PIC18LF2321-I/ML
PIC18LF2321-I/ML - 8KB Flash 8-bit MCU, 40MHz, 28-QFN | Microchip
The Microchip Technology PIC18LF2321-I/ML is a low-voltage 8-bit CMOS Flash microcontroller from the PIC18F family, featuring 8 KB (4K x 16) of Flash program memory, 512 bytes of SRAM, and 256 bytes of EEPROM in a 28-pin QFN (6x6 mm) package with exposed pad. It executes instructions at 10 MIPS (40 MHz clock, 100 ns instruction cycle) and integrates nanoWatt power management technology for sleep-mode currents in the nA range.
This device is part of the PIC microcontroller family, which is a RISC (Reduced Instruction Set Computer) architecture widely used in embedded control applications. PIC microcontrollers are 8-bit MCUs that combine Flash program memory, RAM, EEPROM, configurable digital I/O, and on-chip peripherals (ADC, timers, UART, SPI, I2C) on a single chip. They sit within the broader hierarchy of microcontrollers -> microprocessors -> ICs -> semiconductors, and are favored in industrial, automotive, consumer, and IoT applications for their deterministic performance, low power, and ease of programming through MPLAB X IDE.
The PIC18LF2321-I/ML features a 10-bit ADC with up to 28 channels (varies by package), multiple capture/compare/PWM modules, an enhanced USART, MSSP (SPI/I2C) interface, and a 25 I/O pin count in the 28-QFN package. It supports a wide operating voltage range of 2.0V to 5.5V (LF variant), making it suitable for both battery-powered and 5V regulated systems. The /ML suffix indicates the 28-pin QFN industrial temperature grade (-40C to +85C).
Architecture-wise, this device uses a 16-bit-wide instruction word with an 8-bit data path, allowing most instructions to execute in a single cycle. The integrated nanoWatt Technology provides multiple power-managed modes (Idle, Sleep, and Run) for battery-sensitive designs, while the self-reprogrammable Flash under software control enables flexible field updates.
Typical applications include industrial sensor nodes, low-power IoT edge devices, battery-powered instrumentation, HVAC control, motor control loops, USB-to-UART bridges, and consumer appliances. The combination of 8 KB Flash, 25 I/O, and integrated 10-bit ADC allows engineers to replace multiple discrete components with a single chip.
Design consideration: the exposed thermal pad on the QFN package must be soldered to the PCB ground plane for proper thermal dissipation, RF performance, and mechanical reliability. Always follow Microchip's QFN PCB layout guidelines to avoid solder joint fatigue.
This page synthesizes distributor pricing, drop-in alternative MPNs from the Microchip PIC18 family, and practical design notes not aggregated on the manufacturer product page.
Cotización
Contacto