LPC2378FBD144K - 72MHz ARM7 MCU 512KB Flash | NXP
N.º de pieza: LPC2378FBD144K ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $13.3765 | $13,38 |
| 10 | $12.85 | $128,50 |
| 100 | $11.95 | $1.195,00 |
| 500 | $10.75 | $5.375,00 |
| 1.000 | $9.85 | $9.850,00 |
LPC2378FBD144K Descripción general
A microcontroller is a programmable semiconductor that integrates a CPU core, memory, and peripherals into one package. The LPC2378FBD144K belongs to NXP's LPC2300 general-purpose MCU family and uses the ARM7 architecture, providing a broad software ecosystem and established real-time embedded design methods. Its 512 KB flash supports firmware and application programming, while 58 KB of SRAM accommodates network buffers, protocol stacks, and working data.
Key connectivity features include an Ethernet MAC, USB device controller, two CAN channels, four UARTs, three I2C interfaces, two SSP interfaces, one SPI interface, and I2S support. The device also provides an eight-channel 10-bit ADC and a 10-bit DAC for data acquisition and controlled analog output. A DMA controller supports efficient peripheral transfers, while four general-purpose timers, PWM, and a low-power real-time clock support industrial timing and control functions.
The LPC2378FBD144K is suitable for industrial networking, building automation, data acquisition, embedded control, communications equipment, and USB-connected embedded products. Its 72 MHz ARM7 core provides a capable balance of processing performance, integrated connectivity, and power efficiency for applications that need more than a basic microcontroller but do not require a higher-complexity application processor.
The principal engineering consideration is firmware and peripheral configuration. Ethernet, USB, CAN, analog, and real-time functions require careful initialization, interrupt handling, and PCB signal-integrity layout. The 144-LQFP footprint is also larger than compact MCU packages, so designers should confirm board space and available tooling before committing the component to a new design.
This product page combines manufacturer feature information with distributor listings and application-focused guidance. Pricing, stock, lifecycle status, and alternative sourcing can change, so verify current distributor data before committing to a production BOM.
Alternativas directas para LPC2378FBD144K — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC2378FBD144K (mismo factor de forma y huella) — difiere en Package, ADC, DAC, SRAM, Core.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LPC2378FBD144
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC2378FBD144,551
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1778FBD144
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1788FBD144
✅ Sustitución directa✓ En stock
$9.8 / unidad
Ver hoja de datos →LPC2368FET100
✅ Sustitución directa✓ En stock
$7.75 / unidad
Ver hoja de datos →LPC2378FBD144K Valores máximos y características eléctricas
| CPU Core | ARM7TDMI-S 16-bit/32-bit RISC |
| Maximum CPU Frequency | 72 MHz |
| Embedded Flash Memory | 512 KB |
| SRAM | 58 KB |
| Ethernet | Ethernet MAC |
| USB Interface | USB 2.0 Device |
| CAN Interfaces | 2 channels |
| UART Interfaces | 4 |
| I2C Interfaces | 3 |
| SSP Interfaces | 2 |
| SPI Interface | 1 |
| ADC | 8-channel, 10-bit |
| DAC | 10-bit |
| DMA Controller | Yes |
| General-Purpose Timers | 4 |
| Real-Time Clock | Low-power RTC |
| Encapsulado | 144-LQFP, 20 mm x 20 mm |
| Operating Voltage | 3.3 V |
| Programming Memory | ISP/IAP capability |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de LPC2378FBD144K 144-lqfp, 20 mm x 20 mm
Configuración de pines para LPC2378FBD144K (encapsulado 144-lqfp, 20 mm x 20 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC2378FBD144K.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC2378FBD144K es adecuado para 6 aplicacións: Industrial Ethernet Control, USB Connected Embedded Equipment, CAN-Based Networked Automation, Data Acquisition and Analog Monitoring, Building Automation and Environmental Control, Communications Gateway and Protocol Converter.
Industrial Ethernet Control
The LPC2378FBD144K is suited to industrial control equipment that needs Ethernet connectivity alongside local timers and analog measurement. Its 72 MHz ARM7TDMI-S core, 58 KB SRAM, Ethernet MAC, DMA controller, four UARTs, and 10-bit ADC support protocol handling, sensor acquisition, and actuator supervision in one device. The 144-LQFP package provides access to the broad peripheral set, while the 3.3 V supply fits common embedded control platforms. Firmware must configure the Ethernet MAC, PHY interface, interrupts, and analog channels for the specific control loop.
Recomendado
USB Connected Embedded Equipment
The LPC2378FBD144K fits USB-enabled embedded instruments and service equipment requiring a USB 2.0 device connection plus local processing. Its ARM7 core can handle USB device firmware, configuration handling, and application logic, while 512 KB flash provides room for a substantial firmware image. Four UARTs and three I2C interfaces allow connection to sensors, displays, or service adapters. The 10-bit ADC and DAC support monitoring and controlled analog functions. Board design should follow the NXP electrical and signal-integrity guidance for USB and analog signals.
