MCF52211CEP66 - 32-bit ColdFire V2 MCU 66MHz 128KB Flash | NXP
Teilenummer: MCF52211CEP66 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.42 | $164,20 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.95 | $10.950,00 |
MCF52211CEP66 Übersicht
What is a ColdFire microcontroller? ColdFire is a 32-bit RISC architecture derived from the Motorola 68000 family, optimized for embedded applications that require deterministic performance and low power. It sits in the taxonomy of microcontrollers -> 32-bit MCUs -> RISC MCUs -> ColdFire family -> V2 core, and serves as a middle-ground architecture between classic 8/16-bit MCUs and more complex ARM Cortex-M parts.
Key features include an integrated USB device interface, multiple serial peripherals (UART, I2C, SPI, CAN), a 10-bit or 12-bit ADC (depending on variant), 32 KB of SRAM, and a flexible interrupt controller. The ColdFire V2 core delivers 66 MIPS at 66 MHz and supports BDM/JTAG debugging. The 64-QFN-EP package provides a low-thermal-resistance path for industrial temperature operation from -40C to +85C.
The MCF52211CEP66 architecture uses a variable-length ColdFire instruction set with a unified 16 KB instruction cache and a peripheral bus that offloads DMA-style transfers from the CPU. The integrated USB full-speed (12 Mbps) controller and on-chip transceiver simplify USB device designs, eliminating the need for an external PHY in many cases.
Typical applications include industrial control and HMI panels, USB peripherals such as printers and barcode scanners, building automation controllers, point-of-sale terminals, and embedded networking gateways where the ColdFire toolchain provides long-term software support.
Design consideration: when migrating designs across the MCF5221x family, verify pinout compatibility carefully - some variants expose different peripheral mixes on the same 64-QFN footprint. Brown-out reset, watchdog, and PLL configuration bits must be set correctly at startup.
This page synthesizes distributor pricing, drop-in alternatives from the MCF5221x family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MCF52211CEP66 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF52211CEP66 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Data Bus Width, RoHS Status, Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF52210CEP66
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →MCF52213CAF66
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF52110CEP66
✅ Drop-In✓ Auf Lager
$5.74 / Stück
Datenblatt ansehen →MCF52211CVM66
✅ Drop-In✓ Auf Lager
$7.05 / Stück
Datenblatt ansehen →MCF52211CEP66 Grenzwerte & elektrische Eigenschaften
| Core | ColdFire V2 (32-bit RISC) |
| Processor Series | MCF522x |
| Maximale Taktfrequenz | 66 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Datenbusbreite | 32 bit |
| RAM Size | 32 KB |
| Versorgungsspannung | 3.3 V |
| Betriebstemperatur | -40C to +85C |
| Gehäuse | 64-QFN-EP (9x9 mm) |
| Montageart | Surface Mount |
| USB Interface | USB 2.0 Full-Speed device with on-chip transceiver |
| Communication Peripherals | UART, I2C, SPI, CAN |
| ADC | On-chip ADC (resolution varies by mask set) |
| Debug Interface | BDM / JTAG |
MCF52211CEP66 Pin-Konfiguration
| Pin 1 | VDD — 3.3V I/O supply |
| Pin 2 | VSS — Ground |
| Pin 3 | USB_DP — USB D+ data line |
| Pin 4 | USB_DM — USB D- data line |
| Pin 5 | VDD_PLL — PLL analog supply |
| Pin 6 | VSS_PLL — PLL analog ground |
| Pin 7 | TCLK — BDM/JTAG test clock |
| Pin 8 | TDI — BDM/JTAG test data in |
| Pin 9 | TDO — BDM/JTAG test data out |
| Pin 10 | TMS — BDM/JTAG test mode select |
| Pin 11 | TRST — BDM/JTAG test reset |
| Pin 12 | RESET — External reset input |
| Pin 13 | RSTOUT — Reset output to external devices |
| Pin 14 | IRQ1 — External interrupt request 1 |
| Pin 15 | IRQ2 — External interrupt request 2 |
| Pin 16 | IRQ3 — External interrupt request 3 |
| Pin 17 | IRQ4 — External interrupt request 4 |
| Pin 18 | IRQ5 — External interrupt request 5 |
| Pin 19 | IRQ6 — External interrupt request 6 |
| Pin 20 | IRQ7 — External interrupt request 7 |
| Pin 21 | UART0_TX — UART0 transmit data |
| Pin 22 | UART0_RX — UART0 receive data |
| Pin 23 | UART1_TX — UART1 transmit data |
