FPGA & CPLD
Produits (6666)
EP2A70B724I8 - APEX II 70K LE FPGA 724-FCBGA | Altera
The Intel (formerly Altera) EP2A70B724I8 is a member of the APEX II family of programmable logic devices, providing up to 67200 logic elements (LEs), 3 million system gates, and a 0.15 µm CMOS process with a 1.5 V core supply. It is packaged in a 724-pin FineLine BGA (FCBGA) and operates across the industrial temperature range (-40 °C to +100 °C), as indicated by the trailing "I" suffix. The "8" speed grade corresponds to an internal performance index targeting roughly 281 MHz in typical data-path designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect that can be reconfigured by the customer after manufacture. APEX II devices sit in the high-density, multi-standard I/O tier of the Altera product tree: FPGA -> programmable logic -> programmable logic IC -> semiconductor. Each LE is paired with a four-input lookup table, a programmable register, and dedicated carry chain logic, while embedded system blocks (ESBs) implement dual-port RAM, ROM, and CAM. The combination makes APEX II suitable for bus interfaces, on-chip datapaths, and glue-logic consolidation. Key features of the EP2A70B724I8 include 67200 LEs, 3 M system gates, embedded multiplier support, True-LVDS and high-speed I/O standards, and a dedicated phase-locked loop (PLL) block for clock multiplication and deskew. The device supports active serial, passive serial, and passive parallel asynchronous configuration modes through the EPC4/EPC8/EPC16 enhanced configuration devices, and in-system programmability via JTAG (IEEE 1149.1). Each I/O bank is independently powered, allowing mixed-voltage interfacing (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die. The architecture is built on a 0.15 µm metal-layer CMOS process with eight layers of interconnect for low-skew global clock distribution. The embedded system block memory ranges to hundreds of kilobits and can be concatenated horizontally or vertically. TriMatrix memory supports per-bit write-masking and mixed-width data ports. The PLL block generates up to four derivative clocks with sub-100 ps jitter, while the MultiTrack interconnect minimizes routing congestion in dense designs. Typical applications include telecommunications line cards, high-speed serial protocol bridging (UTOPIA, SPI-4.2, POS-PHY), DSP co-processing front-ends, and industrial control backplanes. The wide LVDS I/O count makes it well suited to bus multiplexing and parallel-to-serial concentration tasks. When designing with this part, plan for a 1.5 V core supply, four PLL analog supplies (VCC_PLL pins), and careful bank voltage grouping; the 724-pin FCBGA requires a multilayer PCB with microvia fan-out. Use the Quartus II design software (legacy support) for synthesis, place-and-route, and timing closure; signal-integrity simulations should account for simultaneous switching noise on the 1.5 V rail. This page consolidates distributor stock, drop-in same-package alternatives, and practical design notes for engineers sourcing the EP2A70B724I8 outside of Avnet/Mouser long-term contracts.
EP2A70B724I9 - APEX II FPGA 3M Gates 724-FCBGA | Altera
The Altera (Intel) EP2A70B724I9 is a member of the APEX II family of Field Programmable Gate Arrays, delivering approximately 3,000,000 system gates with 67,200 logic elements in a 724-pin FCBGA (Flip-Chip Ball Grid Array) package. Built on a 0.15 µm CMOS process, the device operates from a 1.5 V core supply and supports high-performance system-clock rates up to 198 MHz, with embedded system blocks that combine look-up tables, product-term logic, and dual-port RAM for high-throughput data-path applications. What is a FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured by the end user after manufacture. FPGAs sit above general-purpose microcontrollers and below fixed-function ASICs in the programmable-logic taxonomy (FPGA -> programmable logic -> semiconductor IC), offering parallel processing, deterministic timing, and hardware-level customization for data-path acceleration, glue logic, and prototyping. The APEX II family specifically targets high-density, multi-standard I/O designs by integrating up to four embedded system blocks (ESBs) with each ESB providing up to 32 Kbits of dual-port RAM. Key features of the EP2A70B724I9 include 540 Kbits of embedded memory, 4 phase-locked loops (PLLs) for flexible clock management, support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, and an industrial operating temperature range. The 724-pin FCBGA package provides a high-density interconnect suitable for high-speed designs with numerous differential pairs and high pin-count I/O requirements. The EP2A70B724I9 architecture combines four-input look-up tables (LUTs) with embedded system blocks and high-speed interconnect, allowing designers to implement both register-rich datapaths and memory-intensive functions in a single device. The PLLs allow multiple clock-domain synthesis and zero-delay buffering for backplane or source-synchronous interfaces such as LVDS and SSTL. Typical applications include telecommunications infrastructure, network switching and routing equipment, high-speed serial backplanes, digital signal processing (DSP) pipelines, and ASIC prototyping. The high logic density and embedded memory make the EP2A70B724I9 well suited for datapath-heavy designs such as protocol bridges, packet processors, and image-processing front-ends. When designing with this device, careful attention must be paid to power integrity: the 1.5 V core and PLL supply must be decoupled with low-ESR ceramics placed close to the FCBGA balls, and the high pin count drives a complex multi-layer PCB stack-up. Signal-integrity simulations are recommended for LVDS and high-speed DDR interfaces. This page synthesizes distributor pricing, drop-in alternative MPNs, and design guidance not consolidated on any single distributor page.
