MK50DN512CLL10 - 100MHz Cortex-M4 MCU 512KB Flash | NXP
Teilenummer: MK50DN512CLL10 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MK50DN512CLL10 Übersicht
A microcontroller (MCU) is an integrated circuit that combines a processor core, memory, and programmable peripherals on a single chip, forming the heart of embedded systems. Within the voltage regulator-to-system hierarchy of embedded design, the MCU sits at the application layer, driving sensors, displays, and communication interfaces. The ARM Cortex-M4 architecture adds a hardware DSP unit and optional floating-point capability to the 32-bit ARM family, making it a mid-range workhorse between simple Cortex-M0 parts and high-end application processors.
Key features of the Kinetis K50 sub-family include its integrated analog measurement engine: operational amplifiers and trans-impedance amplifiers built directly into the chip, alongside high-resolution ADC and DAC modules. This analog integration reduces system cost and PCB area in measurement-heavy designs. The device also integrates a full-speed USB controller, multiple serial interfaces, and low-power modes suited to battery-operated equipment.
Architecturally, the Cortex-M4 core delivers 100 MHz performance with hardware divide, single-cycle MAC, and interrupt handling that reduces core interruption in real-time control loops. The 512 KB flash program memory and 128 KB SRAM support complex firmware stacks including USB device classes, RTOS kernels, and communication protocol stacks.
Typical applications include medical monitoring devices, portable instrumentation, industrial measurement systems, and consumer products that benefit from on-chip analog amplification ahead of the ADC.
Design consideration: this MCU supports 1.8V, 2.5V, and 3.3V supply domains, so confirm the supply rails match the power tree before layout, and verify that all 100 LQFP pins are routed with appropriate decoupling.
This page synthesizes distributor pricing context, stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MK50DN512CLL10 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK50DN512CLL10 (gleiche Bauform und Footprint) – abweichend in Package, Core Processor, Lifecycle Status, Mounting Type, Flash Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK53DN512CLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MK50DX256CLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →MK40DN512CLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MK60DN512VLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MK10DN512VLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MK50DN512CLL10 Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximale Taktfrequenz | 100 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Supply Voltage Range | 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | 100-LQFP (14x14 mm) |
| Montageart | Surface Mount |
| Product Family | Kinetis K50 |
| Analog Engine | Integrated op-amps and trans-impedance amplifiers |
| ADC | High-resolution ADC modules |
| DAC | High-resolution DAC modules |
| USB | Full-Speed USB |
| Anzahl der Pins | 100 |
| Packaging | Tray |
| Lebenszyklusstatus | Active |
| Temperature Grade | Industrial |
MK50DN512CLL10 100-lqfp (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für MK50DN512CLL10 (100-lqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK50DN512CLL10.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK50DN512CLL10 ist geeignet für 6 Anwendungs: Medical Monitoring Devices, Portable Instrumentation, Industrial Measurement and Control Nodes, USB-Connected Data Acquisition, Sensor Signal Conditioning Systems, Embedded Human-Machine Interfaces.
Medical Monitoring Devices
The MK50DN512CLL10 fits medical monitoring equipment because its K50 analog measurement engine integrates operational amplifiers and trans-impedance amplifiers ahead of high-resolution ADC modules, precisely the signal chain needed for biopotential, blood-oxygen, and pressure sensing. NXP explicitly targeted the K50 family at medical and industrial measurement applications. In a typical design, a photodiode or electrode signal feeds the on-chip trans-impedance amplifier, which drives the internal ADC directly, eliminating external amplifier ICs and their associated noise, offset, and BOM cost. The 100 MHz Cortex-M4 with DSP instructions performs digital filtering such as IIR notch filtering of line interference at low power. The 512 KB flash retains calibration data and multi-parameter firmware.
Empfohlen
Portable Instrumentation
Handheld and battery-powered instruments benefit from the MK50DN512CLL10's combination of 100 MHz processing, low-power modes, and integrated analog. Because the op-amps and trans-impedance amplifiers are on-chip, a portable meter can condition sensor signals without discrete amplifier stages, cutting PCB area and battery drain. The 1.8V/2.5V/3.3V supply flexibility allows a single-cell-derived rail architecture, and the full-speed USB controller provides a direct link to a PC for data logging without a separate USB interface chip. The 512 KB flash supports rich firmware with menus, DSP filtering, and storage management, while the 128 KB SRAM buffers measurement records between USB transfers.
Empfohlen
Industrial Measurement and Control Nodes
In industrial automation, the MK50DN512CLL10 serves as a smart sensor node or actuator controller. Its industrial temperature grade, robust Cortex-M4 interrupt architecture, and high-resolution ADC/DAC modules support closed-loop control over analog processes such as pressure, flow, and temperature. The integrated trans-impedance amplifiers read current-loop or photodiode inputs directly, and the 100 MHz core executes PID loops with fast interrupt latency, reducing core interruption in real-time tasks per NXP's positioning. Multiple serial interfaces bridge to field buses and displays, while flash-based firmware supports field updates. The 100-LQFP package with gull-wing leads eases inspection and rework in industrial production environments.
