FPGA y CPLD
Productos (6666)
EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera
The Intel (formerly Altera) EP2SGX130GF1508C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and 734 user I/Os in a 1508-ball FineLine BGA (FCBGA) package. Built on a 90 nm CMOS process with 1.2 V core supply, it delivers up to 717 MHz internal operation and is designed for high-throughput serial connectivity plus parallel DSP workloads. The integrated 6.375 Gbps transceivers make it a classic platform for early-2000s high-speed serial bridging. A Field Programmable Gate Array (FPGA) is a class of programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hardened I/O serdes that can be rewired post-manufacturing. FPGAs sit in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance applications by combining a unique adaptive logic module (ALM) architecture with embedded transceivers, on-chip memory, and dedicated multipliers. Key features include 132,540 logic elements organized as 6,627 LABs, 6747840 total RAM bits, 8 PLLs, 4 DLLs, and configurable high-speed transceivers capable of multiple protocol rates. The device supports LVDS, LVTTL, LVCMOS, PCI, PCI-X, and HSTL I/O standards and includes dedicated hardware multipliers and DSP blocks. The FCBGA-1508 FineLine BGA package offers vertical migration within the Stratix II GX family, allowing density upgrades without PCB changes. The Stratix II GX architecture introduced the ALM (Adaptive Logic Module) as its core logic unit, replacing the 4-input LUT of previous generations with a fracturable 8-input equivalent that improves DSP packing density and reduces logic fragmentation. Combined with the 90 nm process node, this architecture achieved industry-leading performance at launch. Typical applications include high-speed serial interface prototyping, PCI Express endpoint development, telecommunications backplane bridging, multi-gigabit serial I/O expansion, and DSP-intensive signal processing cards in test and measurement equipment. Its combination of logic density and on-chip transceivers made it a mainstay for OC-48 and early OC-192 designs, radar signal processing, and broadcast video routing. When designing with this FPGA, ensure proper power sequencing for the 1.2 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, since out-of-order power-up can latch-up I/O structures. Thermal management must account for high quiescent current under heavy transceiver utilization; thermal balls in the BGA substrate must be soldered to a grounded thermal via array for proper dissipation. This page synthesizes Stratix II GX family positioning, drop-in density-grade alternatives within the same FCBGA-1508 footprint, and practical design guidance beyond the marketing datasheet, helping engineers evaluate lifecycle risk and migration paths for legacy designs.
EP2SGX130GF1508C5 - Stratix II GX FPGA 6627 LABs 734 I/O 1508-FBGA | Intel
The Intel (formerly Altera) EP2SGX130GF1508C5 is a high-density Stratix II GX FPGA combining 132,540 equivalent logic elements, 6,627 LABs, and 734 user I/Os with up to 20 high-speed serial transceivers, packaged in a 1508-ball FineLine BGA. It belongs to Altera's third-generation FPGA family that integrates multi-gigabit transceivers with a scalable logic fabric optimized for high-bandwidth communication and signal-processing designs. The "GX" suffix indicates the inclusion of embedded transceiver channels supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory, DSP blocks, and routing resources that the designer configures after manufacturing using an HDL-defined bitstream. Within the broader semiconductor hierarchy, an FPGA sits as a specialized type of programmable logic IC, above fixed-function ASICs in flexibility but typically below them in per-unit cost at high volume. The Stratix II GX specifically targets applications that demand both parallel DSP throughput and serial-link connectivity, making it part of Intel's high-performance programmable logic family alongside later Stratix IV/V/10 generations. Key features of the EP2SGX130GF1508C5 include 132,540 LEs, 6,627 LABs, approximately 6.7 Mbits of embedded RAM, 252 embedded 18x18 multipliers, and 734 maximum user I/Os. Up to 20 full-duplex transceiver channels support data rates from 600 Mbps to 6.375 Gbps. The device is fabricated on a 90 nm process and operates on a 1.2 V core supply. Speed grade C5 denotes a commercial temperature range with a mid-tier timing performance bin. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM), which can be configured as either combinational logic or arithmetic functions, providing higher effective density than traditional 4-input LUT architectures. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) layers, allowing direct interface to SERDES-based standards without external PHY chips. The 1508-ball FBGA package supports the high I/O count required for memory, transceiver, and general-purpose parallel interfaces. Typical applications include high-speed serial interface bridging, telecom baseband processing, military radar signal processing, ASIC prototyping, test and measurement equipment, and high-performance DSP accelerators. The integrated transceivers eliminate the need for external SERDES chips in many designs. When designing with this FPGA, ensure adequate power decoupling with multiple bulk and ceramic capacitors, manage JTAG configuration via the dedicated MSEL pins for the selected configuration scheme, and verify thermal management because high logic utilization combined with active transceivers can exceed 10 W of dissipation.
EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX130GF1508C5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements and 6,747,840 bits of embedded memory in a 1508-ball FC-FBGA package. Built on a 90 nm CMOS process and operating from a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications, integrating up to 20 transceivers (per Stratix II GX family capability) operating at up to 6.375 Gbps and hard PCI Express and Serial RapidIO IP blocks. Key features include 6,627 Logic Array Blocks (LABs), 734 user I/O pins, embedded multiplier blocks and DSP blocks for high-throughput signal processing, distributed and M512/M4K/M-RAM block memory, and dedicated PLL and clock-management circuitry. The "C5" speed grade denotes a commercial -5 timing closure, while the "N" suffix indicates a lead-free, RoHS-compliant FBGA. The 40 x 40 mm package with 1 mm ball pitch is intended for high-layer-count PCB designs with controlled-impedance routing. The Stratix II GX architecture uses an ALM (Adaptive Logic Module) approach, allowing each ALM to be configured for either combinational or registered logic with up to 8 inputs, delivering better logic utilization than the older 4-input LUT-based Stratix. The on-chip transceivers support CPRI, OBSAI, Serial RapidIO, PCI Express Gen1, XAUI, CEI-6G, and SFI-5 protocols without external PHYs, making the part well suited for backplane, line-card, and base-station designs. Typical applications include 10G/40G Ethernet line cards, wireless base-station baseband and radio units, high-speed serial protocol bridging (PCIe, SRIO, XAUI), DSP co-processing for radar and medical imaging, and ASIC prototyping. The device is also used in broadcast video processing and high-end test and measurement equipment where logic density and transceiver bandwidth are simultaneous requirements. When designing with this device, ensure the PCB stack-up supports 1 mm-pitch BGA breakout with microvia or via-in-pad technology where required, and provide matched-length routing for high-speed serial links. Thermal management must account for the 1508-pin FC-FBGA's junction-to-ambient thermal resistance; a heatsink with thermal interface material is recommended for full transceiver utilization. Quartus II design software (Stratix II GX device support) is required for synthesis, place-and-route, and bitstream generation.
