MCF5212LCVM66J - 32-bit ColdFire V2 MCU 256KB Flash 81-MAPBGA | NXP
Teilenummer: MCF5212LCVM66J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.42 | $19,42 |
| 10 | $17.85 | $178,50 |
| 100 | $14.91 | $1.491,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $9.88 | $9.880,00 |
MCF5212LCVM66J Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The ColdFire V2 core is a variable-length RISC architecture derived from the Motorola 68000 family; it sits inside the broader taxonomy of 32-bit microcontrollers > embedded processors > semiconductors. Microcontrollers like the MCF5212 belong to the embedded computing tier that executes real-time firmware and bridges analog/digital peripherals to higher-level processors or networks.
Key features include 256 KB of single-access flash with security and interleaved banking for near-zero-wait-state performance, an integrated 10/100 Ethernet MAC on selected family members, three independent UARTs with IrDA support, an I2C bus, a queued SPI, and a 4-channel eDMA controller. The part also includes a 4-channel 32-bit timers array, a 4-channel general-purpose timer, an 8-channel 12-bit ADC, and a real-time clock with separate power domain.
Architecturally, the ColdFire V2 core implements the ColdFire ISA with a hardware multiply-accumulate (MAC) block that accelerates DSP-style arithmetic. The flash controller supports dual-bank operation for in-application firmware updates, and the integrated voltage regulator supports 3.3 V single-supply operation with on-chip decoupling guidance. The chip targets low standby power by gating unused peripheral clocks.
Typical applications include industrial control and Human-Machine Interface (HMI) panels, point-of-sale terminals, building automation controllers, networked sensor hubs, factory automation protocols, and portable medical data loggers. The 66 MHz core clock and MAC instructions make it suitable for control-loop tasks without an external DSP.
When designing with this device, pay close attention to power supply sequencing and decoupling on each VDD/VSS pair. Place four-layer PCB decoupling caps as close to the 81-pin MAPBGA balls as possible. Ensure firmware uses the dual-bank flash feature to enable fail-safe firmware updates.
This page synthesizes distributor pricing, coldfire family siblings, drop-in alternatives, and practical design notes not consolidated in any single datasheet source.
Drop-in-Alternativen für MCF5212LCVM66J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5212LCVM66J (gleiche Bauform und Footprint) – abweichend in DMA Channels, Supply Voltage, Mounting Type, Package, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5212LCVM66
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MCF5211LCVM66
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MCF5213LCVM66
✅ Drop-In✓ Auf Lager
$11.95 / Stück
Datenblatt ansehen →MCF52252AF80
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF52254AF80
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.65 / Stück
Datenblatt ansehen →MCF5212LCVM66J Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (32-bit) |
| CPU Core Frequency | 66 MHz |
| Program Memory | 256 KB Flash |
| Gehäuse | 81-MAPBGA (10x10 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Voltage | 3.3 V |
| UART | 3 |
| I2C | 1 |
| SPI | 1 (queued) |
| DMA Channels | 4 |
| Betriebstemperaturbereich | -40C to +85C (industrial) |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Program Memory Type | FLASH (256K x 8) |
| Connectivity | EBI/EMI, I2C, SPI, UART |
| Peripheral Type | DMA, PWM, WDT |
MCF5212LCVM66J 81-mapbga (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5212LCVM66J (81-mapbga (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5212LCVM66J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5212LCVM66J ist geeignet für 6 Anwendungs: Industrial Control HMI Panels, Point-of-Sale Terminals, Building Automation Controllers, Networked Sensor Hubs, Factory Automation Protocols, Portable Medical Data Loggers.
Industrial Control HMI Panels
The NXP MCF5212LCVM66J fits industrial HMI panels because its 66 MHz ColdFire V2 core and 256 KB flash deliver responsive display refresh and stable firmware execution in -40C to +85C environments. The chip's three UARTs (often driven as RS-232/RS-485 ports) and 8-channel 12-bit ADC make it straightforward to integrate touch controllers, keypads, and analog front-ends without an external ADC. Compared with a discrete MCU + ASIC stack, the integrated flash, RAM, and DMA accelerate panel design and shrink PCB area. Place decoupling within 5 mm of each VDD/VSS ball and use a 4-layer PCB for thermal dissipation under continuous backlight operation.
Empfohlen
Point-of-Sale Terminals
The MCF5212LCVM66J suits point-of-sale terminals because its 256 KB flash and 32 KB-equivalent SRAM comfortably hold firmware for barcode scanning, magnetic-stripe readers, and receipt printer queues. The 3 UARTs drive cash-drawer, terminal, and printer channels concurrently with low DMA overhead. ColdFire V2's eMAC block accelerates real-time encryption tasks (AES/DES seeds) needed for PCI-compliant transaction flows. In retail deployments, the wide 3.0 V to 3.6 V supply tolerance tolerates noisy 3.3 V adapter rails. Add external ESD protection (USB and serial lines) since the chip's ESD rating is typical for industrial-grade ICs.
