MK60DN512ZVMC10 - 100MHz Cortex-M4 MCU 512KB Flash | NXP
Teilenummer: MK60DN512ZVMC10 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.18 | $1.018,00 |
| 500 | $9.05 | $4.525,00 |
| 1.000 | $7.94 | $7.940,00 |
MK60DN512ZVMC10 Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically flash), working RAM, and a rich set of I/O peripherals into one package. MCUs form the lowest tier of the embedded-computing hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor. The Cortex-M4 core adds a single-precision floating-point unit and DSP extensions, making Kinetis K60 devices well suited to closed-loop algorithms and digital signal processing tasks that would overwhelm a Cortex-M0/M0+ part.
Key features of the MK60DN512ZVMC10 include 512 KB of flash with flexible flash-memory controller, 128 KB of SRAM, USB 2.0 full-speed on-chip transceiver, 10/100 Ethernet MAC with IEEE 1588 precision-time-protocol support, multiple serial communication blocks, a 16-bit SAR ADC, and a wide operating voltage range from 1.71 V to 3.6 V. The 100 MHz core delivers 1.25 DMIPS/MHz while advanced low-power modes allow run, wait, stop, and very-low-power-stop operation for energy-conscious designs.
The K60 architecture uses a Cortex-M4 core with a tightly-coupled memory subsystem, a multi-master AHB/APB bus matrix, and a flash-memory controller with a 4-channel RAM, with 128 KB of on-chip SRAM configurable as SRAM, banks, RAM, with 128 KB of on-chip SRAM, banks, RAM, with 128 KB of on-chip SRAM. The 8x8 mm MAPBGA package balances I/O density with reflow-friendly assembly, supporting fine-pitch fan-out for compact PCB layouts while keeping high-speed signal integrity manageable.
Typical applications include industrial motor control and variable-frequency drives, building automation and HVAC controllers, smart energy meters with Ethernet connectivity, USB peripherals and human-interface devices, and point-of-sale terminals. The combination of Ethernet, USB, and a Cortex-M4 with FPU is rare at this part-count and price tier, enabling a single-chip solution where competitors typically require an external PHY or co-processor.
When designing with this device, provide a stable 3.3 V or lower supply rail to VDD/VBAT, ensure the external 32.768 kHz crystal or oscillator is placed close to XTAL pins to minimize jitter, and follow the NXP reference manual for unlocking the flash-memory controller before in-application programming cycles.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MK60DN512ZVMC10 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK60DN512ZVMC10 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature Range, USB, Core, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK60DN256VMD10
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MK20DN512ZVMC10
✅ Drop-In✓ Auf Lager
$5.3 / Stück
Datenblatt ansehen →MK60DN512ZVLQ10
✅ Drop-In✓ Auf Lager
$9.3 / Stück
Datenblatt ansehen →MK40DN512ZVMD10
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.38 / Stück
Datenblatt ansehen →MK21DN512VMC5
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →STM32H563ZIT6
✅ Drop-In✓ Auf Lager
$8.6 / Stück
Datenblatt ansehen →MK60DN512ZVMC10 Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Program Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Betriebstemperaturbereich | -40 C to +85 C |
| Gehäuse | 121-MAPBGA (8 mm x 8 mm) |
| Montageart | Surface Mount |
| Communication Interfaces | USB 2.0 Full-Speed, 10/100 Ethernet MAC with IEEE 1588, UART, SPI, I2C, CAN, I2S |
| Cryptography | Hardware random-number generator |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
MK60DN512ZVMC10 121-mapbga (8 mm x 8 mm) Pinbelegungsleitfaden
Pinbelegung für MK60DN512ZVMC10 (121-mapbga (8 mm x 8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK60DN512ZVMC10.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK60DN512ZVMC10 ist geeignet für 6 Anwendungs: Industrial Motor Control and Variable-Frequency Drives, Smart Energy Meters with Ethernet Connectivity, Building Automation and HVAC Controllers, USB Peripherals and Human-Interface Devices, Point-of-Sale Terminals, Industrial Gateways and Protocol Converters.
Industrial Motor Control and Variable-Frequency Drives
The MK60DN512ZVMC10 fits motor-control designs because the Cortex-M4 with single-precision FPU and DSP extensions accelerates Park/Clark transforms and PI control loops, while the on-chip PWM modules and 16-bit ADC support 3-phase sensorless FOC. The 512 KB flash holds the control state diagram plus application UI, and the 128 KB SRAM stores field-oriented controller working variables. Unlike a Cortex-M0+ part, this MCU runs the full FOC stack at 100 MHz with no core clock stall, which is why drop-in motor designs target this part. Recommended companion parts include NXP IPP520DR1 gate drivers for IGBT/SiC bridges, NXP MMF1023 external PHY and 5, and NXP IPP520DRN for fault-tolerant industrial systems.
Empfohlen
Smart Energy Meters with Ethernet Connectivity
The MK60DN512ZVMC10 supports smart-meter designs because the 10/100 Ethernet MAC with IEEE 1588 hardware timestamping enables utility-grade metering with synchronized time stamps. The 512 KB flash fits DLMS/COSEM protocol libraries, 1553 encryption stacks, and 128 KB SRAM holds metering buffers, and the 128 KB SRAM stores metering samples across runs. The 1.71 V to 3.6 V supply range supports single-cell-battery-backed operation during power outages, while the low-power stop modes provide low quiescent current for battery-low scenarios. Companion parts include NXP MMF1023 external PHY and 5, NXP IPP520DR1 metering front-end, and NXP IPP520DRN for metrology systems.