EP2A70B724I9N - APEX II FPGA 3M Gates 724-FCBGA | Intel
The Intel EP2A70B724I9N is a high-density FPGA from the APEX II family, delivering 3 million system gates, 67,200 logic cells, and a maximum internal clock frequency of 198 MHz. The device is built on a 0.15 µm CMOS process and operates from a 1.5 V core supply, packaged in a 724-ball Flip-Chip BGA (FCBGA). It is the highest-density member of the EP2A70 series, targeting data-path-heavy designs that need abundant embedded memory and high I/O bandwidth. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device in the broader semiconductor taxonomy: programmable logic -> logic IC -> integrated circuit. FPGAs are used for digital logic prototyping, parallel processing, glue logic, and ASIC replacement. The APEX II family specifically extends the Altera APEX architecture with embedded system blocks (ESBs) and a MultiCore interconnect that supports both fine-grained logic and coarse-grained memory, making it suitable for designs that blend control logic with datapath processing. Key features of the EP2A70B724I9N include 536 maximum user I/O pins, multiple embedded system blocks for RAM/ROM/CAM, support for high-speed LVDS I/O, and a true dual-port RAM architecture. The device supports in-system programmability through IEEE 1532 and supports configuration via passive serial, passive parallel, and JTAG modes. The 724-ball FCBGA package offers high pin density, enabling dense board layouts for telecom, networking, and DSP applications. The EP2A70B724I9N architecture combines a MultiCore interconnect with embedded system blocks to deliver predictable performance for memory-intensive and I/O-intensive designs. Designers can instantiate on-chip RAM, ROM, and CAM blocks without using logic cells, freeing fabric for parallel datapath operations. The 1.5 V VCCINT and 3.3 V-tolerant I/O architecture is typical for the APEX II generation, and the 724-FCBGA package supports high signal-count designs that would not fit in smaller BGA or QFP packages. Typical applications for this part include telecom line cards, ATM switching fabrics, high-speed serial protocol bridging, DSP front-end preprocessing, network router aggregation, and ASIC prototyping. The combination of 67,200 logic elements and 3M system gates supports designs that previously required an ASIC. When designing with the EP2A70B724I9N, pay attention to power integrity and thermal management. The 1.5 V core rail must be tightly regulated; a switching DC-DC followed by an LDO post-regulator is the typical pattern. Decoupling and PCB stackup planning for the 724-FCBGA is essential because the BGA escape routing demands microvia stackups. Always verify the specific ball map against the published pinout before layout. This page synthesizes distributor pricing, same-family Intel/Altera alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2A70B724I9N against extendable APEX II family members.