Empfohlen
Building Automation Controllers
The MCF5212LCVM66J is well-suited for HVAC, lighting, and access-control controllers in commercial buildings. Its eMAC (enhanced multiply-accumulate) handles proportional-integral control loops for damper and valve positioning without burdening the main CPU. The I2C and SPI peripherals connect to environmental sensors (temperature, humidity, CO2) and to backplane keypad/display modules. With operating temperatures rated -40C to +85C, the part is at home in electrical closets and rooftop units. Stack an external Ethernet PHY with the MCF5213 variant for BACnet/IP or Modbus TCP gateways.
Empfohlen
Networked Sensor Hubs
For distributed sensor hubs aggregating multiple analog/digital inputs over RS-485, the MCF5212LCVM66J provides enough MIPS to run protocol stacks at 115200 baud over a single UART while polling an 8-channel 12-bit ADC at hundreds of samples per second. The 4-channel DMA offloads repetitive data movement from the core, preserving CPU bandwidth for application logic. ColdFire V2's deterministic interrupt latency ensures sensor-event timeouts stay within industrial specifications. Use the dual-bank flash feature to enable fail-safe over-the-air firmware updates.
Empfohlen
Factory Automation Protocols
The MCF5212LCVM66J's deterministic ColdFire V2 core and 66 MHz clock make it a fit for industrial protocol nodes running Modbus RTU, DeviceNet, or CANopen bridges. Three UARTs and the I2C bus concurrently host protocol stacks and configuration channels. The eMAC block accelerates CRC and Modbus checksum arithmetic in hardware. Pin-bridging firmware updates from a removable serial flash chip are reliable because of the dual-bank flash architecture. Note: For designs requiring CAN bus directly, an external CAN controller IC is needed since the MCF5212 variant does not integrate CAN.
Empfohlen
Portable Medical Data Loggers
The MCF5212LCVM66J serves in portable medical devices because its low-power design and wide operating range support battery-powered data acquisition across -40C to +85C. The 12-bit ADC captures biosensor signals with sufficient resolution for pulse-oximetry, respiration, and temperature logging. Firmware-update safety is enhanced by the dual-bank flash feature, which prevents bricking during field updates - a regulatory requirement for medical devices. The compact 81-MAPBGA 10x10 mm package helps shrink portable housings while keeping reliable solder joints under thermal cycling.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5212LCVM66J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5212LCVM66 | MCF5211LCVM66 | MCF5213LCVM66 | MCF52252AF80 |
|---|---|---|---|---|---|
| Package | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit |
| CPU Core Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 80 MHz |
| Ethernet MAC | No | No | No | Yes (10/100) | Yes (10/100) |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| UART Count | 3 | 3 | 3 | 3 | 3 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Suffix-free alternative with identical die (vs. MCF5212LCVM66)
- Higher-memory drop-in upgrade within same package (vs. MCF52252AF80)
- Without Ethernet MAC versus MCF5213LCVM66 (vs. MCF5213LCVM66)
Designhinweise
Estimated: The 81-MAPBGA 10x10 mm fine-pitch BGA requires a 4-layer PCB with microvia HDI construction for fan-out routing. Place 100 nF decoupling capacitors within 5 mm of each VDD/VSS ball pair, with a bulk 10 uF ceramic cap on each 3.3 V rail. Keep the BGA thermal pad connected to a continuous ground pour for heat dissipation during continuous full-core operation at 66 MHz.
Apply 3.3 V power to the MCF5212LCVM66J via a low-dropout regulator with at least 200 mA headroom; the part can draw 80-120 mA peak during flash programming. Add a 100 uF bulk electrolytic on the board input to absorb inrush from POR events. Use sequenced power-down to prevent in-application flash corruption; the dual-bank flash feature supports fail-safe firmware updates if the firmware adheres to the bank-swap procedure documented in the NXP reference manual.
Do not assume RAM size without checking the MCF5212/5213 family datasheet ordering table - 256 KB flash versions typically pair with 32 KB SRAM, but exact density varies by mask set. Never write to flash while it is also being read by user code in the same bank - use the dual-bank feature to avoid code execution stalls. Always verify the JTAG connector pinout against the NXP reference (14-pin 0.1" dual-row) before fabricating prototype boards; legacy BDM interfaces are also supported but require the correct cable configuration.
Compliance-Informationen
RoHS compliance confirmed via NXP and DigiKey product pages. AEC-Q100 qualification is not stated for this part - it is intended for industrial-grade applications. Halogen-free status not stated in provided snippets; treat as unknown unless verified against NXP's materials declaration.