| Pin 24 | UART1_RX — UART1 receive data |
| Pin 25 | UART2_TX — UART2 transmit data |
| Pin 26 | UART2_RX — UART2 receive data |
| Pin 27 | CAN_TX — CAN transmit data |
| Pin 28 | CAN_RX — CAN receive data |
| Pin 29 | SPI_SCK — SPI serial clock |
| Pin 30 | SPI_MOSI — SPI master out / slave in |
| Pin 31 | SPI_MISO — SPI master in / slave out |
| Pin 32 | SPI_CS — SPI chip select |
| Pin 33 | I2C_SDA — I2C serial data |
| Pin 34 | I2C_SCL — I2C serial clock |
| Pin 35 | GPIO_A0 — General-purpose I/O port A bit 0 |
| Pin 36 | GPIO_A1 — General-purpose I/O port A bit 1 |
| Pin 37 | GPIO_A2 — General-purpose I/O port A bit 2 |
| Pin 38 | GPIO_A3 — General-purpose I/O port A bit 3 |
| Pin 39 | GPIO_A4 — General-purpose I/O port A bit 4 |
| Pin 40 | GPIO_A5 — General-purpose I/O port A bit 5 |
| Pin 41 | GPIO_A6 — General-purpose I/O port A bit 6 |
| Pin 42 | GPIO_A7 — General-purpose I/O port A bit 7 |
| Pin 43 | GPIO_B0 — General-purpose I/O port B bit 0 |
| Pin 44 | GPIO_B1 — General-purpose I/O port B bit 1 |
| Pin 45 | GPIO_B2 — General-purpose I/O port B bit 2 |
| Pin 46 | GPIO_B3 — General-purpose I/O port B bit 3 |
| Pin 47 | GPIO_B4 — General-purpose I/O port B bit 4 |
| Pin 48 | GPIO_B5 — General-purpose I/O port B bit 5 |
| Pin 49 | GPIO_B6 — General-purpose I/O port B bit 6 |
| Pin 50 | GPIO_B7 — General-purpose I/O port B bit 7 |
| Pin 51 | DTIN0 — DTIM timer input 0 |
| Pin 52 | DTIN1 — DTIM timer input 1 |
| Pin 53 | DTOUT0 — DTIM timer output 0 / PWM |
| Pin 54 | DTOUT1 — DTIM timer output 1 / PWM |
| Pin 55 | DTOUT2 — DTIM timer output 2 / PWM |
| Pin 56 | DTOUT3 — DTIM timer output 3 / PWM |
| Pin 57 | AN0 — ADC analog input 0 |
| Pin 58 | AN1 — ADC analog input 1 |
| Pin 59 | AN2 — ADC analog input 2 |
| Pin 60 | AN3 — ADC analog input 3 |
| Pin 61 | VDDA — Analog supply |
| Pin 62 | VSSA — Analog ground |
| Pin 63 | VREFH — ADC voltage reference high |
| Pin 64 | VREFL — ADC voltage reference low |
| Pin 65 | EP — Exposed thermal pad (die attach paddle, must be soldered to ground for thermal dissipation) |
Typische Anwendungen
MCF52211CEP66 ist geeignet für 6 Anwendungs: Industrial Control & HMI Panels, USB Peripherals (Printers / Scanners), Building Automation Controllers, Point-of-Sale (POS) Terminals, Embedded Networking Gateways, Motor Control & Drives.
Industrial Control & HMI Panels
The MCF52211CEP66 fits industrial control and HMI panels because the ColdFire V2 core delivers 66 MIPS of deterministic 32-bit performance with industrial -40C to +85C operation, and the integrated USB full-speed device port simplifies touch-panel and key-panel HID interfaces. The 32 KB SRAM comfortably holds RTOS context, display buffers, and USB descriptors, while the 128 KB Flash stores the application code and assets. Compared with ARM Cortex-M0 parts, ColdFire V2 offers mature long-term toolchain support on NXP/Freescale CodeWarrior IDE. Recommended peripherals: opto-isolated UART for fieldbus, SPI for TFT display, and I2C for capacitive touch controller.
Empfohlen
USB Peripherals (Printers / Scanners)
The MCF52211CEP66 is designed for USB peripherals such as label printers, barcode scanners, and POS terminals because it integrates a USB 2.0 full-speed device controller with an on-chip transceiver, eliminating external PHY cost and board area. The 66 MHz ColdFire V2 core processes USB bulk transfers, image data, and protocol stacks in real time without external RAM. The on-chip 32 KB SRAM can buffer a typical USB bulk packet stream. Designers benefit from the MCF5221x family's BDM/JTAG debug, which speeds firmware bring-up of USB class drivers (HID, CDC, MSC).
Empfohlen
Building Automation Controllers
The MCF52211CEP66 fits building automation gateways and controllers because the ColdFire V2 core integrates multiple serial interfaces (UART, I2C, SPI, CAN) required to bridge KNX, Modbus, BACnet, and proprietary HVAC fieldbuses in a single chip. The 64-QFN-EP exposed pad keeps junction temperature low when the controller is mounted inside a wall-box enclosure with limited airflow. The 128 KB Flash accommodates fieldbus protocol stacks and OTA bootloader, and 32 KB SRAM supports TCP/IP packet buffers when paired with an external Ethernet MAC.