EP2SGX130GF1508I4 - 132K LEs Stratix II GX FPGA | Intel | 1508-FCBGA
The Intel (formerly Altera) EP2SGX130GF1508I4 is a high-density, high-performance Stratix II GX Field Programmable Gate Array (FPGA) with 132,540 logic elements, up to 6,747,840 system gates, and 734 embedded 18x18 multipliers, housed in a 1508-ball FC-FBGA package. The device integrates up to 20 embedded transceivers operating at 6.375 Gbps for high-speed serial I/O, 6.7 Mbits of embedded memory (M9K + M144K blocks), and supports the 90 nm CMOS process with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O resources that the designer can re-program after manufacture. Stratix II GX belongs to the high-end programmable-logic family: FPGA -> programmable logic -> programmable logic IC -> logic device -> semiconductor. The GX suffix denotes integrated multi-gigabit transceivers (MGTs), positioning the device for serial connectivity and DSP-heavy workloads. Key features include an internal clock network with up to 12 PLLs, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and flexible I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI Express. The device supports 1.0/1.2 V LVTTL/LVCMOS I/O and offers hot-socketing capability. The 1508-ball FC-BGA package provides high I/O density (734 user I/O pins per datasheet summary) for memory-rich and transceiver-rich designs. Architecturally, the Stratix II GX family uses the ALM (Adaptive Logic Module), an 8-input fracturable LUT-based logic element that improves packing efficiency versus 4-input LUT predecessors. The 90 nm process node balances performance and power, while dedicated DSP blocks accelerate multiply-accumulate operations. The transceiver block supports CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and custom serial protocols at data rates from 600 Mbps to 6.375 Gbps. Typical applications include high-end telecommunications backplanes, wireless baseband processing, high-performance computing, video broadcast infrastructure, and test & measurement equipment. The combination of 132K logic elements and 20 transceivers targets designs where parallel DSP plus multi-gigabit serial I/O are required simultaneously. When designing, pay close attention to the 1.2 V core supply sequencing and the transceiver reference clock architecture. The 1508-ball FC-BGA package requires a multi-layer PCB with controlled-impedance traces, microvia stacking, and strict length-matching for transceiver channels. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) tool before logic design freeze. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes not found on the Intel datasheet cover page. Cross-reference the manufacturer datasheet for full timing, I/O standard, and transceiver specifications.
EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX130GF1508I4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and up to 734 user I/Os into a 1508-ball flip-chip BGA (FCBGA) package. The device is built on a 1.2V core, 90nm CMOS process with embedded transceivers capable of multi-gigabit serial signaling, making it suitable for high-bandwidth communications and signal-processing designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated DSP blocks, and on-chip memory that an engineer can re-program in the field after manufacturing. FPGAs sit between general-purpose microcontrollers (software-defined, slower) and application-specific integrated circuits (ASICs, fixed-function, highest performance). The Stratix II GX family extends the generic Stratix II architecture with embedded multi-gigabit transceivers, hardening the device for serial connectivity standards such as PCIe, Serial RapidIO, Gigabit Ethernet, and custom backplane links. Key features include 6,627 Adaptive Logic Modules (ALMs), dedicated 18x18 multipliers and DSP blocks, TriMatrix embedded memory with up to 6.75 Mbits, eight phase-locked loops (PLLs), and embedded transceiver channels supporting data rates up to 6.375 Gbps. Configuration is supported via passive serial, fast passive parallel, and JTAG modes, and design entry uses the Quartus II development toolchain. The -I4N speed/temperature grade denotes an industrial temperature range and a fast speed bin. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and high-performance DSP compute nodes. The 1508-ball FCBGA package exposes enough I/O and transceiver channels for multi-port line-card designs where board area is constrained but pin density is essential. When designing with this device, ensure the PCB stackup can handle the FCBGA ball pitch and provides matched-impedance routing for the transceiver channels. Power sequencing must follow the datasheet ramp order to avoid in-rush damage, and the JTAG chain should be accessible for boundary-scan and in-system programming. This page synthesizes distributor pricing, package options, and design guidance for engineers evaluating the EP2SGX130GF1508I4N against other Stratix II GX variants and competing high-density FPGAs.
EP2SGX130GF1508I5N - 132K LEs Stratix II GX FPGA 1.2V 1508-FCBGA | Intel
The Intel EP2SGX130GF1508I5N is a high-density Field Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 132,540 logic elements (LEs) and 132,540 equivalent logic cells in a 1508-ball Flip-Chip BGA (FCBGA) package. It operates from a nominal 1.2V core supply (1.15V to 1.25V range), is fabricated on a 90 nm CMOS process, and supports up to 717 MHz internal frequency with up to 622.08 MHz clock performance per published distributor specifications. The -I5N speed/temperature grade targets industrial environments (-40C to +85C). A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the customer after manufacture using a hardware description language (HDL) and a vendor toolchain. FPGAs sit at the top of the programmable-logic hierarchy alongside Complex Programmable Logic Devices (CPLDs); Stratix II GX extends this category by integrating up to 20 multi-gigabit transceivers (MGTs) on-chip, making it a single-chip platform for high-speed serial I/O. EP2SGX130GF1508I5N therefore belongs to the broader power-management-and-IO-rich programmable IC class used in wired communications infrastructure. Key features of this device include on-chip memory resources (M512/M4K/M-RAM blocks totalling several Mbits, per Stratix II GX family datasheet), embedded multiplier blocks for DSP, and a PLL network for clock management. Its high logic density and embedded transceivers make it suitable for wireline protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Aurora, while the on-chip RAM supports packet buffering and lookup tables in network processing designs. From a technical-depth perspective, the 90 nm Stratix II GX architecture introduced an adaptive logic module (ALM) that maps more efficiently into real-world HDL constructs than the older 4-input LUT of Stratix I. Combined with dedicated high-speed serial I/O and DSP blocks, the EP2SGX130G die is positioned for protocol bridging, channel aggregation, and line-card signal processing rather than low-cost glue logic. Typical applications include high-end wired telecom line cards, baseband processing in wireless backhaul equipment, military signal intelligence and radar preprocessing, broadcast video processing, and ASIC prototyping/emulation where 132K LEs provide headroom for large IP blocks plus testbench logic. When designing with this part, pay close attention to the 1508-ball FCBGA 1.0 mm pitch land pattern, which requires multi-layer PCB with sequential lamination and via-in-pad capability for reliable assembly. Power sequencing of VCCINT/VCCIO/VCCA and transceiver supplies must follow the Intel Stratix II GX Handbook; failures here are a common source of field returns. This page synthesizes distributor inventory, same-package alternative MPNs, and design considerations drawn from the Stratix II GX family datasheet, providing information beyond what a single distributor page or product brief offers.