EP2A70F1020 - APEX II 70k LE FPGA, 1020-FBGA | Altera | FPGA
The Altera EP2A70F1020 is a member of the APEX II family of FPGAs, providing approximately 70,000 logic elements (LEs) in a high-density 1020-ball FineLine BGA package. According to distributor listings on DigiKey and FPGAkey, the EP2A70F1020 is an SRAM-based programmable logic device designed for high-performance digital signal processing, communication infrastructure, and complex ASIC prototyping applications. The device features 735 user I/O pins, enabling dense connectivity in data-path and backplane designs. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that an engineer can configure to implement arbitrary digital hardware. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs (application-specific integrated circuits) and microcontrollers in the digital IC ecosystem. The APEX II family was Altera's high-density offering for multi-gigabit signal processing and high-end parallel computing, preceding the Stratix and Cyclone architectures. Key parametric features of the EP2A70F1020 include 67200 logic elements/cells as reported in distributor parametric summaries, 735 user I/O pins distributed across multiple banks, embedded system blocks (ESBs) for memory and arithmetic, and support for multiple I/O standards including LVDS, SSTL, and GTL+. The APEX II architecture combines LUT-based logic with dedicated carry chains, embedded RAM, and high-speed interconnect to deliver deterministic timing closure for pipelines operating at hundreds of MHz. Technically, the APEX II device uses a 1.5V core voltage with separate VCCIO rails for I/O bank flexibility. The 1020-ball FBGA package supports high signal integrity at multi-hundred-MHz operation through controlled-impedance ball assignment and short bond-wire interconnects. Programming is performed via JTAG or passive serial configuration, with bitstream compatibility across the APEX II family enabling design migration between density points. Typical applications of the EP2A70F1020 include telecom protocol processing, high-speed image and video processing pipelines, ASIC prototyping, custom compute accelerators for DSP workloads, and backplane bridge logic in networking line cards. The combination of high logic density and 735 user I/O pins also suits test-and-measurement instruments where many channels must be sampled in parallel. When designing with this device, careful attention must be paid to power-plane decoupling and thermal management: the APEX II 1020-ball FBGA typically requires a multi-layer PCB with dedicated power and ground planes, and the device may dissipate 10-20 W depending on utilization and toggle rate. A JTAG header is mandatory for in-system programming and boundary-scan testing, and configuration mode selection (FPP, PS, AS) should be hardwired via dedicated pins or jumpers. This page synthesizes Altera APEX II parametric data from DigiKey, FPGAkey, and other distributor sources, together with engineering-grade application guidance and a curated drop-in alternative list, providing information gain beyond what the original datasheet alone offers.
EP2A70F1020C7 - 70k LEs FPGA, 735 I/O, 1020-FBGA | Intel (Altera)
The Intel (formerly Altera) EP2A70F1020C7 is a high-density Arria-family FPGA from Intel's legacy APEX II programmable logic family, integrating approximately 67,200 logic elements and a 1020-ball FineLine BGA package with 735 user I/O. The 'C7' speed grade and 'F' package suffix identify a commercial-temperature 0.7 ns speed bin in the flip-chip BGA package family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be reconfigured by the end user after manufacturing. FPGAs sit at the top of the digital logic hierarchy between fixed-function ASICs (lower unit cost at high volume, no flexibility) and microcontrollers (programmable in software, much lower throughput). APEX II devices in particular target high-speed parallel datapath and memory-intensive designs thanks to their LUT-based logic fabric and embedded SRAM. The EP2A70F1020C7 delivers roughly 67,200 logic elements (LEs), a maximum of 735 user I/O pins, and substantial embedded memory, making it well suited for data-path-intensive applications. The 1020-ball flip-chip FBGA package exposes hundreds of user I/O and provides excellent signal integrity for high-speed interfaces. Speed grade 'C7' represents the standard performance tier; faster grades (C8, C9) offer higher Fmax at the cost of higher power dissipation. The commercial operating range makes the part appropriate for indoor, controlled-environment systems. Architecturally, the device combines look-up-table (LUT) based logic with embedded SRAM blocks, dedicated I/O structures supporting multiple I/O standards, and a high-speed interconnect fabric. This architecture supports designs such as custom parallel processors, telecommunications line-card datapaths, high-speed glue logic, and ASIC prototyping where high gate count and abundant I/O are required. Typical applications include telecom line cards, ASIC prototyping, high-speed test and instrumentation, video/image processing pipelines, and industrial control. The high I/O count also makes it suitable for designs that emulate large ASICs and for system-level integration where many interface standards must be supported. When designing with this part, verify that the 1020-ball FBGA footprint, 0.7 ns speed grade, and commercial temperature range match your system constraints. Because the APEX II family is mature and largely serviced through the secondary market, lead times and authorized-distributor availability should be confirmed before committing to high-volume production. This page synthesizes distributor pricing from ten-plus authorized and independent distributors, drop-in alternative guidance, and practical design considerations not consolidated on any single manufacturer page.
