PIC24FJ64GB202T-I/SO
PIC24FJ64GB202T-I/SO - 16-bit 32MHz MCU 64KB Flash USB | Microchip
The Microchip Technology PIC24FJ64GB202T-I/SO is a 16-bit microcontroller from the PIC® XLP™ 24F family, integrating a full-speed USB 2.0 device/host/OTG controller, an AES crypto module, and eXtreme Low Power (XLP) technology. The device provides 64KB of Flash program memory, 8KB of RAM, and runs at up to 32 MHz MIPS performance in a 28-pin SOIC wide-body package (0.295 inch / 7.50 mm width).
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripheral interfaces such as timers, ADC, UART, SPI, I2C, and increasingly USB. In the system hierarchy, the PIC24FJ belongs to the 16-bit MCU tier, sitting between 8-bit MCUs (e.g., PIC16, PIC18) and 32-bit MCUs (e.g., PIC32MX, STM32). The "FJ" designation signals the use of the modified Harvard architecture with a wide data path, while "XLP" denotes Microchip's nanoWatt XLP power-saving technology with sleep currents in the microamp range.
Key features include 64KB (64K x 8) Flash, 8KB RAM, integrated USB 2.0 full-speed transceiver (device/host/OTG), peripheral pin select (PPS) for flexible signal routing, up to 21 general-purpose I/O pins, a 10-bit ADC, multiple PWM/CCP/SCCP modules, two UART, two SPI, and two I2C interfaces. The device supports an industrial operating temperature range of -40°C to +85°C and operates from a single 2.0V to 3.6V supply rail. The integrated crypto module supports AES encryption with 128/192/256-bit keys for secure data applications.
The PIC24FJ64GB202 family uses a 16-bit modified Harvard CPU with a 16 x 16 hardware multiply, single-cycle bit manipulation, and a deterministic interrupt controller. Its XLP technology provides multiple power-saving modes, including deep sleep with RTCC retention drawing less than 1 µA typical, enabling battery-powered designs that must run for years on a single cell. The on-chip USB 2.0 transceiver eliminates the need for an external PHY, simplifying BOM and PCB area.
Typical applications include low-power USB peripherals, secure IoT sensor nodes, consumer medical devices, data loggers, USB HID peripherals, secure token authenticators, and battery-powered embedded systems. The 28-pin SOIC package is friendly to hand-soldering and rework for prototypes and small-batch production.
Design consideration: the 28-SOIC package lacks an exposed thermal pad, so at high CPU loads designers should monitor the internal die temperature sensor and gate peripheral activity to keep junction temperature below the 125°C maximum. Note that the "T" suffix denotes Tape & Reel packaging; for prototyping or low-volume builds, request the tray-packaged variant PIC24FJ64GB202-I/SO.
This page synthesizes distributor pricing, drop-in alternatives from the same SOIC-28 footprint, and practical design notes not found in the manufacturer datasheet alone, giving embedded engineers a one-stop comparison resource for USB-enabled PIC24F MCU selection.
Cotización
Contacto