EP2SGX130GF40C3ES - 130K LEs Stratix II GX FPGA 6.375Gbps | Altera
The Intel (formerly Altera) EP2SGX130GF40C3ES is a high-performance Stratix II GX FPGA integrating 132,540 logic elements, 6,747 Kbits of embedded TriMatrix memory, and 4 to 20 high-speed serial transceiver channels with embedded CDR/SERDES capability operating at data rates up to 6.375 Gbps, housed in a 40 x 40 mm, 1508-ball FBGA (MS-034AAU-1) package with 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O resources can be customized after manufacture via an SRAM-based configuration bitstream. FPGAs occupy a unique position in the broader hierarchy of programmable logic devices (PLDs), sitting above CPLDs in density and below hard-wired ASICs in NRE cost while offering comparable performance for many parallel and high-bandwidth tasks. The Stratix II GX family specifically combines general-purpose FPGA fabric with multi-gigabit transceivers, enabling single-chip implementations of serial-protocol interfaces (PCI Express, Serial RapidIO, XAUI, Fibre Channel, Gigabit Ethernet) without external PHY silicon. The EP2SGX130G variant delivers up to 17 DSP blocks for fixed- and floating-point arithmetic, 16 global clock networks with up to 32 regional clock networks per device region, on-chip termination for high-speed transceivers, and dedicated circuitry for source-synchronous interfaces such as DDR/DDR2 SDRAM memory controllers operating up to 550 MHz. Internal core voltage is 1.2 V; the device is fabricated on a 90 nm CMOS process with a 12-layer metal stack. Typical applications include high-speed serial-protocol bridging (PCI Express x4/x8 endpoints, Serial RapidIO switches), high-end test and measurement instrumentation, digital video broadcast equipment, defense radar and signal-processing systems, and high-performance DSP co-processors. The transceiver count and package combination make this variant suitable for mid-density serial I/O expansion designs. When designing with this device, careful attention must be paid to PCB stack-up for the FBGA-1508 footprint: a minimum of 6 PCB layers with matched impedance for the high-speed serial channels, a continuous ground reference plane beneath the BGA field, and a via-in-pad or dog-bone fanout is recommended. Power-rail decoupling must follow Altera's Stratix II GX PowerPlay guidelines with multiple bulk and decoupling capacitor values placed as close as physically possible to each supply pin group. The 40 x 40 mm package footprint demands a high-density interconnect (HDI) PCB process with laser-drilled microvias. This page synthesizes drop-in alternate ordering codes within the EP2SGX130 GF1508 package family, current distributor pricing as of 2026-09-09, and practical PCB-layout design guidance not consolidated in any single manufacturer document.
EP2SGX130GF40C3N - 132K LE Stratix II GX FPGA | Intel | BGA-1508
The Intel (formerly Altera) EP2SGX130GF40C3N is a high-density, high-performance Stratix II GX family FPGA delivering 132,540 logic elements, 6.7 Mbits of embedded memory, and 252 embedded 18x18 multipliers in a 1508-ball flip-chip BGA package. The GF40 designator indicates a 40-transceiver variant supporting up to 6.375 Gbps serial connectivity per channel, enabling high-bandwidth bridging between parallel and serial domains. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs occupy the top tier of the programmable logic hierarchy: discrete logic < CPLD < FPGA, and within the FPGA family, Stratix II GX sits in the high-performance transceiver-equipped branch designed for ASIC-prototyping, signal-processing, and high-speed serial I/O. The Stratix II GX family uses a 90 nm process and a 1.2 V core supply, with auxiliary voltages for transceivers and PLLs. Key features include up to 734 user I/O pins, embedded transceivers operating from 600 Mbps to 6.375 Gbps, dedicated PCS hardening per channel, and on-chip PLL/DLL blocks for clock generation. The device supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II through dedicated DQS phase-shift circuitry. Embedded transceivers support popular protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G through configurable PCS logic. The architecture combines a logic fabric of adaptive logic modules (ALMs) with embedded multiplier blocks, TriMatrix memory blocks of MRAM/M4K/M512 types, and four corner PLLs plus two per-side PLLs. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional configuration via Altera EPCS or EPC configuration memories. The result is a programmable platform that integrates DSP, memory, and serial I/O previously requiring multiple companion chips. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI MACs), ASIC prototyping for networking and storage ASICs, software-defined radio baseband processing, digital video broadcast infrastructure, and high-end test-and-measurement equipment. The 40-transceiver count makes this specific die ideal for designs requiring many simultaneous serial links, such as multi-channel base-station cards or protocol-conversion switches. When designing with this device, allocate sufficient PCB area for power decoupling near each transceiver quadrant (the GF40 layout places transceivers in physical columns requiring isolated analog supplies), and ensure the flip-chip BGA has a properly microvia-stitched escape pattern. The 1508-ball package requires a multi-layer PCB with buried vias and a minimum 1 oz copper pour for the ground-return path to control simultaneous-switching noise (SSN). This page synthesizes distributor pricing from DigiKey, Octopart, Jotrin, and SZComponents, cross-references against the in-house Stratix II GX family table, and presents drop-in alternatives within the 1508-BGA footprint plus practical design notes not included in the manufacturer datasheet.
EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera
The Altera (now Intel) EP2SGX130GF40C3NES is a high-density Stratix II GX FPGA from the Stratix II GX family integrating 132,540 equivalent logic elements with up to 20 high-speed serial transceiver channels operating at data rates up to 6.375 Gbps. Housed in a 1508-ball flip-chip BGA (FC-FBGA) package, it combines a scalable high-performance logic fabric with embedded SERDES and clock/data recovery units (CRU) on a 90 nm process, with core and I/O voltages centered around 1.2 V. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit in the hierarchy between programmable logic devices (PLDs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs), offering higher logic density and higher performance than CPLDs but lower per-unit cost and longer lead time than ASICs at high volumes. Key features of the EP2SGX130GF40C3NES include up to 6.375 Gbps transceiver data rate per channel, embedded transceivers with clock/data recovery, on-chip memory, DSP blocks for high-throughput signal processing, and dedicated support for external memory interfaces such as DDR2/QDRII+. The Stratix II GX architecture was Altera's third-generation FPGA to combine high-speed serial transceivers with a scalable logic array, targeting line-card and backplane applications where multi-gigabit serial I/O eliminates external PHY chips. The device fabric is built on 90 nm CMOS technology and supports a maximum internal clock frequency around 717-779 MHz depending on configuration, with embedded transceivers typically delivering 4 to 20 channels at 6.375 Gbps. On-chip TriMatrix memory provides distributed RAM, block RAM, and shift-register memory resources for buffering, packet processing, and DSP coefficient storage. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO, Gigabit Ethernet), protocol bridging and aggregation line cards, multi-gigabit test and measurement equipment, broadcast video processing, and defense/radar signal processing front-ends. Designers also use Stratix II GX parts for proprietary chip-to-chip links requiring SERDES at 3 to 6 Gbps where the integrated transceiver eliminates the cost and signal-integrity overhead of a separate PHY. When designing with this part, plan the PCB for a high-density 1508-ball FC-FBGA which requires microvia-stack-up HDI technology, controlled-impedance SERDES routing, and strict power-rail decoupling per Altera's Stratix II GX design guidelines. Designers transitioning to newer projects should evaluate Stratix IV GX/GT, Arria, or Cyclone families for active-product longevity and tool support. This page synthesizes distributor stock and pricing data, same-package Stratix II GX drop-in alternatives drawn from the XAIPART Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX130GF40C4ES - 132,540 Logic Cells FPGA | Intel
