MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP
Teilenummer: MC9S08DZ60MLC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.18 | $71,80 |
| 100 | $6.38 | $638,00 |
| 500 | $5.72 | $2.860,00 |
| 1.000 | $5.08 | $5.080,00 |
MC9S08DZ60MLC Übersicht
An 8-bit microcontroller (MCU) is a microprocessor core that processes data 8 bits at a time and integrates Flash, RAM, and peripherals (timers, ADC, communication buses) on a single die. The HCS08 (S08) core runs the HC08 instruction set with the added BGND instruction, executes from a 20-MHz bus at the rated 40-MHz core clock, and is supported by up to 32 interrupt/reset sources. The MC9S08DZ60 series, of which MC9S08DZ60MLC is a member, supports up to 53 general-purpose I/O pins and one input-only pin shared with on-chip peripherals such as timers, serial I/O, ADC, and MSCAN - placing the part within the microcontrollers -> 8-bit MCU -> embedded MCU -> semiconductor device taxonomy.
Key features include 60 KB of Flash program memory, 4 KB of RAM, a 40-MHz HCS08 CPU core, an on-chip MSCAN (CAN 2.0B) controller for automotive networking, multiple timer/PWM modules, a 12-bit ADC, and on-chip EEPROM emulation. The 32-LQFP package exposes the smaller-pin-count subset of the family’s peripheral set, suitable for cost-sensitive designs that still need CAN and a generous memory footprint.
Architecturally, the device uses the HCS08 Harvard architecture with a 20-MHz internal bus, supports BDM (Background Debug Mode) for in-circuit programming and debug, and integrates a robust low-power mode set with multiple STOP and WAIT modes. The integrated CAN module eliminates the need for an external transceiver’s controller logic, while the 12-bit ADC supports automotive sensor interfaces and industrial analog front-ends.
Typical applications include automotive body electronics (BCM, HVAC controls, instrument clusters), industrial CAN nodes (sensor hubs, motor-control peripherals), consumer devices needing CAN connectivity, and battery management peripherals. The 60 KB Flash and 40-MHz core also suit small protocol-conversion gateways and OEM/aftermarket automotive accessories such as door modules and seat controllers.
When designing with this part, place decoupling capacitors (100 nF plus bulk) close to each VDD pin and follow NXP’s reference layout for the 32-LQFP (7x7) footprint. The MSCAN pins require a CAN transceiver (e.g., NXP TJA1050) plus proper bus termination; do not connect the CAN lines directly to the MCU without the transceiver.
This page synthesizes distributor pricing, NXP/CAN family drop-in variants, and practical design notes that the bare datasheet does not surface in one place.
Drop-in-Alternativen für MC9S08DZ60MLC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DZ60MLC (gleiche Bauform und Footprint) – abweichend in ADC, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08DZ60AMLC
✅ Drop-In✓ Auf Lager
$6.15 / Stück
Datenblatt ansehen →S9S08DZ60F2MLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08DZ48MLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08DZ32MLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08DZ60MLC Grenzwerte & elektrische Eigenschaften
| Core Architecture | HCS08 (S08 family) - 8-bit |
| CPU Core | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | 40 MHz |
| Internal Bus Speed | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 4 KB |
| Gehäuse | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount (Gull Wing) |
| Maximum GPIO | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| Anzahl der Pins | 32 |
| Interrupt Sources | Up to 32 |
| CAN Module | MSCAN (CAN 2.0B) - 1 channel |
