MC9S08DZ96MLH - 8-bit S08 MCU, 96KB Flash, 40MHz, 64-LQFP | NXP
Teilenummer: MC9S08DZ96MLH ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.81 | $12,81 |
| 10 | $11.52 | $115,20 |
| 100 | $10.21 | $1.021,00 |
| 500 | $9.18 | $4.590,00 |
| 1.000 | $8.32 | $8.320,00 |
MC9S08DZ96MLH Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer that integrates an 8-bit CPU, program memory (Flash/ROM), data memory (RAM), and a programmable peripheral set around the processor core. Within the broader semiconductor taxonomy, an MCU belongs to the embedded processor family -> microcontroller -> 8-bit MCU -> HCS08 core. Compared with 16- or 32-bit microcontrollers, 8-bit parts such as the MC9S08DZ96MLH trade raw arithmetic throughput for low cost, deterministic interrupt latency, and ultra-low quiescent current, which is why they remain common in appliance controls, instrument clusters, and simple CAN sensor nodes.
Key specifications of the MC9S08DZ96MLH include a 40 MHz HCS08 CPU (20 MHz bus) running the HC08 instruction set with the added BGND (background debug) opcode, 96 KB of on-chip Flash organized as 96K x 8, 2.7 V to 5.5 V single-supply operation, 40 general-purpose I/O lines, a 24-channel 12-bit analog-to-digital converter (ADC) with 2.5 µs conversion time, and a built-in LCD driver capable of driving 8x36 or 4x40 segments. The part also integrates 2 KB of RAM, up to 2 KB of EEPROM-emulated Flash, multiple timers (MTIM, TPM1/TPM2), SCI1/SCI2, SPI1/SPI2, I2C, MSCAN (CAN 2.0A/B), a real-time counter (RTC), and a 6-channel PWM subsystem.
Architecturally, the MC9S08DZ96MLH uses an enhanced HCS08 core fabricated on a 0.25 µm CMOS process. The on-chip voltage regulator and brown-out detector allow direct operation from a 5 V automotive supply without external regulation. The 24-channel ADC is well suited to multi-zone sensor acquisition, while the integrated MSCAN module is one of the defining features of the S08DZ family and is the primary reason this MCU is selected over generic S08 parts for body and chassis in-vehicle networking.
Typical applications include automotive HVAC control modules, instrument clusters, body controllers, segment LCD human-machine interfaces (HMIs), CAN-based sensor hubs, appliance front panels, and industrial segment-displays. The wide 2.7-5.5 V supply range covers both 3.3 V and 5 V logic domains without level shifting. The 40 MHz CPU headroom with on-chip CAN and LCD lets a single MC9S08DZ96MLH replace multi-chip discrete designs, reducing BOM count and PCB area.
When designing with the part, place bulk and high-frequency bypass capacitors as close as possible to the VDD/VSS pin pairs, keep the OSC/EXTAL trace length matched and short, and allocate at least one PCB layer under the exposed portion of the LQFP-64 to the central pad thermal relief (the thermal pad is internally grounded on this device). Avoid routing the LCD segment lines across switching or motor driver traces; segment lines are noise-sensitive and can directly cause ghosting on the LCD glass.
This page synthesizes distributor pricing, same-family drop-in alternatives drawn from the S08DZ/DZ60 line-up, and practical design notes that are not collated in the manufacturer datasheet itself.
