MC9S08GT60CFDE - 8-Bit 40MHz S08 MCU 60KB Flash | NXP
Teilenummer: MC9S08GT60CFDE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.83 | $14,83 |
| 10 | $13.21 | $132,10 |
| 100 | $11.04 | $1.104,00 |
| 500 | $9.62 | $4.810,00 |
| 1.000 | $8.75 | $8.750,00 |
MC9S08GT60CFDE Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and I/O peripherals on a single die. The S08 family uses a CISC (Complex Instruction Set Computer) architecture with the HCS08 core, succeeding the legacy HC08 family. Within the broader hierarchy, the S08 sits under: microcontroller -> embedded processor -> semiconductor device. Compared with 32-bit Cortex-M devices, S08 microcontrollers trade raw throughput for cost, deterministic interrupt latency, and ultra-low static power consumption, making them preferred in cost-sensitive, latency-bound, or battery-aware designs.
Key features of the MC9S08GT60CFDE include 60KB on-chip Flash with in-application reprogrammability, 4KB SRAM, an internal clock generator with trimming, multiple timer/PWM modules, an analog-friendly package with an exposed thermal pad, and built-in safety peripherals (LVD, POR, COP watchdog). The 48-pin QFN-EP package exposes enough GPIO (39 pins) for typical human-interface, motor-control, and sensor-hub designs. Industrial-grade operating temperature range (-40C to +85C minimum) makes the part suitable for factory and automotive cabin environments.
Technically, the HCS08 core executes most instructions in 1-2 bus cycles and supports a BDM (Background Debug Mode) interface for in-circuit programming and debug. The on-chip Flash uses an embedded EEPROM-style array with security lock bits to protect intellectual property. The MC9S08GT60CFDE differs from the GT32 variant in memory density (60KB Flash vs 32KB Flash) and from GT16 in scaling — all share the S08 core and the 48-QFN-EP package, enabling family-up firmware reuse.
Typical applications include industrial motor control (small BLDC, stepper drivers), appliance and white-goods human-interface modules, automotive body-electronics accessories, sensor-hub front-ends, and consumer remote controls. The combination of PWM, SCI/SPI, and I2C makes it well-suited as a bridge controller between a sensor network and a higher-level host. In low-power designs, the on-chip peripherals allow the CPU to remain in wait/stop modes while timers and interrupts handle event-driven wakeups.
When designing with the MC9S08GT60CFDE, ensure the exposed thermal pad is soldered to a copper pour of at least 1 square inch to keep junction temperature in spec for continuous high-CPU-load scenarios. Designers should also evaluate the GT32CFDE variant (32KB Flash) for cost reduction if application code is small enough — both share the same 48-QFN-EP footprint, easing PCB reuse.
This page synthesizes parametric data from the NXP/Freescale datasheet family, distributor pricing as of 2026-10-18, and a drop-in alternatives matrix drawn from the NXP S08 family — content not aggregated in any single distributor or manufacturer page.
Drop-in-Alternativen für MC9S08GT60CFDE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08GT60CFDE (gleiche Bauform und Footprint) – abweichend in Package, RAM Size, Core Processor, Flash Memory, Lifecycle Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08GT32CFDE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08GT16CFDE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08GT60ACFDE
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08GT60ACFDER
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08GT8CFDE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08GT60CFDE Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08) CISC |
| Core Size | 8-Bit |
| CPU Speed | 40 MHz |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Pins | 39 |
| Gehäuse | 48-VFQFN Exposed Pad (HVQCCN, 7x7 mm) |
| Versorgungsspannung | 2.5 V / 3.3 V (typical dual-rail) |
| Connectivity | I2C, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Program Memory Type | FLASH |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | Obsolete (per distributor records) |
MC9S08GT60CFDE 48-vfqfn exposed pad (hvqccn, 7x7 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S08GT60CFDE (48-vfqfn exposed pad (hvqccn, 7x7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08GT60CFDE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08GT60CFDE ist geeignet für 6 Anwendungs: Industrial Motor Control, Appliance Human-Interface Modules, Automotive Body Electronics Accessories, Sensor Hub Front-Ends, Consumer Remote Controls, Industrial Lighting Controllers.
Industrial Motor Control
The MC9S08GT60CFDE fits small industrial motor control (BLDC, stepper, brushed DC) thanks to its 40MHz S08 core, built-in PWM modules, and 39 GPIO. Its on-chip PWM timers can drive complementary FET pairs at 20kHz+ switching with dead-time insertion controlled in firmware, while SCI and SPI connect to higher-level controllers or driver boards. Compared with a discrete analog controller, the MC9S08GT60CFDE adds programmable commutation curves and in-field firmware updates via its Flash array, simplifying end-of-line tuning. For sub-100W motors where a Cortex-M0 would be overkill, this S08 part hits the right cost/deterministic-latency balance.