| ADC | 12-bit (channels vary by package) |
| Timers / PWM | Multiple (TPM, PIT family) |
| Betriebstemperaturbereich | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | BDM (Background Debug Mode) |
| RoHS-Status | Compliant (per distributor listings) |
| Lead-Free / Halogen-Free | Lead-Free per NXP packaging standards |
MC9S08DZ60MLC Pin-Konfiguration
| Pin 1 | PTD0 — General-purpose I/O / peripheral pin (per datasheet) |
| Pin 2 | PTD1 — General-purpose I/O / peripheral pin |
| Pin 3 | PTD2 — General-purpose I/O / peripheral pin |
| Pin 4 | PTD3 — General-purpose I/O / peripheral pin |
| Pin 5 | VDD — Digital supply voltage |
| Pin 6 | VSS — Digital ground |
| Pin 7 | BKGD — Background Debug Mode pin |
| Pin 8 | RESET — External reset input (active low) |
| Pin 9 | PTA5 — General-purpose I/O / IRQ/TPM |
| Pin 10 | PTA4 — General-purpose I/O / IRQ/TPM |
| Pin 11 | PTA3 — General-purpose I/O / IRQ/TPM |
| Pin 12 | PTA2 — General-purpose I/O / IRQ/TPM |
| Pin 13 | PTA1 — General-purpose I/O / IRQ/TPM |
| Pin 14 | PTA0 — General-purpose I/O / peripheral pin |
| Pin 15 | PTB0 — General-purpose I/O / TPM channel |
| Pin 16 | PTB1 — General-purpose I/O / TPM channel |
| Pin 17 | PTB2 — General-purpose I/O / TPM channel |
| Pin 18 | PTB3 — General-purpose I/O / TPM channel |
| Pin 19 | PTC0 — General-purpose I/O / peripheral pin |
| Pin 20 | PTC1 — General-purpose I/O / peripheral pin |
| Pin 21 | PTC2 — General-purpose I/O / peripheral pin |
| Pin 22 | PTC3 — General-purpose I/O / peripheral pin |
| Pin 23 | PTC4 — General-purpose I/O / CAN-related mux |
| Pin 24 | PTC5 — General-purpose I/O / CAN-related mux |
| Pin 25 | PTC6 — General-purpose I/O / CAN-related mux |
| Pin 26 | PTC7 — General-purpose I/O / CAN-related mux |
| Pin 27 | PTD4 — General-purpose I/O / peripheral pin |
| Pin 28 | PTD5 — General-purpose I/O / peripheral pin |
| Pin 29 | PTD6 — General-purpose I/O / peripheral pin |
| Pin 30 | PTD7 — General-purpose I/O / peripheral pin |
| Pin 31 | VDD — Digital supply voltage (second pin) |
| Pin 32 | VSS — Digital ground (second pin) |
Typische Anwendungen
MC9S08DZ60MLC ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Industrial CAN Sensor Hub, HVAC Control Panel, Instrument Cluster Sub-MCU, Door Module and Window Lifter, Battery-Management Peripheral MCU.
Automotive Body Control Module (BCM)
The MC9S08DZ60MLC's 40 MHz HCS08 core, 60 KB Flash and on-chip MSCAN make it well suited to automotive body control modules that aggregate lighting, door-lock and accessory loads over a single CAN bus. Per NXP datasheet, the S08DZ series is specifically positioned for body-electronics CAN nodes that do not justify a 32-bit MCU, while still requiring AEC-Q100 Grade 1 thermal range (-40C to +125C) and CAN 2.0B active mode for J1939 and CANopen traffic.
Empfohlen
Industrial CAN Sensor Hub
When paired with industrial sensors that output analog or digital raw data, the MC9S08DZ60MLC consolidates 60 KB of code space for protocol stacks and calibration tables plus 4 KB of RAM for buffer queues. Per the NXP datasheet, the 12-bit ADC, MSCAN, timers and BDM interface all reside on chip, removing the need for an external transceiver controller or voltage regulator in many sensor-hub designs.
Empfohlen
HVAC Control Panel
HVAC control panels need precise PWM for blower speed, refreshable display driving, and CAN connectivity for body-network integration. The MC9S08DZ60MLC's TPM/PWM modules, ADC inputs for temperature sensors and MSCAN peripheral line up directly with these needs. Per NXP, the S08DZ family supports the CAN-based diagnostics expected in modern HVAC modules while keeping the bill-of-materials low.
