PIC24EP32GP202-E/MM
PIC24EP32GP202-E/MM - 60 MIPS 32KB Flash 16-bit MCU | Microchip
The Microchip Technology PIC24EP32GP202-E/MM is a 16-bit PIC® microcontroller featuring a 60 MIPS dsPIC/PIC24E core, 32 KB (10.7K x 24) of Flash program memory, and 4 KB of SRAM, packaged in a 28-pin QFN-S (6x6 mm) with exposed thermal pad. It belongs to the PIC24EP "GP" general-purpose family, which integrates op amps, a CTMU (Charge Time Measurement Unit), and a Peripheral Trigger Generator (PTG) for high-performance analog and signal-chain applications. Operating voltage spans 3.0 V to 3.6 V, and the device supports -40 °C to +125 °C industrial/extended temperature ranges under the "-E" suffix.
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (typically Flash), working memory (SRAM), and a rich set of peripherals (ADC, timers, communication ports, GPIO) on a single silicon die. MCUs sit at the heart of nearly every embedded product, executing firmware that reads sensors, drives actuators, and exchanges data over serial buses. Within the broader taxonomy, the PIC24EP belongs to the PIC24E sub-family of Microchip's 16-bit PIC® MCUs, which sit between 8-bit PIC and 32-bit PIC32 devices. The 16-bit modified Harvard architecture delivers a strong balance of deterministic interrupt response, code density, and DSP-friendly instruction set for motor control, power conversion, and instrumentation applications.
Key features of the PIC24EP32GP202-E/MM include a 60 MIPS core, integrated op amps, CTMU for capacitance/temperature/time measurement, a 10-bit (minimum) ADC with up to 1.1 Msps conversion, multiple PWM outputs, and the Peripheral Trigger Generator for hardware-level sequencing without CPU intervention. The 28-QFN-S package exposes a thermal pad, which must be soldered to the PCB ground plane to meet the datasheet's thermal specifications.
Typical applications include industrial sensor conditioning, LED lighting control, BLDC/PMSM motor control, medical instrumentation, automotive body and sensor modules (AEC-Q100 variants exist), and any general-purpose embedded control requiring deterministic 16-bit performance. The combination of integrated op amps and CTMU makes this family particularly attractive for signal-chain designs where component count and BOM cost must be minimized.
When designing with this part, solder the exposed pad (EP) directly to a continuous ground plane on the top layer to achieve the specified thermal resistance. Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed as close to each pin as possible, and follow Microchip's recommended supervisor / POR sequencing. For migration to other variants, note that Flash size, pin count, and temperature suffix all affect both the part number and the firmware linker script.
This page synthesizes authorized distributor pricing as of 2026-09-29, Microchip's official PIC24EP32GP202 family datasheet, and curated drop-in alternatives for engineers who need a quick substitution path for this 28-QFN-S footprint.
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