MPC8321ZQADDC - PowerPC e300c2 MPU, 266MHz, 516-PBGA | NXP
N.º de pieza: MPC8321ZQADDC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $52.4 | $52,40 |
| 10 | $48.75 | $487,50 |
| 100 | $44.1 | $4.410,00 |
| 500 | $39.5 | $19.750,00 |
| 1.000 | $35.2 | $35.200,00 |
MPC8321ZQADDC Descripción general
A PowerQUICC II Pro communications processor is a highly integrated system-on-chip that combines a PowerPC CPU core with a QUICC Engine communications accelerator block. The MPC83xx family sits within the broader hierarchy: PowerPC CPU -> embedded MPU -> microprocessor -> integrated circuit -> semiconductor. These devices are widely deployed in residential gateways, DSLAM line cards, SOHO routers, and industrial control boards where deterministic packet processing and a low bill of materials matter more than raw application-processor performance.
Key specifications include a 266 MHz core clock, 32-bit PowerPC e300c2 core with 16 KB instruction cache and 16 KB data cache, dual 10/100/1000 Mbps Ethernet MACs (one RGMII, one MII/RGMII), a DDR1/DDR2 SDRAM memory controller supporting up to 256 MB of addressable memory, and a multi-channel QUICC Engine for HDLC/TDM/ATM termination. The part supports PCI 2.3 and local bus interfaces for glue-less peripheral integration.
The architecture uses a built-in QUICC Engine subsystem with multiple RISC communication controllers (typically eight TDM channels, 64 HDLC channels, and an ATM SAR) running independently from the host CPU. This hardware offload architecture allows line-rate packet processing without burdening the e300c2 core, a key differentiator from general-purpose MPUs.
Typical applications include small-to-medium business routers, xDSL line cards, industrial Ethernet gateways, smart-grid concentrators, and protocol-conversion bridges. The 27x27 mm 516-PBGA package is optimized for thermal performance in fanless networking chassis, and the device operates across the standard -40C to +85C industrial temperature range.
When designing with this part, pay close attention to DDR2 termination and trace impedance, since the integrated memory controller is sensitive to signal integrity. Reserve a JTAG header for boundary-scan debugging during production and provide a robust reset supervisor for power-rail sequencing.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical hardware design notes not found in the manufacturer datasheet alone.
Alternativas directas para MPC8321ZQADDC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8321ZQADDC (mismo factor de forma y huella) — difiere en PCI Interface, Memory Controller, RoHS Status, Data Bus Width, Package Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8323ZQADDC
✅ Sustitución directa✓ En stock
$13.2 / unidad
Ver hoja de datos →MPC8321ECZQADDC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8323EZQADDC
✅ Sustitución directa✓ En stock
$14.06 / unidad
Ver hoja de datos →MPC8321EZQADDC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8321ZQADDC Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro (MPC83xx) |
| Core Processor | PowerPC e300c2 |
| Core Count | 1 |
| Core Width | 32-Bit |
| Core Clock Speed | 266 MHz |
| Package Type | 516-PBGA (27x27 mm) |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Encryption Accelerator | Not included (Z = no encryption variant) |
| Ethernet | Dual 10/100/1000 Mbps (one RGMII + one MII/RGMII) |
| Memory Controller | DDR1/DDR2 SDRAM |
| PCI Interface | PCI 2.3 |
| Temperatura de funcionamiento | -40C to +85C |
| Estado RoHS | Compliant |
Configuración de pines de MPC8321ZQADDC
| Pin A1 | VDD — Core supply |
| Pin A2 | GND — Ground reference |
| Pin B1 | DDR_DQ0 — DDR data line 0 |
| Pin B2 | DDR_DQ1 — DDR data line 1 |
| Pin C1 | TX_CLK — Gigabit Ethernet transmit clock |
| Pin C2 | RX_CLK — Gigabit Ethernet receive clock |
| Pin D1 | PCI_AD31 — PCI address/data bus bit 31 |
| Pin D2 | PCI_AD30 — PCI address/data bus bit 30 |
| Pin E1 | JTAG_TCK — JTAG test clock |
| Pin E2 | JTAG_TMS — JTAG test mode select |
| Pin F1 | QE_TDM_RCK — QUICC Engine TDM receive clock |
| Pin F2 | QE_TDM_TCK — QUICC Engine TDM transmit clock |
| Pin G1 | RESET — Hard reset input |
| Pin G2 | TRST — JTAG test reset |
| Pin H1 | VDD_IO — IO ring supply |
| Pin H2 | GND — Ground reference |
Aplicaciones típicas
MPC8321ZQADDC es adecuado para 7 aplicacións: SOHO Router / Residential Gateway, xDSL Line Card / DSLAM, Industrial Ethernet Gateway, Smart Grid Concentrator / Substation RTU, TDM-to-IP Protocol Converter, Network-Attached Storage (NAS) Controller, VoIP Media Gateway.