Empfohlen
USB-Connected Data Acquisition
The MK50DN512CLL10 is a strong fit for USB data acquisition pods because it integrates a full-speed USB controller alongside high-resolution ADC modules in one chip, removing the traditional separate MCU-plus-USB-interface architecture. Data sampled by the internal ADCs or streamed over SPI from external converters is buffered in the 128 KB SRAM and transferred to the host at 12 Mbps. The 100 MHz Cortex-M4 handles protocol processing, packetization, and command interpretation concurrently, while DSP instructions enable on-device filtering and decimation before upload. The 512 KB flash can implement multiple USB device classes and in-application firmware upgrade capability, important for deployed DAQ hardware.
Empfohlen
Sensor Signal Conditioning Systems
Systems that digitize photodiodes, bridge sensors, or current-output transducers match the MK50DN512CLL10's on-chip analog measurement engine: the trans-impedance amplifier converts sensor current to voltage, the operational amplifier provides gain stages, and the high-resolution ADC digitizes the result, all without external analog ICs. NXP designed this analog engine specifically to reduce system cost and design flexibility constraints in measurement applications. The 100 MHz core then applies calibration, linearization, and digital filtering. Keeping the entire analog chain on-die reduces parasitic pickup, board noise, and temperature-related drift between discrete components, improving overall measurement accuracy relative to multi-chip signal chains.
Empfohlen
Embedded Human-Machine Interfaces
The MK50DN512CLL10 supports compact HMI panels and control consoles where its 100 MHz Cortex-M4 drives displays, touch input, and communication simultaneously. The 512 KB flash accommodates graphics and menu firmware, while the DAC modules and PWM peripherals generate analog control and audio-feedback outputs. USB connectivity links the panel to a host PC or power source, and the 100-LQFP package provides enough I/O for keypads, indicators, and serial peripherals within one controller. The Cortex-M4's low interrupt latency keeps user-interface response crisp even while background measurement or control loops execute, making it a single-chip replacement for MCU-plus-coprocessor HMI architectures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK50DN512CLL10 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK53DN512CLL10 | MK50DX256CLL10 | MK40DN512CLL10 | MK60DN512VLL10 | MK10DN512VLL10 |
|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Clock | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz |
| Flash Memory | 512 KB | 512 KB | 256 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Sub-Family Analog Engine | Op-amps + trans-impedance amplifiers + ADC/DAC (K50) | Measurement engine (K53, with crypto) | Op-amps + trans-impedance amplifiers (K50) - same | K40 analog mix (adds LCD controller) | K60 mix (adds Ethernet/touch) | No integrated amplifier engine (K10) |
| USB | Full-Speed USB | Full-Speed USB | Full-Speed USB | Full-Speed USB | Full-Speed USB | Full-Speed USB |
Wichtigste Unterscheidungsmerkmale
- Integrated analog measurement engine (vs. MK10DN512VLL10)
- Double the flash at identical footprint (vs. MK50DX256CLL10)
- Analog focus vs crypto focus (vs. MK53DN512CLL10)
Designhinweise
The MK50DN512CLL10 supports 1.8V, 2.5V, and 3.3V supply domains per the datasheet record. Design a clean 3.3V main rail with dedicated LDO or ferrite-filtered analog supply for the VDDA domain feeding the ADC and amplifier modules. Place a 100 nF ceramic capacitor at each supply pin pair plus bulk 4.7-10 uF near the part; the K50 datasheet decoupling table lists the exact per-pin capacitance budget. Verify regulator sequencing does not back-feed I/O rails through ESD diodes.
Because the K50's analog measurement engine places op-amps and trans-impedance amplifiers on-die, external sensor traces to the amplifier inputs are the most noise-sensitive nets on the board. Keep photodiode or electrode traces short, guard them with ground pours, and route them away from the USB differential pair and any switching regulator nodes. Use the differential ADC inputs where possible for common-mode rejection. Estimated: a 10 cm unguarded high-impedance trace can pick up millivolt-level line noise, well above the ADC LSB.
The 'LL10' suffix encodes the LQFP-100 package and 100 MHz grade; ordering an 'LJ' or 'MC' suffix variant will receive a different package or speed grade that will not populate the same PCB footprint or meet timing expectations. Confirm the full MPN on labels at incoming inspection, since Kinetis family members look alike externally. Also verify flash sector erase times in your boot code rather than assuming fixed delays, as flash timing parameters differ between K-series revisions.
The 100-LQFP (14x14 mm) footprint needs 0.5 mm pitch pads per the NXP reference footprint. Extend each pad 0.3-0.5 mm beyond the lead for inspectable solder joints, and thermal-relief any copper pour connected to supply pins to keep reflow profiles within JEDEC-recommended limits for LQFP packages. Keep the crystal and USB routing on the top layer with an unbroken ground reference plane directly beneath.
Compliance-Informationen
Compliance details must be confirmed on the official NXP product page (Environmental Quality section) for MK50DN512CLL10; the retrieved data did not include explicit RoHS/REACH declarations.