Empfohlen
Building Automation and HVAC Controllers
The MK60DN512ZVMC10 drives HVAC controllers because the USB 2.0 full-speed port enables Wi-Fi/Bluetooth dongle connectivity, the Ethernet MAC supports BACnet/IP gateways, and the 100 MHz Cortex-M4 runs PID loops for variable-air-volume systems. The 512 KB flash fits BACnet, Modbus, Modbus/TCP, and 128 KB SRAM holds HVAC state across runs. The MAPBGA-121 footprint enables compact designs where fan-out is more important than absolute pin count in mains-line applications. Companion parts include NXP MK50DX256CLL10 sensor hub for HVAC sensors, NXP IPP520DR1 motor drivers, and NXP MK21DN512VMC5 for secondary loop control.
Empfohlen
USB Peripherals and Human-Interface Devices
The MK60DN512ZVMC10 fits USB HID designs because the on-chip USB 2.0 full-speed transceiver eliminates external PHY, the 100 MHz Cortex-M4 handles USB HID stack plus application code, and the 512 KB flash fits composite-USB stacks. The 128 KB SRAM stores HID buffers, the 128 KB SRAM stores HID state, and the USB suspend/resume signaling supports battery-powered HID scenarios. Unlike parts without USB, this MCU adds no external PHY BOM in HID peripheral applications, which is why drop-in HID designs target this part. Companion parts include NXP MK50DX256CLL10 companion HID controller, NXP IPP520DR1 external PHY and 5, and NXP IPP520DRN for fault-tolerant HID systems.
Empfohlen
Point-of-Sale Terminals
The MK60DN512ZVMC10 supports POS terminals because the Ethernet MAC enables IP-based payment terminals, the USB 2.0 full-speed port connects to PIN pads and printers, and the 100 MHz Cortex-M4 runs the POS stack plus crypto libraries. The 512 KB flash fits payment applications, encryption libraries, and 128 KB SRAM holds payment buffers across runs. The MAPBGA-121 footprint reduces BOM in slim card terminals where competitor parts require external PHY chips. Companion parts include NXP MK50DX256CLL10 secure-element MCU, NXP IPP520DR1 external PHY and 5, and NXP IPP520DRN for secure payment systems.
Empfohlen
Industrial Gateways and Protocol Converters
The MK60DN512ZVMC10 fits industrial-gateway designs because the Ethernet MAC and USB full-speed ports enable multi-protocol bridging, the 100 MHz Cortex-M4 runs the gateway stack plus routing logic, and the 512 KB flash fits multi-protocol firmware. The 128 KB SRAM stores gateway buffers, the 128 KB SRAM stores routing state, and the MAPBGA-121 footprint enables compact designs where fan-out is more important than absolute pin count in industrial-cabinet applications. Companion parts include NXP MK50DX256CLL10 sensor hub for industrial protocols, NXP IPP520DR1 RS-485 transceiver, and NXP MK21DN512VMC5 for secondary gateway protocol.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK60DN512ZVMC10 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK60DN256VMD10 | MK20DN512ZVMC10 | MK60DN512ZVLQ10 | MK40DN512ZVMD10 | MK21DN512VMC5 | STM32H563ZIT6 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Package | 121-MAPBGA (8x8 mm) | 144-MAPBGA | 121-MAPBGA | 144-LQFP | 144-MAPBGA | 121-MAPBGA | 144-LQFP |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M33 |
| Maximum CPU Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 50 MHz | 250 MHz |
| Program Flash Memory | 512 KB | 256 KB | 512 KB | 512 KB | 512 KB | 512 KB | 2 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 640 KB |
| Ethernet MAC | Yes (10/100 with IEEE 1588) | Yes (10/100 with IEEE 1588) | No | Yes (10/100 with IEEE 1588) | No | Yes (10/100) | Yes (10/100) |
| USB 2.0 Full-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes (USB 2.0 High-Speed) |
| Supply Voltage Range | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
Wichtigste Unterscheidungsmerkmale
- Smallest MAPBGA package in K60 family (vs. MK60DN512ZVLQ10)
- Lower cost than K51 family (vs. MK51DN512ZCMC10)
- 512 KB flash density at 100 MHz (vs. MK21DN512VMC5)
Designhinweise
Provide a clean 3.3 V rail to VDD with a 4.7 uF + 100 nF decoupling network within 10 mm of the BGA balls. The K60 has multiple VDD/VSS ball pairs that all require low-impedance decoupling; share the same ground via fan-out to reduce ground bounce. Estimated: at 100 MHz core clock with Ethernet active, typical active-mode current is around 80-110 mA; standby current drops below 10 uA in VLLS0 mode.
Layout the 121-MAPBGA on a 4-layer PCB with 0.4 mm micro vias and 4 mil trace/space per JEDEC JESD-BGA-LP recommendations. Place external 32.768 kHz crystal within 5 mm of EXTAL32/XTAL32 balls with a guard ring tied to ground; long trace exposure on this net adds jitter to the RTC. Route USB DP/DM as a 90 ohm differential pair, and route Ethernet MII/RMII signals with controlled impedance per trace.
Do not omit the external PHY reset loop or the ETH_MDC pull-up; the 30 kohm MDC pull-up keeps the bus idle high and prevents false clock detection. Ensure the flash-memory controller is unlocked before performing in-application programming cycles, otherwise the FCB read returns the lock state and not the unlock state. Reference: K60RM reference manual chapter on flash-memory controller and the fault-detection state across the entire fault-detection arc.
The 121-MAPBGA package has a theta_JA of approximately 35-40 C/W on a JEDEC 4-layer test board. Estimated: at 100 MHz active with Ethernet active, internal dissipation is around 250 mW, giving a 10 C rise above ambient. No external heatsink is needed; standard airflow cooling in industrial enclosures is sufficient for operation across the -40 C to +85 C range.
Compliance-Informationen
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - choose K60 automotive variants for AEC-Q100. Halogen-free status not confirmed.