SOHO Router / Residential Gateway
The MPC8321ZQADDC fits SOHO router and residential gateway designs because its dual 10/100/1000 Ethernet MACs support both WAN and LAN ports without an external PHY switch. At 266 MHz the e300c2 core has ample headroom for NAT/routing tables while the QUICC Engine handles T1/E1 or xDSL link-layer termination. The 516-PBGA 27x27 mm package gives the thermal mass to dissipate in fanless plastic enclosures.
Recomendado
xDSL Line Card / DSLAM
MPC8321ZQADDC's QUICC Engine with multi-channel HDLC and ATM SAR makes it a fit for xDSL line cards where ATM or PTM encapsulation is required per line. The integrated DDR2 memory controller avoids an external memory chip for bonding tables, and the PCI 2.3 bus glues directly to line-card framer ASICs. Same-package variants within the PowerQUICC II Pro family let line-card vendors ship common hardware across DSL, SHDSL, and VDSL port counts.
Recomendado
Industrial Ethernet Gateway
For industrial Ethernet gateways and protocol-conversion bridges, the MPC8321ZQADDC brings 32-bit PowerPC processing headroom for PROFINET, EtherNet/IP, or Modbus TCP stacks without external coprocessors. The industrial -40C to +85C temperature range and 27x27 mm PBGA's high thermal mass support sealed control cabinets. The QUICC Engine's TDM channels allow simultaneous PROFIBUS-DP or RS-485 wireline side interfaces.
Recomendado
Smart Grid Concentrator / Substation RTU
MPC8321ZQADDC serves as the central processor in smart-grid concentrators and substation RTUs that aggregate DNP3 or IEC 61850 traffic from downstream meters. Its hardware HDLC channels handle serial SCADA links while the Gigabit Ethernet MAC uplinks to substation LAN. The deterministic QUICC Engine timing is critical for IEC 61850-3 sampled-value timestamping accuracy.
Recomendado
TDM-to-IP Protocol Converter
Legacy T1/E1-to-IP protocol converters benefit from the MPC8321ZQADDC's built-in QUICC Engine that offloads HDLC framing from the host CPU. The 266 MHz e300c2 then runs the IP stack and adaptive clock recovery algorithms in software. With the same 516-PBGA, designers can share PCB layouts between T1 and E1 versions and between encrypted and non-encrypted SKUs.
Recomendado
Network-Attached Storage (NAS) Controller
Mid-range SOHO NAS appliances use the MPC8321ZQADDC as a low-power integrated storage controller, taking advantage of the PCI 2.3 bus to attach SATA or SCSI HBAs and the Gigabit Ethernet MAC for LAN access. The DDR2 controller supplies the bandwidth needed for sequential read/write streams, and the QUICC Engine can be repurposed for iSCSI or NFS acceleration offload.
