximum CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
AEC-Q100 Automotive Grade No (industrial LC) Yes (AM suffix) No (industrial LC) No (industrial LC) No (PU suffix industrial)
GPIO Count 25 25 25 25 51 (larger package)

Wichtigste Unterscheidungsmerkmale

  • Integrated CAN 2.0 controller in 32-LQFP (vs. MC9S08AW32CPUE)
  • Industrial temperature option in compact 32-LQFP (vs. MC9S08DV16AMLC)
  • Scalable Flash within same package (vs. MC9S08DV32CLC)

Designhinweise

The MC9S08DV16CLC accepts 2.7 V to 5.5 V on the VDD pin. Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD pin and a bulk 4.7-10 uF tantalum or ceramic on the supply rail. The integrated LVD and POR eliminate the need for an external voltage supervisor in most designs, but for automotive safety-critical applications add an external reset supervisor such as the NXP MC33164.

Route the analog VREFH/VREFL traces as a dedicated analog ground island and keep digital switching currents away from the ADC reference. Use a ground pour on the top layer stitched with multiple vias to the inner ground plane. Keep the XTAL/EXTAL traces short and shielded by grounded copper to reduce oscillator jitter, which directly impacts ADC accuracy and CAN bit-timing precision.

Do not leave the RESET pin floating - tie it through a 10 kohm pull-up to VDD and a 100 nF capacitor to ground to form a manual reset circuit. The BKGD pin must remain accessible for BDM programming; do not route it through a complex mux without a bypass option. When migrating from the LC to the AM (AEC-Q100) variant, verify that firmware boot timing is compatible because automotive-grade silicon is tested across wider temperature and voltage corners.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per distributor listings. The LC suffix designates industrial temperature grade, not AEC-Q100; for AEC-Q100 use the AM suffix variant (e.g. MC9S08DV16AMLC). Lead-free reflow profile compatible with standard JEDEC J-STD-020.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S08DV16CLC MC9S08DV16AMLC MC9S08DV32CLC MC9S08DV60CLC MC9S08AW32CPUE S08 core CISC architecture microcontroller MCU 8-bit microcontroller LQFP-32 LQFP package family surface mount Flash memory RAM CAN 2.0 CAN bus CANopen LINbus SCI SPI I2C 12-bit ADC PWM watchdog timer WDT low-voltage detect LVD power-on reset POR Background Debug Mode BDM AEC-Q100 RoHS REACH J-STD-020 TJA1040 TJA1057 industrial temperature grade automotive body electronics HVAC controller appliance mainboard sensor hub
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