Intel EP2SGX130GF40C4ES is a high-density Stratix II GX field-programmable gate array containing 132,540 logic cells, configured with 7,047 CLBs, and packaged in a 1,508-ball FBGA measuring 40 mm by 40 mm. The device uses CMOS programmable logic, supports an internal frequency of 717 MHz, and is specified for a 1.15 V to 1.25 V supply range. Its lead-free BGA construction belongs to the MS-034AAU-1 package designation and uses a 1 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor device whose logic function is defined by configuration rather than fixed internal circuitry. In the system hierarchy, the FPGA combines programmable logic blocks, routing resources, input and output blocks, and optional embedded functions on one integrated circuit. Designers use implementation software to convert a digital design into configuration data, after which the device performs parallel logic, interface, signal-processing, or control functions. The EP2SGX130GF40C4ES belongs to the Stratix II GX family and targets applications requiring substantial logic capacity and high pin count. The principal verified specifications are 132,540 logic cells, 7,047 CLBs, 734 user I/O, and 1,508 package pins. The GX family positioning makes the part relevant to designs that combine high-density programmable logic with serial transceiver-oriented integration. The 717 MHz internal-frequency listing provides a useful reference for the device's speed class, while the 40 mm by 40 mm package supports a large number of parallel interfaces and power connections. The exact transceiver count, operating temperature, configuration memory capacity, and speed-grade interpretation were not exposed in the supplied web snippets. The EP2SGX130GF40C4ES uses SRAM-based programmable-logic technology, as indicated by its Stratix II GX family identity and CMOS process classification. Designers synthesize the intended circuit and load it into the FPGA through its configuration interface. With 734 user I/O and 1,508 total pins, board implementation requires careful assignment of power, ground, configuration, clock, and user-signal balls. The large BGA package can support wide parallel buses, memory interfaces, protocol bridges, and high-channel-count digital processing structures. Typical applications include communications equipment, high-speed test and measurement systems, industrial imaging and video processing, data-acquisition platforms, and protocol-conversion hardware. The 132,540 logic-cell resource count suits designs that need many parallel datapaths, while 734 user I/O can support numerous external buses. Serial transceivers may also make the GX family appropriate where the target design requires high-speed serial connectivity, although the supplied data does not provide a verified transceiver count. Before layout or production release, engineers should obtain the complete manufacturer datasheet and verify ball assignments, configuration requirements, supported I/O standards, transceiver limits, power sequencing, thermal design, and operating-temperature details. The 40 mm by 40 mm FBGA requires a multilayer PCB, controlled escape routing, and sound power-distribution design. Missing parameters are marked rather than inferred, and design-in decisions should be based on the complete datasheet and Quartus support documentation. This product data combines the verified distributor and manufacturer-source snippets with engineering context unavailable on a typical price listing. The result helps buyers compare capacity, package, and commercial information while giving FPGA engineers a clear distinction between confirmed specifications and parameters that still require datasheet-level verification.
EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
The Intel EP2SGX130GF40C4NES is a 132,540 logic-element Stratix II GX FPGA with embedded 6.375 Gbps multi-gigabit transceivers, manufactured on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FC-FBGA, 40x40 mm, 1 mm pitch). It combines a high-performance programmable logic fabric with up to 20 embedded SERDES channels, 4.5 Mbits of embedded memory, and dedicated DSP blocks, targeting high-speed serial I/O applications including backplane switching, telecom line cards, and high-end test equipment. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and I/O cells that allow designers to implement arbitrary digital logic. Stratix II GX FPGAs sit within the hierarchy: FPGA -> programmable logic device -> PLD -> logic IC -> integrated circuit. The GX suffix denotes Altera/Intel's high-speed transceiver family, integrating multi-gigabit serial interfaces directly on-die to eliminate external PHY chips and shorten signal-trace paths. Key features of the EP2SGX130GF40C4NES include 132,540 logic elements, 717 MHz core fabric speed, 734 user I/O pins, an internal voltage of 1.2 V, and embedded SERDES supporting data rates up to 6.375 Gbps per channel with on-chip clock data recovery. The device exposes eight PLL blocks for clock synthesis and includes embedded TriMatrix memory totalling approximately 4.5 Mbits. Speed grade -4 (C4) and commercial extended temperature grade (N suffix with E) are specified per the datasheet family code. Architecturally, the Stratix II GX uses adaptive logic modules (ALMs) that combine fracturable look-up tables, dedicated carry chains, and register resources. Hard IP for PCIe, Serial RapidIO, and Gigabit Ethernet is embedded next to the transceivers, accelerating protocol implementation. The 90 nm process delivers an optimal balance between performance, leakage, and cost for high-pin-count FPGA designs in 2008-2010 vintage telecom and broadcast infrastructure. Typical applications include 10 Gbps optical transport line cards, Serial RapidIO backplanes, high-end ASIC prototyping, real-time DSP for radar and software-defined radio, and protocol-aware test and measurement platforms. The integrated transceivers let designers collapse multi-chip PHY + FPGA designs into a single package, simplifying board layout. Designers should plan for two-tier power decoupling (bulk plus 0.1 uF and 0.01 uF ceramics near each supply pin), implement thermal vias under the FC-FBGA thermal array, and respect the Quartus II pin connection guidelines for the GF40 package. The high pin count mandates a minimum 8-layer PCB with controlled-impedance routing for SERDES channels. This page consolidates current distributor pricing, verified drop-in same-brand alternatives, and design notes not present in the original datasheet, giving engineers a single reference for sourcing and second-sourcing decisions.
EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
The Intel (formerly Altera) EP2SGX130GF40C4NGB is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, featuring 132,540 logic elements, 6,627 Logic Array Blocks (LABs), and integrated high-speed serial transceivers for gigabit serial interface applications. The device is housed in a 1508-ball FineLine Ball-Grid Array (FBGA) package with a 1.00 mm terminal pitch and is offered in the commercial speed grade 4 (C4) temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built around an array of programmable logic blocks, programmable interconnect, and I/O cells, belonging to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Modern FPGAs combine this programmable fabric with hardened IP such as transceivers, memory blocks, PLLs, multipliers, and embedded processors, allowing designers to implement custom datapaths, protocol controllers, and parallel processing pipelines on a single chip. The Stratix II GX series extends the general-purpose Stratix II family by adding multi-gigabit transceivers. The EP2SGX130GF40C4NGB integrates up to 20 transceivers supporting serial interfaces up to 6.375 Gbps, embedded TriMatrix memory, and DSP blocks. With 734 user I/O pins and 8 PLLs, the device supports a wide range of high-speed parallel and serial I/O standards. The 1508-ball FBGA package provides high pin density and signal integrity for backplane, telecommunications, and high-performance computing applications, and the C4 speed grade balances timing margin and operating frequency for commercial-temperature designs. Architecturally, the Stratix II GX device uses a row-based logic structure, ALM-based adaptive logic modules, and source-synchronous circuitry optimized for 600 MHz to 1 GHz internal operation. Hard IP for PCI Express, SerialLite II, and other serial protocols reduces soft-logic footprint, while the on-chip TriMatrix memory provides up to 6.7 Mbits of distributed and block RAM with multiple operating modes. Typical applications include 10G/40G Ethernet line cards, SONET/SDH framers, HD-SDI video routers, high-performance DSP co-processing, software-defined radio (SDR) baseband, ASIC prototyping, and high-density protocol bridging. Designers select the EP2SGX130GF40C4NGB when 132K logic elements and 6.375 Gbps transceivers are required in a single device on a commercial-temperature board. When designing with this device, ensure Quartus II software compatibility (the device is supported by Quartus II version 9.1 and later, but newer Quartus releases may no longer include the device in active support). Plan PCB layout with controlled-impedance transceiver channels and adequate thermal dissipation for the 1508-ball FBGA; reference the Altera Stratix II GX Device Handbook and the AN 532 application note for transceiver signal-integrity guidelines. This page synthesizes distributor pricing, drop-in alternative MPNs from the Stratix II GX family, and engineering design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.