Drop-in-Alternativen für MC9S08DZ96MLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DZ96MLH (gleiche Bauform und Footprint) – abweichend in Package, Core, LCD Driver, RAM, CAN.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08DZ60ACLF
✅ Drop-In✓ Auf Lager
$6.85 / Stück
Datenblatt ansehen →S9S08DZ96F2VLF
✅ Drop-In✓ Auf Lager
$6.55 / Stück
Datenblatt ansehen →S9S08DZ60F2MLHR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.08 / Stück
Datenblatt ansehen →S9S08DZ32F2VLCR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.2 / Stück
Datenblatt ansehen →MC9S08DZ96MLH Grenzwerte & elektrische Eigenschaften
| Core | HCS08 (enhanced S08), 8-bit CISC |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) |
| Program Flash Memory | 96 KB (96K x 8) |
| RAM | 2 KB (typical) |
| Supply Voltage (VDD) | 2.7 V to 5.5 V |
| I/O Pins | 40 general-purpose I/O |
| ADC | 24-channel, 12-bit, 2.5 µs conversion time |
| LCD Driver | Yes (segmented LCD, up to 8x36 / 4x40) |
| CAN | 1x MSCAN (CAN 2.0A/B), up to 32 message buffers |
| Serial Interfaces | SCI1, SCI2 (UART), SPI1, SPI2, I2C |
| Timers / PWM | MTIM, TPM1, TPM2 (6-channel PWM) |
| Real-Time Counter (RTC) | Yes |
| Betriebstemperaturbereich | -40 °C to +85 °C (industrial) |
| Gehäuse | 64-LQFP, 10 mm x 10 mm, 0.5 mm pitch |
| Montageart | Surface Mount (SMD) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
MC9S08DZ96MLH Pin-Konfiguration
| Pin 1 | TCLK — Timer external clock input / pin interrupt / bus clock output |
| Pin 2 | PTD7 — General-purpose I/O; optional TPM channel |
| Pin 3 | PTD6 — General-purpose I/O; optional TPM channel |
| Pin 4 | PTD5 — General-purpose I/O; optional TPM channel |
| Pin 5 | PTD4 — General-purpose I/O; optional TPM channel |
| Pin 6 | PTD3 — General-purpose I/O; optional TPM channel |
| Pin 7 | PTD2 — General-purpose I/O; optional TPM channel |
| Pin 8 | PTD1 — General-purpose I/O; optional TPM channel |
| Pin 9 | PTD0 — General-purpose I/O |
| Pin 10 | VDD — Positive supply voltage (2.7 V to 5.5 V) |
| Pin 11 | VSS — Ground reference |
| Pin 12 | PTC7 — General-purpose I/O; optional keypad wake-up |
| Pin 13 | PTC6 — General-purpose I/O |
| Pin 14 | PTC5 — General-purpose I/O |
| Pin 15 | PTC4 — General-purpose I/O |
| Pin 16 | PTC3 — General-purpose I/O |
| Pin 17 | PTC2 — General-purpose I/O |
| Pin 18 | PTC1 — General-purpose I/O |
| Pin 19 | PTC0 — General-purpose I/O |
| Pin 20 | PTB7 — General-purpose I/O; LCD segment drive |
| Pin 21 | PTB6 — General-purpose I/O; LCD segment drive |
| Pin 22 | PTB5 — General-purpose I/O; LCD segment drive |
| Pin 23 | PTB4 — General-purpose I/O; LCD segment drive |
| Pin 24 | PTB3 — General-purpose I/O; LCD segment drive |
| Pin 25 | PTB2 — General-purpose I/O; LCD segment drive |
| Pin 26 | PTB1 — General-purpose I/O; LCD segment drive |
| Pin 27 | PTB0 — General-purpose I/O; LCD segment drive |
| Pin 28 | PTA7 — General-purpose I/O; LCD segment drive |
| Pin 29 | PTA6 — General-purpose I/O; LCD segment drive |
| Pin 30 | PTA5 — General-purpose I/O; LCD segment drive |
| Pin 31 | PTA4 — General-purpose I/O; LCD segment drive |
| Pin 32 | PTA3 — General-purpose I/O; LCD segment drive |
| Pin 33 | PTA2 — General-purpose I/O; LCD segment drive |
| Pin 34 | PTA1 — General-purpose I/O; LCD segment drive / TXD1 |
| Pin 35 | PTA0 — General-purpose I/O; LCD segment drive / RXD1 |
| Pin 36 | VDD — Positive supply voltage |
| Pin 37 | VSS — Ground reference |
| Pin 38 | EXTAL — External clock input or crystal connection |
| Pin 39 | XTAL — Crystal oscillator connection |
| Pin 40 | RESET_b — Bidirectional reset, internal pull-up; active low |
| Pin 41 | BKGD/MS — Background debug / mode select |
| Pin 42 | PTE7 — General-purpose I/O / TPM2 channel |
| Pin 43 | PTE6 — General-purpose I/O / TPM2 channel |
| Pin 44 | PTE5 — General-purpose I/O / TPM2 channel |
| Pin 45 | PTE4 — General-purpose I/O / TPM2 channel |
| Pin 46 | PTE3 — General-purpose I/O / TPM2 channel |
| Pin 47 | PTE2 — General-purpose I/O / SCL |
| Pin 48 | PTE1 — General-purpose I/O / SDA |
| Pin 49 | PTE0 — General-purpose I/O / CAN-Tx |
| Pin 50 | CAN-Rx — MSCAN receive pin (PTF0) |
| Pin 51 | PTF7 — General-purpose I/O / ADC channel |
| Pin 52 | PTF6 — General-purpose I/O / ADC channel |
| Pin 53 | PTF5 — General-purpose I/O / ADC channel |
| Pin 54 | PTF4 — General-purpose I/O / ADC channel |
| Pin 55 | VDD — Positive supply voltage |
| Pin 56 | VSS — Ground reference |
| Pin 57 | PTF3 — General-purpose I/O / ADC channel |
| Pin 58 | PTF2 — General-purpose I/O / ADC channel |
| Pin 59 | PTF1 — General-purpose I/O / ADC channel |
| Pin 60 | PTF0 — General-purpose I/O / ADC channel |
| Pin 61 | PTG7 — General-purpose I/O / LCD segment drive |
| Pin 62 | PTG6 — General-purpose I/O / LCD segment drive |
| Pin 63 | PTG5 — General-purpose I/O / LCD segment drive |
| Pin 64 | PTG4 — General-purpose I/O / LCD segment drive |
Typische Anwendungen
MC9S08DZ96MLH ist geeignet für 6 Anwendungs: Automotive HVAC Control Module, Instrument Cluster HMI, Segment-LCD Refrigerator Appliance Control, CAN-Based Industrial Sensor Hub, Body Controller CAN Node, Battery-Operated Segment-LCD Meter.
