MPC857TVR66B - PowerQUICC MPC8xx 32-Bit 66MHz MPU | NXP
N.º de pieza: MPC857TVR66B ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $58.3 | $29.150,00 |
| 1.000 | $52.1 | $52.100,00 |
MPC857TVR66B Descripción general
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions from program memory using an internal CPU core. The PowerQUICC MPC8xx family belongs to the broader embedded microprocessor category, which sits hierarchically above microcontrollers (MCUs) for applications that need higher CPU performance and richer peripheral integration. The MPC8xx line specifically combines a PowerPC core with the CPM (Communications Processor Module), historically used for WAN, LAN, and serial-routing functions in networking gear.
Key features include a 32-bit PowerPC core with 66 MHz core clock, integrated CPM block for HDLC/SCC/SMC channels, integrated system functions (timers, interrupt controller, memory controller), and a 357-ball PBGA package for high-density board designs. The 25 mm x 25 mm BGA footprint provides generous thermal mass for the typical PowerQUICC power envelope and supports controlled-impedance routing required by the external memory bus.
The MPC857T variant of the MPC8xx family is differentiated from the MPC860 by on-chip enhancements to the CPM and by extended temperature and silicon revision identification. The 66 MHz speed grade is the standard commercial operating point, and parts from the same family are available at higher bus frequencies (e.g., MPC857TVR80B). The architecture is well documented in the Freescale/NXP MPC862/857T/857DSL reference manual.
Typical applications include legacy networking routers and bridges, industrial serial communications, telecom control planes, and embedded control systems that require deterministic serial-channel handling. Engineers frequently pair the MPC8xx with external SDRAM/Flash memory and PHY devices for complete line-card or WAN-router designs.
When designing with this device, carefully observe the IBIS and BSDL models from NXP to ensure signal integrity on the external memory bus. Decoupling must follow the reference board stack-up documented in the evaluation kit schematic; the 357-BGA package requires via-in-pad or microvia technology for reliable assembly. Verify all errata against the latest silicon revision mask before committing to volume production.
This page synthesizes distributor stock, drop-in alternatives, and engineering guidance beyond what the bare datasheet excerpt provides.
Alternativas directas para MPC857TVR66B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC857TVR66B (mismo factor de forma y huella) — difiere en Core Architecture, Core Frequency, Manufacturer, Mounting Type, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC857TVR80B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC857TVR50B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC857TCVR66B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TVR66B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC857DSLCVR66B
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →MPC857TVR66B Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC MPC8xx |
| Processor Type | MPC8xx PowerQUICC, 32-Bit |
| Core Count | 1 |
| Core Architecture | PowerPC |
| Core Frequency | 66 MHz |
| Tensión de alimentación | 3.3 V |
| Encapsulado | 357-PBGA (25x25 mm) |
| Ball Count | 357 |
| Tipo de montaje | Surface Mount (BGA) |
| Operating Temperature Grade | Other (per manufacturer profile) |
| Packaging | Tray |
| Lead-Free Status | Lead Free |
| Estado RoHS | RoHS Compliant |
| Peripherals / Features | CPM (HDLC/SCC/SMC), timers, interrupt controller, memory controller |
Guía de configuración de pines de MPC857TVR66B 357-pbga (25x25 mm)
Configuración de pines para MPC857TVR66B (encapsulado 357-pbga (25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC857TVR66B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC857TVR66B es adecuado para 6 aplicacións: Legacy Networking Routers and Bridges, Industrial Serial Communications Controllers, Telecom Control-Plane Processors, Embedded Control Systems with Deterministic Serial I/O, Long-Life Aerospace and Defense Sub-Systems, Service Provider Edge Aggregation Nodes.
Legacy Networking Routers and Bridges
The MPC857TVR66B's 66 MHz PowerPC core and integrated CPM with HDLC/SCC/SMC channels make it a strong fit for legacy router and bridge designs that need deterministic serial-channel handling without an external ASIC. Placed on the line card or main control board, the MPU drives WAN interfaces (T1/E1, V.35, HDLC), runs the routing protocol stack, and manages the on-board SDRAM/Flash. Compared with newer PowerQUICC III parts, the MPC857T draws less power and survives in designs that have already validated the CPM code base.
Recomendado
Industrial Serial Communications Controllers
Industrial gateways and protocol converters benefit from the MPC857TVR66B's combination of PowerPC processing headroom and multiple serial channels. The MPU handles Modbus, Profibus, or proprietary industrial protocols on the SMC/SCC interfaces while the core runs the application logic and management plane. The 357-BGA package supports robust thermal performance in sealed industrial enclosures, and the part's proven longevity suits long-life industrial deployments.