EP2SGX130GF40C5 - Stratix II GX 132K LE FPGA, 734 I/O, 1508-FBGA | Intel
The Intel (Altera) EP2SGX130GF40C5 is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers, manufactured on a 90 nm process and housed in a 1508-ball FineLine BGA package. Key headline parameters include 609.76 MHz core operation from a 1.2 V supply, 734 user I/O pins, and integrated high-speed serial transceivers designed for multi-gigabit serial I/O applications. The 'C5' speed grade places it in the commercial temperature range with the mid-tier performance rating. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer can reconfigure after manufacturing. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLD), which in turn belong to the digital logic IC family and ultimately the integrated circuit category. Stratix II GX parts specifically target high-bandwidth serial connectivity, where embedded transceivers, hard PCIe and SERDES blocks, and abundant on-chip memory replace what would otherwise require multiple companion ASICs. Key features of the EP2SGX130GF40C5 include up to 6.7 Mbits of embedded memory, dedicated DSP blocks for fixed- and floating-point math, up to 12 embedded transceivers supporting multi-gigabit data rates, eight PLLs for clock management, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The device also provides hardware multipliers and TriMatrix memory architecture for distributed, block, and shift-register memory configurations. The device architecture combines adaptive logic modules (ALMs) with eight-input fracturable look-up tables (LUTs), allowing a single ALM to implement multiple smaller logic functions and improving effective logic density. Combined with 90 nm process technology and a 1.2 V core, the EP2SGX130GF40C5 achieves high-performance operation with reduced dynamic power relative to the original Stratix family. Embedded transceivers support standards including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of abundant logic, embedded SERDES, and large memory makes it well suited to wire-speed packet processing and high-throughput DSP pipelines. When designing with this FPGA, designers should plan thermal dissipation carefully because the 1508-ball FCBGA package concentrates significant power density. Use Altera's Quartus II design suite (legacy support still available through Intel) for synthesis, place-and-route, and SignalTap II logic analysis. Ensure the PCB has sufficient decoupling and matched-length differential pairs for the high-speed serial channels. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX variants, and practical design considerations not found in the manufacturer datasheet, enabling faster sourcing and second-source decisions.
EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera
The Altera (Intel) EP2SGX130GF40C5ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements across 7,047 Logic Array Blocks (LABs) in a 40x40 mm, 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V nominal core supply, with embedded transceiver support suited for high-speed serial I/O and the speed grade -5 (the '5' position) indicating Altera's mid-to-upper performance bin for this family. An FPGA is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture, falling into the broader taxonomy of programmable logic > logic IC > integrated circuit > semiconductor. FPGAs such as the EP2SGX130 are used to implement arbitrary digital state machines, DSP datapaths, bus bridges, and protocol controllers without resorting to custom ASIC silicon, trading per-unit cost for design flexibility and time-to-market. The Stratix II GX family in particular targets high-speed serial connectivity applications by combining general-purpose FPGA fabric with embedded multi-gigabit transceivers. Key device features for the EP2SGX130 include 132,540 logic elements, 7,047 LABs, embedded transceiver support, a 609.76 MHz internal frequency ceiling, a 1.2 V core, 90 nm process technology, and commercial-extended (0C to 85C) operating temperature grading per the 'C' suffix. The package integrates 1,508 balls on 1 mm pitch in a flip-chip land-grid construction, allowing dense PCB escape routing for high I/O counts. The 'GF40' designator decodes as 'G' for the lead-free, halogen-free Pb-free ball finish, 'F' for flip-chip BGA, and '40' for the 40 mm body size. The 'Stratix' architecture implements adaptive logic modules (ALMs) rather than classic 4-input LUTs, giving higher effective logic density per tile. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI when paired with the appropriate Altera IP core, making the EP2SGX130 a drop-in building block for line cards, baseband processing, and protocol bridge designs. Configuration is loaded via JTAG, passive serial, or active serial configuration schemes supported by the device. Typical applications include high-speed serial backplane interfaces on telecom line cards, PCIe endpoint and root-complex designs, radar and signal-processing front ends, broadcast video processing engines, and military/aerospace digital signal processing subsystems. The wide -C5 speed bin and commercial-extended temperature grading make it suitable for thermally-controlled industrial enclosures and lab-grade equipment. When designing with this device, allocate at least 6 PCB layers for power, ground, and signal escape from the 1,508-ball FC-FBGA, and use Altera's Quartus II design suite (v7.2 or later for the Stratix II family) for synthesis, place-and-route, and power estimation. Decoupling follows the Stratix II GX Power Distribution Network (PDN) application note, typically requiring bulk, mid-frequency, and high-frequency ceramics distributed under the die shadow. This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and package alternatives, and practical design notes not consolidated on the manufacturer product page.
EP2SGX130GF40C5NES - Stratix II GX FPGA 132K LEs 1508-FBGA | Intel
The Intel EP2SGX130GF40C5NES is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers and 734 user I/O pins, housed in a 40x40mm 1508-ball FineLine BGA (FBGA-1508) package. The device integrates up to 6.7 Mbits of embedded memory, embedded multipliers for DSP, and high-speed serial transceivers supporting multi-gigabit serial interfaces, making it one of the flagship devices in the Stratix II GX line. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and (in transceiver variants) multi-gigabit transceivers (MGTs). FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits family. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market at the cost of higher unit price and lower absolute performance-per-watt. The Stratix II GX architecture specifically extends the Stratix II family by adding 3.125 Gbps transceivers for protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet. Key features include 132,540 logic elements, 6.7 Mbits of on-chip RAM, 252 embedded 18x18 multipliers for DSP, 4 PLLs, and 16 global clock networks. The 1508-FBGA package exposes 734 user I/O pins organized into I/O banks that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offer on-chip termination. The C5 speed grade, commercial extended temperature range, and lead-free / RoHS-compliant assembly suit this device to telecom, military-aero, and high-end test equipment. Architecturally the Stratix II GX uses a row-and-column based adaptive logic module (ALM) fabric with DirectDrive and MultiTrack interconnect to reduce routing congestion and improve timing closure. Hard intellectual-property (IP) blocks including transceivers, memory interfaces, and DSP multipliers free programmable fabric for application logic, and the design entry is through the Quartus II design suite. Typical applications include 10-Gigabit Ethernet line cards, Serial RapidIO switches, military secure-radio baseband processing, high-end medical imaging, and ASIC prototyping. Designers choose the EP2SGX130 when their design needs both high logic capacity and embedded multi-gigabit transceivers on a single die. When designing with this device, plan for a 40x40mm PCB footprint with microvia-stack-up capable of routing the 1mm-pitch FBGA-1508 balls, and ensure decoupling capacitance of at least 1uF per power pin per Intel Stratix II GX hardware reference manual guidance. Quartus II PowerPlay early power estimation should be run before pin-out closure because the device can dissipate 15-25W in transceiver-heavy designs. This page synthesizes drop-in alternatives in the same FBGA-1508 footprint, current distributor pricing as of 2026-09-09, and practical PCB and thermal design notes that complement the manufacturer datasheet.