Empfohlen
Point-of-Sale (POS) Terminals
The MCF52211CEP66 targets POS terminals by combining ColdFire V2 deterministic interrupt response with integrated USB device for keyboard, magnetic-stripe reader, and printer peripherals. The on-chip USB full-speed controller and on-chip transceiver minimize BOM cost for the small-footprint POS terminal segment. The 128 KB Flash holds the payment-class firmware plus bootloader; 32 KB SRAM is sufficient for transaction buffers. The -40C to +85C industrial temperature range supports both indoor retail and outdoor kiosk environments.
Empfohlen
Embedded Networking Gateways
The MCF52211CEP66 is suitable for embedded networking gateways bridging fieldbus to Ethernet, because the ColdFire V2 core handles UART/CAN/SPI fieldbus traffic and the USB device port can tether to an external Wi-Fi or cellular module. The 128 KB Flash stores TCP/IP stacks (such as lwIP) and fieldbus protocol libraries, while 32 KB SRAM is adequate for packet buffers when an external Ethernet MAC such as ENC28J60 is used. ColdFire's mature toolchain supports reliable long-lifecycle products common in industrial networking.
Empfohlen
Motor Control & Drives
The MCF52211CEP66 supports low-to-mid-speed motor control (BLDC, stepper, brushed DC) because its ColdFire V2 core delivers deterministic PWM timing through on-chip timers, and the integrated CAN and UART interfaces connect to industrial drive networks. The 64-QFN-EP exposed pad provides a low-thermal-resistance path to the PCB copper pour, which doubles as a heatsink for FET gate drivers. The 128 KB Flash stores the FOC algorithm and fault-handling routines; 32 KB SRAM holds sensor and observer state. Industrial -40C to +85C operation covers drive cabinet environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF52211CEP66 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF52210CEP66 | MCF52213CAF66 | MCF52110CEP66 | MCF52211CVM66 |
|---|---|---|---|---|---|
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Memory | 128 KB | 64 KB (-50%) | 256 KB (+100%) | 64 KB / 128 KB (variant) | 128 KB (same) |
| SRAM | 32 KB | 32 KB | 32 KB / 64 KB (variant) | 32 KB | 32 KB |
| USB Interface | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed on-chip | USB 2.0 Full-Speed on-chip | USB not present on all masks | USB 2.0 Full-Speed on-chip (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density with same pinout (vs. MCF52210CEP66)
- Lower Flash density with same pinout for cost-sensitive designs (vs. MCF52213CAF66)
- USB device with on-chip transceiver integrated (vs. MCF52110CEP66)
Designhinweise
The 64-QFN-EP package uses the exposed thermal pad (pin 65) as the primary heat-dissipation path. For industrial 85C operation at full 66 MHz with all peripherals active, solder the exposed pad to a continuous ground copper pour at least 1 square inch in area. Without proper pad soldering, junction temperature can exceed 105C and trigger thermal-shutdown behaviour on long CAN or USB bursts. Avoid placing vias in the pad that are not thermally capped - they act as heat pipes to the opposite board side and reduce dissipation.
Place 100 nF ceramic decoupling capacitors on every VDD pin within 3 mm of the package, plus a single 10 uF bulk tantalum or ceramic capacitor at the board power entry. The PLL supply (VDD_PLL) and analog supply (VDDA) require their own filtered rails - LC pi-filter or ferrite bead plus capacitor - to keep PLL jitter low and ADC noise floor below 1 LSB. According to the MCF5221x reference manual, VDD_PLL must be powered up no later than VDD to avoid a startup race condition.
Route the USB DP and DM traces as a 90-ohm differential pair with continuous ground reference on the layer below; keep total length under 25 mm to meet USB 2.0 full-speed signal-integrity requirements. Place the ESD protection diode array within 5 mm of the USB connector. The BDM/JTAG pins (TCLK, TDI, TDO, TMS, TRST) should be brought out to a 2x5 0.05-inch header or Tag-Connect footprint to enable in-system programming without populating a connector in production.
Estimated: at 66 MHz with all peripherals active and the USB transceiver enabled, the V2 core draws approximately 80 mA from the 3.3 V rail; a regulator with at least 250 mA headroom is recommended to handle inrush during Flash programming. Do not connect the USB_DP/USB_DM pins to external 5 V sources - the USB controller is 3.3 V tolerant only. Failing to release the BDM RESET pin before software reset can lock the part; ensure the BDM interface is properly terminated per MCF5221x reference manual section 13.
Compliance-Informationen
RoHS/REACH status not present in the Verified Web Data; manufacturer datasheet should be consulted for the exact compliance declaration. Part is industrial temperature grade (-40C to +85C) but not AEC-Q100 qualified for automotive use.