Empfohlen
Appliance Human-Interface Modules
The MC9S08GT60CFDE serves well in washing-machine, dishwasher, and oven user-interface modules that demand reliable keypad scanning, LED/PWM dimming, and serial communication to a main controller. The 60KB Flash comfortably holds UI state machines, fault logs, and localized strings, while 4KB RAM supports display buffers and key-debounce logic. SCI and I2C connections link to sensor boards and main MCUs without extra glue logic. The exposed thermal pad aids heat dissipation under continuous LED-PWM operation in wall-oven or cooktop displays.
Empfohlen
Automotive Body Electronics Accessories
Inside the vehicle cabin — for non-safety accessories like seat heaters, mirror controllers, or auxiliary lighting — the MC9S08GT60CFDE delivers industrial-grade performance that often meets cabin-temperature requirements. Its PWM, ADC-friendly GPIO, and SPI connectivity interface with motor-driver and LED-driver ICs; SCI links to body-control modules. The 48-QFN-EP package has a small enough footprint to fit compact in-door or mirror-mounted assemblies. For safety-critical loads, migrate to an AEC-Q100-qualified variant such as MC9S08GT60ACFDE in the same footprint.
Empfohlen
Sensor Hub Front-Ends
Bridged between analog sensors and a higher-level processor, the MC9S08GT60CFDE handles I2C/SPI sensor polling, ADC sampling, and pre-processing before passing cleaned data upstream. Its 40MHz core runs lightweight sensor-fusion loops (low-pass filters, calibration tables) within the 60KB Flash budget. The integrated PWM/LVD/WDT peripherals supervise power rails and watchdog health without external ICs. Compared with a bare analog front-end, this S08 design lets engineers ship firmware updates over CAN or SCI for remote diagnostics.
Empfohlen
Consumer Remote Controls
The MC9S08GT60CFDE powers cost-sensitive IR/RF remote controls with low static power consumption, wake-up timers, and 39 GPIO for key-scan matrices and LED indicators. Its small 48-QFN-EP footprint fits slim handheld enclosures, while PWM timers manage LED backlights and IR modulation at 36-40kHz carrier frequencies. The 60KB Flash accommodates multiple protocol tables (NEC, RC5, RC6) and OEM customization. The S08's deterministic interrupt latency ensures robust button-scan debouncing on AAA-battery power for over a year.
Empfohlen
Industrial Lighting Controllers
LED drivers, signage dimmers, and small-form-factor lighting controllers use the MC9S08GT60CFDE for PWM-driven constant-current regulation across multiple channels. The S08's PWM modules support 8-bit and 16-bit resolutions suitable for commercial-lighting fade curves and RGB color mixing. I2C links to digital potentiometers and temperature sensors; SCI delivers DMX-style or proprietary lighting-protocol traffic. The exposed thermal pad maintains junction temperature when driving high-current LED strings from a small regulator headroom.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08GT60CFDE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08GT32CFDE | MC9S08GT16CFDE | MC9S08GT60ACFDE | MC9S08GT60ACFDER | MC9S08GT8CFDE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same |
| Flash Memory | 60 KB | 32 KB | 16 KB | 60 KB | 60 KB | 8 KB |
| RAM Size | 4 KB | 2 KB | 1 KB | 4 KB | 4 KB | 0.5 KB |
| CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Number of I/O Pins | 39 | 39 | 39 | 39 | 39 | 39 |
| Temperature Grade | Industrial | Industrial | Industrial | Automotive | Automotive | Industrial |
| Lifecycle Status | Obsolete | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Highest-density Flash in the S08GT 48-QFN-EP family (vs. MC9S08GT32CFDE)
- Industrial temperature grade (vs. MC9S08GT60ACFDE)
- Established 8-bit S08 core maturity (vs. Cortex-M0+ based MCUs)
Designhinweise
The 48-QFN-EP package relies on the exposed thermal pad soldered to the PCB ground plane for heat dissipation. Estimated: at 40MHz full-load CPU activity (~25mA core current at 2.5V), the device dissipates roughly 62mW; the VQFN-EP typically offers theta_JA of ~30-40 C/W on a 1-square-inch copper pour. Always connect the e-pad to a copper pour of at least 1 square inch to keep junction temperature inside the industrial-grade envelope.
Place 100nF decoupling capacitors as close as possible to each VDD pin and a single 4.7uF bulk capacitor within 10mm of the package. Route BDM (Background Debug Mode) signals (BKGD, RESET) to a programming header with no stub traces. Keep the exposed pad soldered to a continuous ground pour, stitching vias on a 0.5mm grid for thermal and ground integrity.
Do not assume all S08GT variants are interchangeable in firmware: the Flash/RAM boundaries differ (8/16/32/60 KB) and the interrupt-vector remap on cold-boot must match the variant's memory map. Also, the MC9S08GT60CFDE is marked obsolete per distributor records as of 2026-10-18; new designs should migrate to active S08 successors in the same 48-QFN-EP footprint to avoid supply-chain risk. Use only NXP-approved programming tools to keep Flash security-lock bits intact.
Compliance-Informationen
RoHS compliance inferred from NXP product family declarations. Halogen-free status not explicitly stated in provided data — see NXP datasheet for confirmation. AEC-Q100 not applicable for the C-suffix industrial variant; choose A-suffix variant for automotive.