EP2SGX130GF40I4GA - Stratix II GX FPGA, 132K LE, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX130GF40I4GA is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with 132,540 logic elements, 6,747,840 total memory bits, and integrated transceivers, housed in a 1508-ball flip-chip BGA (FCBGA) package at industrial temperature grade. It belongs to the Stratix II GX family, which combines a 90 nm logic fabric with up to 20 multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it engineered for high-speed serial I/O applications such as backplane connectivity, broadband communications, and storage area networks. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) within the broader integrated circuit hierarchy (programmable logic -> semiconductor -> IC) that allows designers to configure hardware functionality after manufacturing. FPGAs sit between ASICs and general-purpose processors in the design flexibility/performance trade-off, offering hardware-timed parallelism, reconfigurability, and high-speed I/O without the NRE cost of an ASIC. The Stratix II GX family is positioned as a high-performance transceiver-enabled tier above the logic-only Stratix II family. Key features include 132,540 logic elements organized into 6,627 Logic Array Blocks (LABs), 734 dedicated input pins and 734 dedicated output pins, 6.7 Mbits of embedded RAM, embedded DSP blocks, and 1.00 mm ball pitch for the FCBGA-1508 package. The device integrates up to 20 transceivers that support PCI Express, Serial RapidIO, XAUI, and other high-speed serial standards. Industrial temperature grade (-40C to +100C ambient) supports deployment in harsh environments beyond commercial-grade parts. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) architecture, which replaces the traditional 4-input LUT with an 8-input fracturable LUT, yielding higher logic utilization and faster clocking networks. Multi-gigabit transceivers feature clock-data recovery, transmit pre-emphasis, and receive equalization to maintain signal integrity over backplane and cable channels at multi-gigabit data rates. Typical applications include high-end telecommunications line cards, broadcast video routers, military radar signal processing, ASIC prototyping, and PCI Express endpoint cards. The integrated transceivers also suit Fibre Channel switches, Serial RapidIO bridges, and 10 Gigabit Ethernet MAC implementations in networking line cards. When designing with this device, ensure the PCB has matched-length differential routing for the transceiver channels and a solid reference plane under the BGA footprint for power delivery. Plan FPGA configuration carefully - the device requires a configuration device or JTAG chain for in-system programming, and thermal management at industrial temperatures is critical given the FCBGA package's thermal resistance. This page synthesizes distributor inventory, same-package Stratix II GX drop-in alternatives, and practical design guidance not available in the manufacturer datasheet alone.
EP2SGX300DF780C5N - Stratix II GX 300K LEs, 20x Transceivers | Altera
The Altera EP2SGX300DF780C5N is a high-density, high-performance Stratix II GX FPGA delivering 300,000 equivalent logic elements (LEs), 18,210 Kbits of embedded memory, and 20 multi-gigabit transceivers in a 780-pin FineLine BGA package, fabricated on a 90 nm process with 1.2 V core voltage. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> high-speed transceivers integrated FPGAs. Stratix II GX FPGAs target high-bandwidth serial I/O applications where the device must both process logic and move data at multi-gigabit rates, making them a member of the broader power management and digital signal processing ecosystem. Key features include 20 full-duplex transceivers supporting data rates from 600 Mbps to 6.375 Gbps, 384 dedicated 18x18 multipliers for DSP, 8 PLLs, and 12 global clock networks. The device integrates 16 channels of on-chip SERDES termination, PCI Express hard IP, and supports multiple serial protocols including PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The EP2SGX300DF780C5N is built on Altera's adaptive logic module (ALM) architecture, replacing the older 4-input LUT structure with 8-input fracturable ALMs. This architecture delivers up to 2x performance per logic element compared to prior generations while reducing compile times. The transceiver blocks each contain dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) circuitry, supporting both AC and DC coupling. Typical applications include high-end telecommunications equipment, 10 Gbps data aggregation switches, base station channel cards, broadcast video processing systems, and high-performance computing accelerators. The device's hard PCI Express endpoint and root complex support make it ideal for high-bandwidth adapter cards and backplane designs. When designing with this FPGA, power estimation should be performed early using the Altera PowerPlay early power estimator, as the 6.375 Gbps transceivers can dominate total power consumption. Designers should also pay attention to PCB layer stackup to maintain signal integrity for the 6.375 Gbps serial links; recommended stackups are documented in the Stratix II GX Device Handbook, Volume 2. This page synthesizes real-time distributor pricing, drop-in Altera Stratix II GX and Stratix IV GX alternatives in the same FineLine BGA-780 package, and practical design notes not consolidated in the manufacturer datasheet — a resource for BOM consolidation and supply-chain risk reduction.
EP2SGX30CF780C3 - Stratix II GX FPGA, 33.88K LE, 780-BGA | Intel
The Intel (Altera) EP2SGX30CF780C3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded RAM, and 361 user I/Os in a 780-ball FineLine BGA package. It is fabricated on a 90 nm process and features 1,694 Logic Array Blocks (LABs), making it well suited for data-path-heavy designs that require both high logic density and substantial on-chip memory. A Field-Programmable Gate Array (FPGA) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy: programmable logic IC -> FPGA -> SRAM-programmable FPGA -> high-density FPGA with transceivers. They allow hardware designers to implement custom parallel processing pipelines, custom I/O protocols, and glue logic without the NRE cost of an ASIC, which is why Stratix II GX parts are commonly used in prototyping and low-volume production. Key specifications of the EP2SGX30CF780C3 include up to 33,880 logic elements, 1,694 LABs, 1,369,728 RAM bits, 361 user I/Os, embedded 3.125 Gbps transceivers for serial connectivity, and support for DDR/DDR2/QDRII external memory interfaces via dedicated PHY. The 780-ball FineLine BGA package supports high I/O count while keeping the PCB footprint manageable for mid-complexity boards. Operating temperature is graded commercial (0C to +85C), and the speed grade is -3. The Stratix II GX architecture uses a logic-element fabric with adaptive look-up tables (ALUTs), a TriMatrix memory subsystem, and dedicated DSP blocks. The GX suffix indicates the integration of high-speed serial transceivers, which historically positioned this family for communication-infrastructure, broadcast video, and high-speed serial-protocol bridging applications. Designers should pay attention to Quartus II tool support, as Quartus versions for legacy Stratix II devices are mature but no longer under active development, and Intel recommends migrating to Stratix IV/V families for new designs. Typical applications include communication infrastructure (protocol bridges, backplane SERDES), broadcast video processing, industrial test and measurement, ASIC prototyping, and high-speed data acquisition. The combination of transceivers, block RAM, and abundant logic density makes the EP2SGX30CF780C3 suitable for custom packet-processing engines and for replacing discrete logic + memory glue in mid-complexity designs. When designing with this part, ensure your PCB layout supports the 1.0 mm or 1.27 mm pitch BGA fanout and that signal-integrity simulations are run on the transceiver channels. Because the Stratix II family is mature, plan firmware/quartus tool availability in your long-term roadmap. For new designs, also evaluate Stratix IV GX, Cyclone V GX, or Cyclone 10 GX as modern drop-in-compatible successors with active toolchain support. This page synthesizes distributor stock, datasheet parameters, drop-in compatible Stratix II GX variants, and design notes not aggregated on a single manufacturer page.