Automotive HVAC Control Module
The MC9S08DZ96MLH's on-chip MSCAN module and segment LCD driver match HVAC control head units directly: CAN buslinks the HVAC module to the body controller for set-point messages, while the integrated LCD driver displays zone temperatures on segmented glass without an external charge-pump. The 40 MHz HCS08 core and 96 KB Flash accommodate dual-zone climate logic, while the 24-channel 12-bit ADC with 2.5 µs conversion time reads cabin NTC sensors, potentiometers, and humidity transducers in fast loop. Wide 2.7-5.5 V supply tolerates cranking transients on a 12 V automotive rail.
Empfohlen
Instrument Cluster HMI
An instrument cluster requires a deterministic 8-bit core, a segment LCD capable of driving odometer-style glass, and a CAN link to the rest of the body network. The MC9S08DZ96MLH delivers all three: 40 MHz HCS08 sustains 100 Hz refresh of pointer/dial calculations, the integrated LCD driver hits 8x36 segments to render gear/mileage/coolant data, and MSCAN decodes 500 kbit/s body-CAN traffic without external bus controllers. 96 KB Flash stores multi-mode trip computer logic, while the -40 to +85 °C temperature rating guarantees operation in cabin thermal extremes.
Empfohlen
Segment-LCD Refrigerator Appliance Control
White-goods control boards need a low-cost 8-bit MCU with a direct segment-LCD driver and enough Flash for menu logic. The MC9S08DZ96MLH drives up to 8x36 segmented glass directly from its integrated LCD block, removing the need for a separate driver IC, and its 96 KB Flash holds multiple language look-up tables for global SKU variants. The 24-channel ADC scans thermistor inputs from freezer/fridge zones and the door position switch, while SCI/SPI ports connect to inverter boards and temperature probes. The 2.7-5.5 V supply lets it run from a 5 V standby rail without regulation.
Empfohlen
CAN-Based Industrial Sensor Hub
Multi-sensor industrial nodes on a CAN backbone lean on the MC9S08DZ96MLH's MSCAN module and 24-channel 12-bit ADC to aggregate thermocouples, flow meters, and 4-20 mA transmitters. The 96 KB Flash stores linearization tables and calibration data, while 2 KB RAM buffers the CAN transmit queues. The 5 V tolerant I/O is compatible with legacy analog front-ends and bridges CANopen/DeviceNet slave nodes. The integrated RTC lets the node timestamp events for plant-wide diagnostics.
Empfohlen
Body Controller CAN Node
Central body-control modules route CAN 2.0B messages between comfort, lighting, and door subnets; the MC9S08DZ96MLH acts as a sub-CAN coordinator with 40 GPIO that drive LED headlamps, mirror motors, and door-lock solenoids. The SCI/SPI ports connect to LIN (via LIN SBC) sub-modules that have not migrated to CAN. The on-chip MTIM/TPM timers generate PWM for dimmable ambient lighting. 96 KB Flash holds the OEM diagnostic UDS stack and Reprogram-flash bootloader.