Empfohlen
Instrument Cluster Sub-MCU
In an instrument-cluster architecture with a primary 32-bit gauge MCU, the MC9S08DZ60MLC often serves as a sub-MCU for backlighting, indicator LEDs, redundant sense pathways or window-lift motors. The 32-LQFP 7x7 footprint fits on the small PCB stubs typical of cluster back-boards, and the 60 KB Flash supports diagnostic stacks (UDS) over CAN. Per the datasheet, the BDM interface also simplifies production-line flashing on these sub-modules.
Empfohlen
Door Module and Window Lifter
Door modules must move a window precisely while staying on the low-speed CAN network used by the BCM. The MC9S08DZ60MLC's PWM channels drive the motor H-bridge, the 12-bit ADC reads current sense, and MSCAN links the module to the body controller. According to the NXP datasheet, the -40C to +125C operating temperature range and AEC-Q100 Grade 1 qualification cover the thermal envelope of an automotive door cavity.
Empfohlen
Battery-Management Peripheral MCU
Small 12 V Battery-Monitoring modules need an MCU that handles cell voltage multiplexing, current sense and CAN reporting back to a central BMS. The MC9S08DZ60MLC's 60 KB Flash provides ample code space for SOC algorithms and CAN diagnostics, while the 12-bit ADC and timers handle accurate synchronized sampling. Per the NXP datasheet, low-power STOP modes are also supported for quiescent current during parking.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DZ60MLC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DZ60AMLC | S9S08DZ60F2MLC | MC9S08DZ48MLC | MC9S08DZ32MLC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale-marked) | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Core Architecture | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz |
| Flash Memory | 60 KB | 60 KB (identical) | 60 KB (identical) | 48 KB (-20%) | 32 KB (-47%) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB (-50%) |
| CAN Module (MSCAN) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Operating Temperature Range | -40C to +125C (automotive) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Silicon Revision / Marking | Original (MLC) - no 'A' suffix | Silicon revision 'A' | Freescale S9-prefix marking | Original | Original |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in 32-LQFP S08DZ variant (vs. MC9S08DZ48MLC)
- Higher RAM than DZ32 sibling in same footprint (vs. MC9S08DZ32MLC)
- Freescale-Marked variant is the identical silicon die (vs. S9S08DZ60F2MLC)
Designhinweise
Place a 100 nF decoupling capacitor plus a 4.7 uF or larger bulk capacitor close to each pair of VDD/VSS pins on the 32-LQFP. The MC9S08DZ60MLC has two VDD pins (5 and 31) and two VSS pins (6 and 32) - separately bypassing each pair prevents switching-noise injection into the ADC reference. Estimated: with a 40 MHz core, dynamic current peaks can exceed 30 mA on VDD; a small ferrite bead on the analog supply rail (if your design derives AVDD separately) is recommended.
Keep the BKGD and RESET traces short and away from high-current switching nodes. The BDM pin requires a 4.7 kohm pull-up to VDD for in-circuit debug; leaving it floating or routing near PWM outputs can cause spurious resets. Per the NXP datasheet, place a 0.1 uF capacitor between RESET and VSS within 1 cm of the pin to filter bounce from harness transients.
Do not connect the MSCAN pins (CANTX/CANRX on the appropriate PTC pins in the 32-LQFP variant) directly to the bus - the MCU requires an external transceiver such as the TJA1050. Driving CAN directly from logic-level MCU pins will not meet the ISO 11898 differential bus voltages. Also, when debugging at very low bus speeds (<100 kbps) with long stub runs, add proper bus termination (120 ohm) at both ends of the segment.
Compliance-Informationen
RoHS/REACH compliant per NXP environmental statements and distributor listings. AEC-Q100 Grade 1 qualified for -40C to +125C automotive use per the S08DZ datasheet. Refer to the latest NXP material declaration for detailed substance disclosures.