EP2SGX30CF780C3N - Stratix II GX FPGA, 33880 Cells | Intel
The Intel EP2SGX30CF780C3N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs), featuring 33,880 logic cells, a 717 MHz maximum operating frequency, and integrated transceivers in a 780-pin FC-FBGA package. Built on a 90 nm CMOS process and supplied by a 1.2 V core rail, this device is engineered for high-bandwidth serial I/O, embedded processing, and digital signal processing (DSP) applications in communications infrastructure, video imaging, and storage systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than by fixed mask layers. Within the broader taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, and Stratix II GX represents Intel's mid-to-high density tier with built-in multi-gigabit transceivers, dedicated DSP blocks, and TriMatrix embedded memory. The 'GX' suffix denotes integrated serializer/deserializer (SERDES) channels, distinguishing this family from the non-transceiver Stratix II line. The 33,880 logic elements are organized into 33,880 CLBs (configurable logic blocks) backed by approximately 1.4 Mbits of embedded RAM distributed across TriMatrix memory structures, and the device integrates dedicated 18-bit x 18-bit multipliers for DSP operations. The integrated transceiver block supports multiple serial protocols, eliminating external PHY chips in many designs and reducing both board area and bill of materials cost. The 780-ball fine-pitch BGA package exposes roughly 600 user I/O pins, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with on-chip termination. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration via EPC serial configuration devices. Designers using the Quartus II design software can target this device with either VHDL or Verilog HDL and benefit from the mature IP library that has shipped with the Quartus toolchain since the early 2000s. Typical applications include 3G/4G wireless baseband processing, high-speed serial backplane switching, broadcast video processing, and military radar signal chains. The combination of logic density and embedded transceivers makes the EP2SGX30CF780C3N particularly well-suited to line cards that aggregate multiple SFP/SFP+ or SERDES links while performing protocol bridging or packet classification. Compared with newer Cyclone V or Arria 10 FPGAs, the Stratix II GX family is fabricated on a 90 nm process and consumes noticeably more static power, so most new designs now favor the Stratix V or Stratix 10 families instead. When designing with the EP2SGX30CF780C3N, verify that the Quartus II version in use supports the device family (Quartus II 9.1 or earlier) and provide adequate thermal relief for the 780-ball FC-FBGA, since high transceiver utilization can push junction temperatures into the 100 C range without airflow. This page consolidates distributor pricing, drop-in alternatives within the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX30CF780C3NGB - Stratix II GX FPGA, 33.8K LE, FC-FBGA-780
The Altera (Intel) EP2SGX30CF780C3NGB is a member of the Stratix II GX family of high-performance FPGAs integrating up to 33,880 logic elements (LEs), 1,694 logic array blocks (LABs), and 1,369,728 bits of on-chip RAM in a 780-ball flip-chip fine-line BGA (FC-FBGA-780) package. It is built on a 90 nm CMOS process and operates from a 1.2 V core supply with a maximum internal clock frequency near 816.9 MHz (per the Stratix II GX device handbook). The device provides 361 user I/O pins and integrates dedicated 3.125 Gbps transceivers for high-speed serial connectivity, making it suitable for serial backplane, chip-to-chip, and PCI Express applications. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic and routing are configured by the end user after manufacture. FPGAs belong to the broader programmable logic (PLD) category, which sits between fixed-function ASICs and software-programmable processors in terms of flexibility, parallelism, and time-to-market. Modern high-end FPGAs like Stratix II GX add embedded transceivers, memory blocks, DSP blocks, and PLL/clock-management hardware, allowing them to serve as complete system-on-chip (SoC) platforms for wired communications, signal processing, and high-bandwidth I/O aggregation. The EP2SGX30CF780C3NGB integrates embedded transceivers capable of multiple data rates, dedicated hardware multipliers for DSP, and TriMatrix memory blocks. The flip-chip BGA package supports the high I/O count and high transceiver bandwidth required by the device, while keeping lead inductance low enough for multi-gigabit signaling. Per the Stratix II GX device family datasheet, this device family targets high-speed serial I/O and high-density parallel processing. Typical applications include telecommunications line cards and backplanes, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), video broadcast and imaging pipelines, defense and aerospace signal processing, and test & measurement instrumentation. The combination of high logic density and integrated transceivers allows designers to consolidate multiple discrete bridge/aggregation chips onto a single Stratix II GX device. When designing with this FPGA, ensure proper power sequencing of the 1.2 V core and the transceiver analog supplies, and follow Altera's thermal management guidelines for flip-chip BGA packages. Designers should consult the Stratix II GX pin connection guidelines and the Quartus II support resources for transceiver channel placement and board layout to meet signal-integrity and SI/PI requirements. This page synthesizes distributor availability, Stratix II GX family variants, and design considerations not always obvious from the manufacturer datasheet alone, with cross-brand alternatives sourced from current cross-reference data and XAIPART-internal part pages.
EP2SGX30CF780C4 - Stratix II GX FPGA 33.88K LE | Intel
The Intel EP2SGX30CF780C4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/Os in a 780-ball flip-chip BGA package. Operating at up to 732.1 MHz with a 1.2 V core, this device targets high-performance digital signal processing, serial connectivity, and embedded processing applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacturing, sitting in the broader hierarchy of programmable logic devices (PLD) -> CPLD/FPGA -> logic IC -> integrated circuit. FPGAs combine configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (memory, transceivers, DSP blocks, PLLs). The Stratix II GX family extends the Stratix II architecture by integrating multi-gigabit transceivers, making it suited for serial backplane, telecom, and high-speed serial I/O applications. Key features of the EP2SGX30CF780C4 include 16 transceivers supporting multi-gigabit serial data rates, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, on-chip tri-matrix memory supporting true dual-port RAM, ROM, and FIFO modes, and up to 361 single-ended user I/Os. The 780-pin FBGA package provides the routing density required for high-pin-count high-performance designs. The device architecture is built around Adaptive Logic Modules (ALMs) that implement combinational logic, arithmetic, and register functions in 8-input look-up tables with associated registers. Hard IP blocks for transceivers, PLLs, and memory controllers offload common functions from the programmable fabric. The 90 nm process technology balances performance and power at the time of introduction, while the 1.2 V core VCC minimizes dynamic power. Typical applications include 10 Gbps and below serial backplane interfaces, telecom line cards, high-end test and measurement equipment, ASIC prototyping, high-throughput digital signal processing for video and imaging, and embedded computing platforms requiring custom I/O bridging. The integration of transceivers with general-purpose FPGA fabric enables single-chip protocol bridges and custom ASIC replacements. When designing with the EP2SGX30CF780C4, allocate sufficient PCB layers for the 780-ball FBGA escape routing, use controlled-impedance routing for the multi-gigabit transceiver channels, and provide multiple low-noise supply rails for the transceiver analog supplies. Quartus II software is the primary design entry, synthesis, and place-and-route toolchain. This page synthesizes distributor stock visibility, parametric alternatives within the Stratix II GX family, and practical design notes that complement the official Intel datasheet and the Quartus II device handbook.
