AD7893ACHIPS-2 - 12-Bit, 117 kSPS ADC | Analog Devices
N.º de pieza: AD7893ACHIPS-2 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $18.95 | $9.475,00 |
| 1.000 | $16.4 | $16.400,00 |
AD7893ACHIPS-2 Descripción general
A successive-approximation ADC (SAR ADC) is a type of analog-to-digital converter that uses a binary-search algorithm to digitize an analog input. Each conversion takes one clock cycle per bit of resolution, so a 12-bit SAR ADC produces one sample in 12 conversion clock periods. SAR ADCs offer deterministic latency, no pipeline delay, and excellent DC accuracy, making them the dominant choice for multiplexed data acquisition systems, industrial process control, and instrumentation front-ends where both high accuracy and fast single-shot response are required. The AD7893 family sits in the product hierarchy: ADC -> data converter -> signal chain IC -> mixed-signal semiconductor.
Key specifications include 12-bit resolution, 117 kSPS maximum sampling rate (model -2 variant), ±10 V analog input range, single +5 V supply, low power dissipation, and an on-chip track/hold. The CHIPS suffix denotes the bare die / wafer form intended for hybrid module assembly, multi-chip modules, and applications requiring a smaller footprint or hermetic packaging beyond what the 8-pin mini-DIP / SOIC plastic parts can offer. The die is qualified to Analog Devices' standard commercial operating temperature range and is shipped in waffle packs or Gel-Pak carriers.
The AD7893 architecture uses a capacitive charge-redistribution DAC core, a high-speed comparator, and a successive-approximation register, all clocked by an internal oscillator that can be overdriven by an external clock for precise sampling-rate control. This architecture delivers true 12-bit linearity, ±1 LSB maximum INL/DNL (typical), and low input capacitance, simplifying front-end drive requirements.
Typical applications include industrial process control and PLC analog input modules, multi-channel data acquisition systems on PC/104 and CompactPCI boards, medical instrumentation front-ends, and avionics / military signal-conditioning modules where the bare-die form is preferred for size, weight, or hermeticity reasons.
When designing with the AD7893ACHIPS-2, the user is responsible for die attachment, wire bonding, and package-level ESD protection - the bare-die option is intended for hybrid assembly houses with MCM/COB capability, not for hand-soldered prototypes. A proper anti-aliasing filter must precede the analog input to avoid fold-back of out-of-band noise.
This page synthesizes distributor pricing, parametric specifications, drop-in alternatives, and practical design notes for the AD7893ACHIPS-2 not found on a typical distributor listing.
Alternativas directas para AD7893ACHIPS-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con AD7893ACHIPS-2 (mismo factor de forma y huella) — difiere en Supply Voltage, Architecture, Conversion Time, Operating Temperature, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
AD7893AN-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
AD7893AR-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
AD7893ARZ-2REEL
✅ Sustitución directa✓ En stock
$10.45 / unidad
Ver hoja de datos →AD7893SQ-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
AD7893ACHIPS-5
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
AD7892BR-1
✅ Sustitución directa✓ En stock
$38.9 / unidad
Ver hoja de datos →AD7893ACHIPS-2 Valores máximos y características eléctricas
| Resolución | 12 bits |
| Conversion Rate (throughput) | 117 kSPS (model -2) |
| Analog Input Range | ±10 V |
| Tensión de alimentación | +5 V single |
| Architecture | SAR (Successive Approximation) with on-chip track/hold |
| Process Technology | LC²MOS (Linear Compatible CMOS, mixed bipolar + CMOS) |
| Integral Nonlinearity (INL) | ±1 LSB max |
| Differential Nonlinearity (DNL) | ±1 LSB max |
| Package Type | Bare die / chip (CHIPS suffix) |
| Available Other Packages | 8-pin mini-DIP, 8-pin SOIC |
| Rango de temperatura de funcionamiento | 0 °C to +70 °C (commercial) |
| Digital Interface | Parallel (12-bit word) |
| Sample-and-Hold | On-chip track/hold amplifier |
| AEC-Q100 Automotive Qualification | not_qualified |
Guía de configuración de pines de AD7893ACHIPS-2 8-pin mini-dip, 8-pin soic
Configuración de pines para AD7893ACHIPS-2 (encapsulado 8-pin mini-dip, 8-pin soic). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para AD7893ACHIPS-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
AD7893ACHIPS-2 es adecuado para 6 aplicacións: Hybrid Module Data Acquisition Front-End, Industrial Process Control PLC Analog Input Module, Medical Instrumentation Analog Front-End, Avionics / Military Signal Conditioning Module, PC/104 and CompactPCI Data Acquisition Boards, Portable Test and Measurement Instrument.