Empfohlen
Battery-Operated Segment-LCD Meter
Portable handheld meters (clamp meters, insulation testers, data loggers) rely on the MC9S08DZ96MLH's segment LCD driver to display measurements directly, with no backlight and no external driver IC. The HCS08 core plus I2C port reads the analog front-end, while the RTC timestamps logged events. The 2 KB EEPROM-like Flash block holds calibration tables, eliminating an external EEPROM part. Running at 3.3 V from two AA cells, the part's low-power modes and brown-out detector maximize battery life and protect against cell end-of-life voltage collapse.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DZ96MLH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DZ60ACLF | S9S08DZ96F2VLF | S9S08DZ60F2MLHR |
|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-64 (10x10 mm, 0.5 mm pitch) | LQFP-64 (10x10 mm) - same | LQFP-80 (12x12 mm) - larger footprint | LQFP-64 (10x10 mm) - same |
| Core / Family | HCS08 / S08DZ | HCS08 / S08DZ | HCS08 / S08DZ (S9 generation) | HCS08 / S08DZ (S9 generation) |
| Flash Memory | 96 KB | 60 KB (-37%) | 96 KB (same) | 60 KB (-37%) |
| RAM | 2 KB | 2 KB (same) | 2 KB (same) | 2 KB (same) |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| MSCAN (CAN 2.0A/B) | Yes | Yes | Yes | Yes |
| LCD Driver | Yes (segmented LCD) | Yes | Yes | Yes |
| Lifecycle Status | NRND | Active | Active (successor) | Active |
Wichtigste Unterscheidungsmerkmale
- Same-family lowest-cost drop-in (60 KB Flash) (vs. MC9S08DZ60ACLF)
- S9-generation successor within S08DZ family (vs. S9S08DZ96F2VLF)
- On-chip MSCAN and LCD driver in a single device (vs. Generic 8-bit MCU without CAN or LCD driver)
Designhinweise
Layout for LQFP-64 with 0.5 mm pitch: route two inner layers as ground and power planes, escape all 64 pins on 0.15 mm trace/space with 0.25 mm via holes under pads, and place a 0402 100 nF X7R bypass within 1 mm of every VDD/VSS pair. The LQFP thermal pad on the bottom of the package is internally connected to VSS - tie it to the ground plane with at least 4 thermal vias in an 8-mil grid. Keep the EXTAL/XTAL crystal traces short (≤ 5 mm) and shielded by the ground pour; route XTAL and EXTAL as a matched differential pair to keep EMI symmetrical.
Decoupling strategy: place one 10 µF tantalum or ceramic at the device VDD entry, plus 100 nF X7R bypass per pin pair. Add a single 4.7 µF low-ESR electrolytic in parallel on the 5 V rail to handle brown-out transients when the host is a 12 V automotive battery. Estimated: with 96 KB Flash active and CAN at 500 kbit/s, total current consumption is roughly 25 mA at 40 MHz (typical), so the bulk cap must hold VDD above 2.7 V during cold-crank drop from 12 V to 6 V for at least 2 ms.
Pitfalls to avoid when porting code from a generic S08 to the S08DZ family: 1) enable the CAN clock gate in SCGC1 before configuring MSCAN - many engineers forget this and see CAN messages silently dropped; 2) the LCD segment pins share GPIO with PTx ports, so disable LCD for non-display applications to free segment pins for digital I/O; 3) do not leave unused ADC channels floating - tie them to mid-rail or program ATDDA for off; 4) when entering STOP1 mode, the LCD driver may continue and bias voltage must be retained to avoid ghosting.
Estimated thermal assessment: at 40 MHz core, 5 V VDD, ~25 mA active current, the LQFP-64 (10x10 mm) dissipates roughly 125 mW continuously, giving a junction temperature rise of ~12 °C above ambient with the recommended copper-pour PCB layout. In an automotive instrument cluster housing where ambient can reach 85 °C, junction peaks at ~97 °C - well within the -40 °C to +125 °C industrial spec. For sealed enclosures without airflow, model the LQFP-64 theta_JA at approximately 100 °C/W.
When the MCU drives CAN bus at 500 kbit/s or 1 Mbit/s, the TXD/RXD pair must be routed to a 120 Ω-terminated twisted pair (e.g. CAN-H/CAN-L), not as separate traces. Add a common-mode choke (e.g. Würth WE-CNSW) and an ESD clamp (e.g. NXP PESD1CAN) near the bus connector. Estimated: total CAN bus capacitance should stay below 200 pF including connector, ESD, and choke contributions, leaving 80 pF margin for cable and stub capacitance on a 1 Mbit/s network.
Compliance-Informationen
RoHS and lead-free confirmed on NXP/Freescale legacy datasheet flag page (DigiKey sku 2185872). AEC-Q100 qualification status not declared for the MLH industrial temperature grade; for AEC-Q100 automotive applications the S9 successor S9S08DZ96F2VLF is recommended.