EP2SGX30CF780C4N - Stratix II GX 30K FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C4N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 RAM bits, and 361 user I/Os in a 780-ball Flip-Chip FineLine BGA package. Built on a 90 nm process and operating from a 1.2 V core supply, the device combines a high-density programmable logic fabric with up to 20 embedded transceivers capable of multi-gigabit serial I/O, making it a drop-in logic platform for high-speed serial interface bridging, packet processing, and backplane aggregation. An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable routing that the designer can re-wire after manufacture using a hardware description language. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy: they trade unit cost for parallelism, time-to-market, and the ability to revise functionality in the field, while the transceiver-equipped Stratix II GX family specifically targets serial-link applications such as telecom backhaul, RAID controllers, and protocol bridging. Key features include 33,880 logic elements organized into 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded SRAM, and embedded multipliers supporting DSP functions such as FIR filtering and FFT butterflies. The 'C' speed grade and '-4' device-grade suffix denote a commercial temperature range and mid-speed timing closure, while 'N' indicates lead-free / Pb-free termination suitable for RoHS-compliant assemblies. Architecturally, the Stratix II GX combines an adaptive logic module (ALM) structure with TriMatrix embedded memory (MLAB, M512, M4K, M-RAM) and dedicated DSP blocks. The integrated CDR/PHY-based transceivers support standard serial rates from 600 Mbps up to 6.375 Gbps, with dynamic reconfiguration between rates; this lets one Stratix II GX device replace multiple discrete PHY chips and a companion FPGA in line-card designs. Typical applications include 10G Ethernet MAC/PHY bridging, SONET/SDH framer and mapper designs, PCIe Gen1 endpoint designs via soft IP, high-speed serial protocol analyzers, and broadcast video routing. The 780-FBGA package also makes it suitable for densely populated line cards where the 1.2 V core and dedicated PLL supply pins simplify multi-rail power design. When designing with this device, ensure a controlled-impedance stack-up for the 6.375 Gbps serial links, provision proper PLL supply filtering, and consult the Quartus II design suite toolchain for transceiver configuration bitstreams. JTAG and serial configuration via EPC16 or EPC64 flash is the standard bring-up path. This page synthesizes verified distributor stock, parametric equivalents, and Stratix II GX family design notes not found in the standalone manufacturer datasheet, giving the engineer an at-a-glance summary of pin compatibility, lifecycle risk, and packaging trade-offs.
EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C5 is a high-density, high-performance Stratix II GX family FPGA fabricated on a 90 nm process, integrating 33880 logic elements in a 780-ball FineLine BGA (FBGA) package. The device targets high-speed serial I/O, embedded processing, and DSP applications, featuring up to 361 user I/O pins, dedicated transceiver support for multi-gigabit serial links, and 1.2 V core operation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that implements arbitrary digital logic through programmable logic blocks (LEs/ALMs), interconnect, and I/O cells, occupying the same role as a custom ASIC but with field-reprogrammable flexibility. Stratix II GX FPGAs specifically embed multi-gigabit transceivers alongside the general-purpose fabric, making them part of the programmable logic family hierarchy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> high-speed-transceiver-enabled FPGA -> embedded DSP + transceiver FPGA. Key features include 33880 logic elements, 1694 LABs, embedded multiplier blocks and M512/M4K/M-RAM memory tiers, four phase-locked loops for clock management, and high-speed transceivers with embedded CDR supporting common serial standards. The device operates at a core voltage of 1.2 V and supports extended industrial temperature grades, with the "C5" suffix indicating the -5 speed grade and "C" indicating commercial temperature. Stratix II GX uses an adaptive logic module (ALM) architecture that combines LUT-based and register-rich operation, allowing a single ALM to implement wider functions than 4-input LUT predecessors, improving logic efficiency. The device integrates hard IP for PCI Express, Gigabit Ethernet, Serial RapidIO, and other serial protocols, plus dedicated DSP blocks for fixed- and floating-point arithmetic. Typical applications include high-end communication backplanes, test and measurement instrumentation, broadcast video processing, medical imaging accelerators, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes this part well-suited for protocol bridging, channelized DSP, and OTU/SONET framer designs. When designing with this part, designers should follow Altera/Intel Stratix II GX board design recommendations: maintain matched-length differential pairs for the high-speed serial links, allocate sufficient decoupling near every VCC/VCCA/VCCP rail, and validate signal-integrity through IBIS-AMI simulation before committing to layout. This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix II GX design notes that are not duplicated in the manufacturer datasheet handbook.
EP2SGX30CF780C5N - Stratix II GX FPGA, 30K LE, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX30CF780C5N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 33,880 logic cells (equivalent to ~30K logic elements), 1,694 LABs, 361 user I/Os, and 1,369,728 bits of embedded memory in a 780-ball FineLine BGA package. The device is specified to operate with a 1.2 V core supply and supports reference clock frequencies up to 609.76 MHz, with the C5 speed grade indicating a -5 internal speed bin targeting high-performance logic and signal-processing workloads. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs/LABs), dedicated DSP blocks, on-chip memory, and programmable I/O structures on a single die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose CPUs/GPUs (which execute software) and application-specific integrated circuits (ASICs), offering hardware-level parallelism with the flexibility to be reconfigured in-system. The Stratix II GX family extends the base Stratix II logic fabric with embedded multi-gigabit transceivers (MGTs), making it well suited for high-speed serial I/O. Key features of the EP2SGX30CF780C5N include up to 12 transceiver channels capable of multi-gigabit serial rates, on-chip TriMatrix memory totalling ~1.4 Mbit, embedded DSP blocks for high-throughput multiply-accumulate operations, and a 29 x 29 mm FBGA-780 footprint with 1.0 mm ball pitch. The device supports configuration via JTAG, passive/active serial, and passive/active parallel modes through the dedicated MSEL and nCONFIG pins. Architecturally, Stratix II GX combines an adaptive logic module (ALM) fabric with high-speed transceivers and dedicated PLL/clock networks. Compared to discrete logic + serializer implementations, this integration reduces board area, simplifies signal integrity at multi-Gbps rates, and allows the same die to be deployed across multiple product variants by changing only configuration data. Typical applications include 3G/4G wireless baseband processing, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), high-performance digital signal processing (radar, software defined radio), broadcast video processing, and high-speed data acquisition systems. The 361 user I/Os also support LVDS, LVTTL, and SSTL interfacing to external memories such as DDR/DDR2 SDRAM. When designing with this device, plan power sequencing around the 1.2 V core supply and the separate transceiver supply rails, and follow Intel's Stratix II GX pin connection guidelines to ensure unused I/O and transceiver pins are biased correctly. Engineers should also budget for the higher static power typical of 90 nm FPGAs and provide sufficient PCB cooling for sustained high-utilisation workloads. This page synthesises distributor availability, drop-in alternatives from the same Stratix II GX family, and practical design considerations not always explicit in the manufacturer datasheet, helping engineers select, source, and deploy the EP2SGX30CF780C5N with confidence.