MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP
N.º de pieza: MCF5307CAI90B ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $32.1 | $3.210,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $25.75 | $25.750,00 |
MCF5307CAI90B Descripción general
A microprocessor (MPU) is an integrated processor that contains the central processing unit, on-chip peripherals, memory interfaces, and bus controllers needed to run an embedded system. The MCF5307 belongs to the ColdFire family (a Motorola/Freescale/NXP 32-bit M68k-derivative architecture), sitting in the hierarchy MPU -> embedded processor -> ColdFire family -> ColdFire V3 core -> integrated microprocessor. It is designed for designers who need deterministic 32-bit performance with rich peripheral integration without the complexity of external ASIC glue logic.
Key features include a 32-bit ColdFire V3 core with MAC for DSP-like arithmetic, a 90 MHz core clock delivering 70 MIPS of integer throughput, a 32-bit DRAM controller supporting FPM/EDO/SDRAM, four DMA channels, three timer modules, dual UARTs, an I2C interface, a QSPI port, and a 16-bit general-purpose parallel port. The 208-FQFP package offers generous I/O for industrial and networking designs.
Typical applications include industrial automation controllers, networking edge devices, point-of-sale terminals, building automation gateways, and embedded instrumentation. The on-chip DRAM controller and MAC unit make it well suited to control loops and protocol conversion without external DSP chips.
When designing with this device, allocate at least 4 KB of SRAM for boot vectors and consider external bus mastering carefully because the integrated DMA and DRAM controller share the same external memory bus as the CPU.
Alternativas directas para MCF5307CAI90B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF5307CAI90B (mismo factor de forma y huella) — difiere en Package, Program Memory, Mounting Type, Core Architecture, Ethernet MAC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF53013CQT240
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MCF53010CQT240
✅ Sustitución directa✓ En stock
$9.8 / unidad
Ver hoja de datos →MCF53015CMJ240J
✅ Sustitución directa✓ En stock
$22.85 / unidad
Ver hoja de datos →MCF5327CVM240J
✅ Sustitución directa✓ En stock
$15.95 / unidad
Ver hoja de datos →MCF5274CVM166
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MCF5274LVM166
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MCF5307CAI90B Valores máximos y características eléctricas
| Processor Core | ColdFire V3 |
| Core Architecture | 32-bit RISC (M68k-derived ColdFire) |
| Maximum Core Frequency | 90 MHz |
| Performance | 70 MIPS (Dhrystone 2.1) |
| Instruction Set | ColdFire V3 + MAC (multiply-accumulate) |
| Tensión de alimentación | 3.3 V |
| Process Technology | 0.32 um |
| On-chip SRAM | 4 KB |
| External Memory Bus | 32-bit (FPM/EDO/SDRAM DRAM supported) |
| DMA Controller | 4 channels |
| Timers | 3 timer modules |
| UART | 2 UARTs |
| I2C | 1 I2C interface |
| QSPI | 1 QSPI port |
| Parallel I/O | 16-bit general-purpose |
| Encapsulado | 208-FQFP (28 mm x 28 mm) |
| Tipo de montaje | Surface Mount, Gull-Wing |
| Temperature Grade | Commercial |
Guía de configuración de pines de MCF5307CAI90B 208-fqfp (28 mm x 28 mm)
Configuración de pines para MCF5307CAI90B (encapsulado 208-fqfp (28 mm x 28 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF5307CAI90B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF5307CAI90B es adecuado para 6 aplicacións: Industrial Automation Controllers, Networking Edge / Protocol Gateways, Point-of-Sale (POS) Terminals, Building Automation Gateways, Embedded Instrumentation, Medical Device Controllers (Non-Life-Critical).
Industrial Automation Controllers
The MCF5307CAI90B is well matched to industrial automation controllers because its 32-bit ColdFire V3 core delivers deterministic 70 MIPS at 90 MHz while the on-chip MAC unit accelerates closed-loop arithmetic. The integrated 32-bit DRAM controller handles FPM/EDO/SDRAM directly, removing the need for an external memory ASIC, and four DMA channels move sensor data without loading the CPU. With dual UARTs, an I2C interface, and a QSPI port, designers can connect motor drivers, HMI panels, and field instruments from a single chip. The 208-FQFP package has the I/O density needed for parallel-bus peripherals such as legacy PLC I/O racks.
Recomendado
Networking Edge / Protocol Gateways
For networking edge and protocol-conversion gateways, the MCF5307CAI90B pairs a 70 MIPS ColdFire V3 core with the DMA + DRAM controller combination needed to forward packets between serial and Ethernet interfaces. Two UARTs and the QSPI port handle RS-232/485 field devices, while the parallel port can drive LCD keypads or additional PHY glue logic. The 4 KB on-chip SRAM accelerates boot and routing-table lookups, and the 208-FQFP footprint leaves pins free for external PHY and memory devices. Versus a discrete MPU plus external controller, the integrated design cuts BOM cost and PCB area in industrial gateways.