Hybrid Module Data Acquisition Front-End
The AD7893ACHIPS-2's bare-die form is ideal for hybrid module data acquisition front-ends where board area is constrained and a hermetic / multi-chip module (MCM) assembly is preferred. Its 117 kSPS throughput and 12-bit resolution support per-channel sample rates of 100 kHz with bandwidth margin for anti-aliasing filter roll-off, while the ±10 V input range accepts industrial ±10 V transducer signals directly without external signal conditioning. The single +5 V supply simplifies the hybrid's internal power distribution, and the LC²MOS process ensures low noise contribution from the analog input. Paired with an AD822BRZ instrumentation amplifier for input buffering, the AD7893ACHIPS-2 forms the front-end of compact DAQ modules used in industrial PLC racks and avionics line-replaceable units.
Recomendado
Industrial Process Control PLC Analog Input Module
In industrial process control PLC analog input modules, the AD7893ACHIPS-2's ±10 V input range matches the standard industrial analog signal level (±10 V or 4-20 mA via shunt), allowing direct connection to PLC backplane analog input modules. The 12-bit resolution (1 LSB = 4.88 mV over ±10 V) is sufficient for process variable monitoring, and the 117 kSPS throughput supports scanning 8-16 multiplexed channels at typical PLC cycle rates. The single +5 V supply and on-chip track/hold reduce BOM count, while the LC²MOS process tolerates the noisy industrial supply environment. Companion components include the ADG1208 / ADG1209 multiplexers for channel expansion and the ADuM1411ARWZ isolator for field-side galvanic isolation.
Recomendado
Medical Instrumentation Analog Front-End
The AD7893ACHIPS-2 fits medical instrumentation analog front-ends where the 12-bit resolution (4.88 mV LSB at ±10 V) and 117 kSPS sampling rate are sufficient for ECG, EMG, and patient monitoring front-ends after sensor amplification. The bare-die form factor enables miniaturized patient-wearable designs and integration into disposable sensor modules. The single +5 V supply and low power dissipation simplify battery-powered operation. The AD822BRZ instrumentation amplifier provides ECG signal amplification, and the AD780BRZ voltage reference supports ratiometric measurement of strain-gauge and bio-sensor signals; the AD7893ACHIPS-2 digitizes the conditioned analog output with 12-bit accuracy.
Recomendado
Avionics / Military Signal Conditioning Module
Avionics and military signal conditioning modules require high-reliability ADCs that can be integrated into ruggedized hybrid assemblies. The AD7893ACHIPS-2 bare-die form, combined with the military-grade AD7893SQ-2 ceramic DIP option on the same silicon, allows designers to prototype with SOIC and migrate to a hermetic MCM for flight-qualified hardware. The 117 kSPS sampling rate supports vibration monitoring and inertial sensor readout at multi-kHz rates, and the ±10 V input range directly accepts avionics bus analog signals. The companion AD822BRZ instrumentation amplifier handles differential sensor inputs, while the AD780BRZ provides a stable reference over the full military temperature range.
Recomendado
PC/104 and CompactPCI Data Acquisition Boards
PC/104 and CompactPCI data acquisition boards benefit from the AD7893ACHIPS-2's small footprint when assembled in hybrid MCM format, allowing high channel density on 16-bit ISA and PCI form factors. The 12-bit, 117 kSPS performance enables per-channel sample rates of 100 kHz for sonar, vibration, and accelerometer data logging; the ±10 V input range matches industrial sensor signals directly. The single +5 V supply is convenient because PC/104 and CompactPCI boards typically derive a +5 V rail. The ADG1208 8:1 multiplexer expands single-channel ADCs to 8 channels per chip, and the ADuM1411ARWZ isolator protects host CPU logic from field-side transients.