Recomendado
Telecom Control-Plane Processors
The MPC857TVR66B has a long track record in telecom equipment where its CPM handles HDLC framing, while the PowerPC core executes control-plane software stacks. In central-office or base-station control cards, the MPU interfaces to TDM backplanes, supervisory circuits, and management Ethernet. Its deterministic interrupt latency and mature CPM code base keep it relevant for incremental telecom designs that have already invested in the BSP.
Recomendado
Embedded Control Systems with Deterministic Serial I/O
Embedded control systems that require deterministic multi-channel serial I/O can use the MPC857TVR66B as the central supervisor. Its CPM supports independent baud-rate generators per channel and hardware-accelerated protocol processing, offloading the PowerPC core from interrupt-heavy serial work. Engineers typically pair the MPU with external PHY transceivers and a real-time operating system such as VxWorks or Linux with the appropriate BSP.
Recomendado
Long-Life Aerospace and Defense Sub-Systems
Long-lifecycle aerospace and defense sub-systems that were designed around the PowerQUICC MPC8xx family continue to use the MPC857TVR66B because of its mature software ecosystem and stable supply through franchised distributors. The 357-BGA package suits compact conduction-cooled boards, and the part's deterministic behavior simplifies DO-254 / DO-178 certification evidence. Programs with multi-decade support windows particularly value the wide distributor inventory of NRND PowerQUICC parts.
Recomendado
Service Provider Edge Aggregation Nodes
Service provider edge aggregation equipment leverages the MPC857TVR66B to combine multiple T1/E1 or Ethernet feeds onto an uplink, with the CPM handling HDLC encapsulation and the core managing forwarding tables. The part's proven reliability and broad distributor availability keep it cost-effective for refresh deployments that cannot undertake full hardware redesigns. Integrating the PowerPC core plus CPM on one die reduces the BOM and simplifies the bill of materials versus multi-chip solutions.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC857TVR66B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC857TVR80B | MPC857TVR50B | MPC857TCVR66B | MPC860TVR66B | MPC857DSLCVR66B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 66 MHz | 80 MHz | 50 MHz | 66 MHz | 66 MHz | 66 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 |
| Core Architecture | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC |
| Family / Series | PowerQUICC MPC8xx (MPC857T) | PowerQUICC MPC8xx (MPC857T) | PowerQUICC MPC8xx (MPC857T) | PowerQUICC MPC8xx (MPC857T) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC857DSL) |
| RoHS / Lead-Free | Yes (R suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND / Last Time Buy | NRND |
Diferenciadores clave
- Mature PowerQUICC CPM with multi-channel HDLC/SCC support (frente a MPC860TVR66B)
- Standard commercial 66 MHz speed grade for cost-sensitive designs (frente a MPC857TVR80B)
- No integrated DSL PHY; pure communications processor role (frente a MPC857DSLCVR66B)
Notas de diseño
Estimated: the 357-ball PBGA on a 1.27 mm pitch typically requires microvia or via-in-pad PCB technology to keep return paths short on the PowerPC external bus. Reference the NXP MPC857T evaluation board stack-up for trace width, dielectric, and via geometry; controlled-impedance routing on the address/data bus is mandatory to meet timing margins at 66 MHz. Place bulk decoupling capacitors inside the BGA's power-ball array and use a continuous ground plane directly beneath the package.
Estimated: at 66 MHz the MPC857T draws on the order of 1-2 W from the 3.3 V rail depending on CPM activity. Sequence the 3.3 V rail relative to any internal 1.8 V/2.5 V rails per the datasheet power-on diagram; out-of-order sequencing can latch-up the device or trigger POR (Power-On Reset) glitches. Use the PLL filter network specified in the reference manual and keep its analog ground island isolated from the digital return plane.
Engineers commonly confuse the MPC857T with the MPC857DSL - although both come in a 357-BGA package, the DSL variant has integrated DSL PHY balls whose pin assignments differ from the non-DSL MPC857T. Always verify against the specific BSDL file and datasheet ball-map before treating one as a drop-in for the other. Also check the silicon revision mask against the latest NXP errata document; older masks carry known CPM and USB bugs that newer revisions have fixed.
Use the IBIS model from NXP to simulate the address, data, and control buses before committing to layout; the 66 MHz bus is sensitive to reflections, ISI, and SSO (Simultaneous Switching Output) noise. Stagger the SDRAM clock-to-DQS skew per the JEDEC specification supported by the MPC857T DRAM controller and length-match the data byte lanes within each byte group. Series-damping resistors on heavily-loaded buses can mitigate ringing without violating timing.
Información de cumplimiento
RoHS and lead-free status confirmed by the 'R' suffix in the MPN and the DigiKey listing data; REACH compliance stated by NXP product declarations. AEC-Q100 is not applicable for this MPU category. Halogen-free and Conflict Minerals declarations were not present in the provided web data and are marked 'unknown' per data authenticity rules.