Recomendado
Point-of-Sale (POS) Terminals
In POS terminals the MCF5307CAI90B handles main transaction processing, display driving, and peripherals such as mag-stripe readers, printers, and keypads. The 70 MIPS throughput is sufficient for application logic, encryption hand-offs, and TCP/IP stacks, while the parallel port is well suited to character LCDs or small graphical panels. The QSPI port drives secure-accessory memories, and the on-chip DRAM controller supports commodity SDRAM for transaction buffering. The 208-FQFP keeps the board physically compact and the processor cost low enough for value-tier POS hardware.
Recomendado
Building Automation Gateways
Building automation gateways benefit from the MCF5307CAI90B's combination of multiple UARTs, I2C, QSPI, and timers for managing HVAC, lighting, and access-control subsystems. The 32-bit ColdFire V3 core handles BACnet, Modbus, and LonWorks translation, while the DRAM controller lets the gateway buffer trend logs before forwarding to a cloud or building-management server. The integrated DMA engine moves sensor data efficiently without CPU interrupts, and the 208-FQFP leaves enough I/O for additional field-bus ASICs if needed. Compared with multi-chip solutions, this single-chip MPU lowers total system cost.
Recomendado
Embedded Instrumentation
Embedded instrumentation such as data loggers, oscilloscope front-ends, and process analyzers use the MCF5307CAI90B for its combination of deterministic real-time response and rich peripherals. The MAC unit accelerates DSP-style averaging and FFT pre-processing, while the four-channel DMA engine streams ADC samples into memory without CPU intervention. Dual UARTs and the QSPI port allow chaining multiple instruments or talking to test fixtures, and the 32-bit external bus supports high-throughput SDRAM for deep capture buffers. The 208-FQFP package offers adequate I/O for parallel ADC/DAC front ends.
Recomendado
Medical Device Controllers (Non-Life-Critical)
For non-life-critical medical device controllers such as lab analyzers, the MCF5307CAI90B delivers the 32-bit performance needed for motor control, sample handling, and user-interface management. The integrated DRAM controller supports commodity SDRAM for sample logs, while the multiple serial ports connect to barcode readers, printers, and laboratory instruments. The ColdFire V3 + MAC combination accelerates numerical processing for calibration and curve fitting. Designers must still perform their own IEC 60601 and risk-management validation; this part is commercial-grade, not AEC-Q100 qualified.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF5307CAI90B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF53013CQT240 | MCF53010CQT240 | MCF53015CMJ240J | MCF5327CVM240J | MCF5274CVM166 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same |
| Processor Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V2 |
| Maximum Core Frequency | 90 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 166 MHz |
| On-chip SRAM | 4 KB | 32 KB | 32 KB | 32 KB | 32 KB | 8 KB |
| DMA Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Ethernet MAC | No | No | No | No | Yes (with USB) | Yes (Fast Ethernet) |
Diferenciadores clave
- 70 MIPS at 90 MHz in the original ColdFire V3 family member (frente a MCF53013CQT240)
- Single-chip integration of DRAM controller, DMA, MAC, and timers (frente a MCF5274CVM166)
- 208-FQFP (28x28) standard outline for legacy layout reuse (frente a MCF5327CVM240J)
Notas de diseño
The MCF5307CAI90B operates from a single 3.3 V supply and integrates its own DRAM controller, so designers need a 3.3 V LDO or DC-DC capable of supplying the MPU plus I/O current budget. Decouple the core with at least a 10 uF bulk + 0.1 uF ceramic pair placed within 10 mm of the power pins, and provide separate analog 3.3 V rails if the design uses an Ethernet PHY. The DRAM controller switching transients can cause measurable supply ripple, so a ferrite bead and additional bulk capacitor near the memory array are recommended.
The 208-FQFP at 28 mm x 28 mm uses 0.5 mm gull-wing pitch, so a 4-layer PCB with a continuous ground plane under the part is strongly recommended. Keep address, data, and control traces matched to within 25 mm on the external memory bus to avoid skew, and route DRAM clocks inside a ground-guard via fence. Place the 4 KB on-chip SRAM code region in fast-access memory by using the on-chip SRAM boot mode for time-critical ISR vectors, and place the bulk application code in SDRAM.
A common pitfall on the MCF5307 is forgetting that the integrated DMA and DRAM controller share the external memory bus with the CPU, so heavy DMA traffic can stall instruction fetches if bus priority is not tuned. Another gotcha is the JTAG/BDM debug pin population - leaving these as no-connect breaks in-system debug. Finally, the commercial temperature grade limits deployment in industrial or automotive environments, so check the -40 C to +85 C window against the end application before committing to layout.
Información de cumplimiento
Commercial-grade (-40 C to +85 C implied); RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data extracted for this part. Verify against the manufacturer datasheet or product environmental information before use in regions where these certifications are mandated.