Recomendado
Portable Test and Measurement Instrument
Portable test and measurement instruments such as handheld multimeters and battery-powered oscilloscope front-ends benefit from the AD7893ACHIPS-2's single +5 V supply, low power dissipation, and compact bare-die footprint. The 12-bit resolution at 117 kSPS supports measurement of ±10 V signals with 4.88 mV LSB, sufficient for general-purpose T&M. The hybrid/MCM assembly allows miniaturization for hand-held form factors. The AD822BRZ instrumentation amplifier handles input attenuation and buffering, while the AD780BRZ provides a stable internal reference for absolute voltage measurements; the AD7893ACHIPS-2 digitizes the conditioned analog signal into the host microcontroller or DSP for display and processing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para AD7893ACHIPS-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | AD7893AN-2 | AD7893AR-2 | AD7893ARZ-2REEL | AD7893SQ-2 | AD7893ACHIPS-5 | AD7892BR-1 |
|---|---|---|---|---|---|---|---|
| Package | Bare die / chip (CHIPS) | 8-pin mini-DIP | 8-pin SOIC | 8-pin SOIC (RoHS) | 8-pin ceramic DIP | Bare die / chip | 8-pin SOIC |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits |
| Sampling Rate | 117 kSPS | 117 kSPS | 117 kSPS | 117 kSPS | 117 kSPS | 117 kSPS | 500 kSPS |
| Input Voltage Range | ±10 V (model -2) | ±10 V (model -2) | ±10 V (model -2) | ±10 V (model -2) | ±10 V (model -2) | 0 to +5 V (model -5) | 0 to +5 V (model -1) |
| Supply Voltage | +5 V single | +5 V single | +5 V single | +5 V single | +5 V single | +5 V single | ±5 V bipolar |
| Architecture | SAR, on-chip T/H | SAR, on-chip T/H | SAR, on-chip T/H | SAR, on-chip T/H | SAR, on-chip T/H | SAR, on-chip T/H | SAR, on-chip T/H |
| Assembly Format | Bare die / MCM | Through-hole PCB | Surface-mount PCB | Surface-mount PCB (RoHS) | Through-hole, military | Bare die / MCM | Surface-mount PCB |
Diferenciadores clave
- Bare-die package for hybrid / MCM assembly (frente a AD7893ARZ-2REEL (SOIC-8))
- Single +5 V supply simplifies hybrid power distribution (frente a AD7892BR-1 (requires ±5 V bipolar supply))
- ±10 V input range accepts industrial sensor signals directly (frente a AD7893ACHIPS-5 (0 to +5 V input))
Notas de diseño
The bare-die (CHIPS) variant is intended only for hybrid/MCM assembly houses with die-attachment and gold-wire-bonding capability. Do not attempt to hand-solder bare die - ESD and mechanical damage will destroy the part. For prototype evaluation, choose the AD7893ARZ-2REEL SOIC-8 package instead; the silicon is identical. A proper anti-aliasing filter (typically 1 kΩ / 1 nF RC) must precede the analog input pin to prevent fold-back of out-of-band noise into the baseband - this is the single most common reason for failed EMC compliance in AD7893 designs.
Decouple VDD with a 10 µF tantalum in parallel with a 0.1 µF ceramic capacitor placed as close to the supply pin as possible. For hybrid/MCM designs, use multiple parallel ceramic capacitors distributed around the die perimeter to minimize inductance. Route the AGND and DGND traces in a star-ground topology with the star point at the AGND pin; do not run digital return currents through the analog ground plane. Keep the analog input trace away from switching converters and digital clocks; this is the second most common source of degraded ADC SNR.
Drive the analog input with a low-impedance buffer (e.g., AD822BRZ or AD845) for source impedances above 1 kΩ. The AD7893 internal input capacitance and input leakage current (~1 nA) form a low-pass pole with the source impedance; an unbuffered 10 kΩ source degrades effective bandwidth by an order of magnitude. For highest linearity, use a buffer amplifier whose bandwidth is at least 10x the ADC's sampling rate (~1.2 MHz minimum for 117 kSPS). At very low signal levels, calibrate the system gain error against the on-chip reference or an external AD780BRZ reference.
Información de cumplimiento
CHIPS (bare-die) package compliance status varies by batch and date code; contact Analog Devices for specific lot RoHS/REACH documentation. The plastic SOIC equivalent AD7893ARZ-2REEL is RoHS compliant.