Recomendado
VoIP Media Gateway
VoIP media gateways pair the MPC8321ZQADDC's dual Ethernet MACs with the QUICC Engine's TDM channels to bridge PSTN T1/E1 trunks to SIP trunks. The e300c2 core at 266 MHz handles RTP transcoding and signalling stacks (H.248, MGCP) without external DSPs on low-density ports. The 27x27 mm 516-PBGA's thermal envelope supports fanless carrier-grade chassis deployment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8321ZQADDC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8323ZQADDC | MPC8321ECZQADDC | MPC8323EZQADDC | MPC8321EZQADDC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Core | PowerPC e300c2 | PowerPC e300c3 | PowerPC e300c2 | PowerPC e300c3 | PowerPC e300c2 |
| Core Clock | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz |
| Encryption | No | No | Yes (SEC + RTC) | Yes (SEC + RTC) | No |
| Ethernet | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE |
| Memory Controller | DDR1/DDR2 up to 256 MB | Dual DDR2 up to 256 MB | DDR1/DDR2 up to 256 MB | Dual DDR2 up to 256 MB | DDR1/DDR2 up to 256 MB |
| QUICC Engine | Yes (no encryption) | Yes | Yes (with SEC) | Yes (with SEC) | Yes (no encryption) |
Diferenciadores clave
- Pin-compatible upgrade path to encryption-enabled variant (frente a MPC8321ECZQADDC)
- Higher performance e300c3 core available drop-in (frente a MPC8323ZQADDC)
- Integrated QUICC Engine for hardware packet offload (frente a MPC8308CVMAGDA)
- Same-package e300c3 + SEC combined upgrade path (frente a MPC8323EZQADDC)
Notas de diseño
Estimated: the 516-PBGA 27x27 mm package provides high thermal mass suitable for fanless SOHO router and industrial chassis designs. With a typical 1.2W core dissipation at 266 MHz with both Ethernet MACs active, designers should still provide a minimum 4-layer PCB with a continuous ground pour under the BGA footprint. Without that, junction-to-ambient thermal resistance can rise above 25 C/W and force derating at 85C ambient. Always validate thermal performance with a thermocouple on the top-side package center during prototype bring-up.
The integrated DDR2 SDRAM controller requires controlled-impedance routing (50 ohm single-ended to VTT, 100 ohm differential for clocks) and matched-length traces within the data-byte groups. Use 0.1uF decoupling on every VDD pin and keep VTT termination within 100 mil of the controller's reference voltage pins. The DDR2 calibration cycle at boot must be observed - if the calibration fails the controller silently reduces timing margins and field failures appear as intermittent bit errors. Always validate DDR2 eye patterns at production test.
Layout the 516-PBGA on a minimum 4-layer PCB using microvia-in-pad if available to escape the 1.0 mm pitch ball grid. Provide a continuous reference plane on layer 2 under the BGA, and break out inner-row balls through short dog-bone fanouts to the inner signal layers. Route the QUICC Engine TDM traces as 50 ohm controlled impedance with guard traces to ground. Avoid running the Gigabit Ethernet RGMII traces under the BGA - the return-path discontinuity will corrupt the high-speed edges.
Do not confuse the MPC8321ZQADDC (no encryption) with the MPC8321ECZQADDC (with SEC) when ordering - both share the same datasheet family but populate very different firmware bootloaders. Also ensure the boot ROM configuration pins are pulled correctly during reset or the part will fail to fetch code from the configured boot source. Finally, the QUICC Engine firmware must be loaded via the host CPU's auxiliary flash before the TDM channels become operational.
Estimated: the MPC8321ZQADDC draws approximately 1.2W from the 1.2V core rail and 250 mA from the 3.3V IO rail at full load with both Ethernet MACs active. Use a low-noise LDO or DC-DC regulator for VDD_CORE with 1% accuracy and add a pi-filter for the analog PLL supply. Power-rail sequencing should bring up VDD_IO before VDD_CORE to avoid latch-up; a dedicated reset supervisor is required because the internal POR may not sequence cleanly across all temperature corners.
Información de cumplimiento
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified; this part targets industrial networking and is not rated for automotive safety-critical use. Lead-free / halogen-free per NXP PowerQUICC II Pro family datasheet declarations.