Recomendado
CAN-Based Networked Automation
Two integrated CAN channels make the LPC2378FBD144K useful for industrial automation nodes, building controllers, and equipment interfaces that communicate over CAN. The 72 MHz ARM7 core provides processing capacity for protocol handling, diagnostics, and application logic, while 58 KB SRAM supports receive buffers and working memory. The device also includes four UARTs, three I2C buses, timers, PWM, and analog converters, reducing the need for external interface components in a compact control design. CAN transceiver selection, termination, isolation, and bus-layout design remain external engineering responsibilities.
Recomendado
Data Acquisition and Analog Monitoring
The integrated eight-channel 10-bit ADC and 10-bit DAC make the LPC2378FBD144K appropriate for compact data-acquisition and process-monitoring systems. The MCU can sample multiple analog channels, apply calibration and filtering in firmware, and use the DAC for control or test outputs. Four general-purpose timers, PWM, DMA, and the 58 KB SRAM support deterministic acquisition and buffering. The 144-LQFP package exposes the required analog and digital resources, but precision analog designs still need careful grounding, decoupling, reference selection, and input-protection layout.
Recomendado
Building Automation and Environmental Control
The LPC2378FBD144K can serve as the central controller in building automation equipment requiring Ethernet or serial connectivity, real-time timing, and analog sensor inputs. Its low-power real-time clock, four general-purpose timers, PWM outputs, multiple serial interfaces, and ADC resources support scheduling, monitoring, lighting control, and HVAC coordination. The 512 KB flash is useful for storing application logic and protocol code, while 58 KB SRAM supports network and control buffers. Deployment should consider environmental limits, safety requirements, isolation, and the long-term availability of the selected MCU grade.
Recomendado
Communications Gateway and Protocol Converter
The combination of Ethernet, USB 2.0 device, dual CAN, four UARTs, three I2C interfaces, SSP, SPI, and I2S makes the LPC2378FBD144K useful for communications gateways and protocol-conversion equipment. The 72 MHz ARM7 core can manage multiple protocol tasks, DMA can reduce CPU involvement in data movement, and the 58 KB SRAM provides working memory for buffered traffic. The 512 KB flash supports embedded firmware and update logic. A production design should validate throughput, interrupt latency, buffer sizing, connector protection, and EMC performance for its target communications environment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC2378FBD144K — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC2378FBD144 | LPC2378FBD144,551 | LPC1778FBD144 | LPC1788FBD144 | LPC2368FET100 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP; exact package details require verification | 144-LQFP; exact package details require verification | 100-LQFP; not the same footprint |
Diferenciadores clave
- High peripheral integration (frente a LPC2368FET100)
- Larger package supports broad pin access (frente a LPC2368FET100)
- Exact same-device ordering options (frente a LPC2378FBD144)
Notas de diseño
The LPC2378FBD144K uses a 144-LQFP, 20 mm x 20 mm footprint with fine-pitch leads and numerous power, ground, analog, and communication pins. Confirm the land pattern, pin numbering, exposed thermal and power requirements, and assembly clearances against the official NXP package drawing before layout release. Keep analog inputs away from high-speed switching and provide a solid ground reference plane.
Use the manufacturer-recommended decoupling and power-supply arrangement for all VDD pins, with adequate local bulk capacitance and short return paths. The verified listing identifies the device as a 3.3 V MCU, but current consumption depends on CPU activity, clock configuration, enabled peripherals, I/O loading, and temperature. Validate worst-case rail tolerance, startup sequencing, and peripheral current before selecting regulators and magnetics.
Ethernet, USB, CAN, UART, SPI, and I2C interfaces require deliberate signal routing. Keep high-speed or differential signals short where possible, provide continuous reference planes, control return paths, and use manufacturer-recommended termination and protection. For analog ADC inputs, use guarded routing, appropriate source impedance, filtering, and separation from switching nodes to preserve measurement quality.
Do not treat LPC1778, LPC1788, or LPC2368 as automatic replacements based only on the LPC family name or package similarity. Check exact pin assignments, peripheral multiplexing, memory map, clock requirements, startup behavior, and firmware compatibility. A same-package candidate can still require board or software changes if alternate-function mapping or electrical limits differ.
At 72 MHz, thermal performance depends on activity, supply voltage, I/O loading, ambient temperature, PCB copper, and package mounting. The verified data does not provide a complete thermal characterization, so calculate the design margin from the applicable NXP datasheet and measure temperature in the final enclosure. Avoid placing the MCU near unregulated power components or heat-generating regulators without a defined thermal path.
Información de cumplimiento
The verified search results include compliance-related comparison pages, but the supplied data does not provide authoritative declarations for RoHS, REACH, AEC-Q100, lead-free status, halogen-free status, or conflict minerals. Confirm current declarations from NXP and the authorized distributor before release.