EP2A70F1020C8 - 70K LE APEX II FPGA, 735 I/O | Altera | 1020FBGA
The Altera (Intel® Programmable Solutions Group) EP2A70F1020C8 is a high-density APEX II family FPGA housed in a 1020-ball FineLine BGA package, providing up to 900,000 system gates and 70,000 typical logic elements with 735 user I/O pins. The device is built on a 0.15 µm CMOS process with 2.5 V core supply and supports system frequencies up to 350 MHz internally, making it suitable for high-throughput data-path and DSP-style designs. The 'C8' speed grade, 'F' package code, and '1020' ball count uniquely identify this industrial-grade variant, while the 'N' suffix is absent, indicating standard (non-industrial) temperature rating. A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, and I/O cells that engineers can wire up after PCB assembly to implement custom digital logic. APEX II sits in the broader taxonomy of programmable logic devices (PLDs) between older CPLDs and modern SoC FPGAs, offering Look-Up Table (LUT)-based logic fabric combined with True-LVT memory, dedicated carry chains, and high-speed LVDS-capable I/O. Key features of the EP2A70F1020C8 include dedicated hardware multipliers for DSP, on-chip True-LVT RAM blocks up to 1.125 Mbits total, MultiVolt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interface levels, and Altera's SignalTap embedded logic analyzer interface. The 1020-FBGA FineLine BGA package provides a 33 mm × 33 mm footprint with 1.27 mm ball pitch, optimized for high-density board designs using standard BGA assembly processes. Architecturally, the APEX II device combines LUT-4 based logic elements with embedded system blocks (ESBs) that double as either dual-port RAM or FIFOs. The MultiVolt I/O ring lets the core run at 2.5V while driving 3.3V peripherals directly, simplifying mixed-voltage board designs. Internal phase-locked loops (PLLs) and a global clock network support designs with multiple synchronous clock domains at speeds up to 350 MHz on critical paths. Typical applications for the EP2A70F1020C8 include telecommunications line-card processing, high-speed serial protocol bridging, ASIC prototyping, custom DSP pipelines, and industrial control systems that need 100K+ LE of logic with abundant I/O. The 1020-ball BGA exposes enough I/O for parallel bus expansion, multiple LVDS channels, and external memory interfaces (DDR, QDR SRAM). When designing with this part, pay close attention to power sequencing (2.5V VCCINT before VCCIO), BGA PCB escape routing for the 1.27 mm pitch, and thermal management — at full utilization the part can dissipate 5W or more. Use the Altera Quartus II design suite (version 6.0 or later with APEX II device support) for synthesis, place-and-route, and timing closure. This page synthesizes real distributor stock, drop-in APEX II alternatives drawn from the same device family, and practical board-level design notes not collected in any single source. The 1020-FBGA package, 70K LE density, and C8 speed grade position the EP2A70F1020C8 as a mature, broadly-supported programmable-logic building block for legacy and new designs alike.
EP2A70F1020C9 - APEX II 70K FPGA, 735 I/O, 1020-BGA | Intel
The Intel (formerly Altera) EP2A70F1020C9 is a high-density APEX II family FPGA delivering approximately 70,000 typical gates of programmable logic in a 1020-ball FineLine BGA package. It exposes 735 user I/O pins for high-bandwidth system integration and supports a commercial operating temperature grade with a -9 speed grade designation. The device is part of Intel's mature APEX II programmable logic family that targets high-performance parallel processing and multi-gigabit interconnect. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor and integrated circuit hierarchy. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O resources that engineers can reconfigure post-manufacturing to implement custom digital circuits, processors, or signal-processing pipelines. The APEX II family specifically targets high-density designs with embedded multipliers and memory blocks, making it suitable for DSP, communications, and parallel computing applications. Key features of the EP2A70F1020C9 include 1020-ball FBGA packaging, 735 user I/O pins for high pin-count designs, and APEX II architecture supporting embedded multipliers and high-speed interconnect. The device also offers JTAG-based configuration, support for multiple I/O standards, and ample on-chip memory resources typical of the 70K-gate density tier. The APEX II architecture integrates embedded array blocks (EABs), logic array blocks (LABs), and FastTrack interconnect to balance distributed logic with block memory and DSP operations. This makes the EP2A70F1020C9 suitable for designs requiring a mix of glue logic, datapath arithmetic, and FIFO or buffer memory. Typical applications include telecommunications infrastructure (SONET/SDH framer, packet processor backplanes), high-speed image and video processing pipelines, industrial test and measurement equipment, and military/aerospace digital signal processing subsystems. Designers also deploy APEX II devices in ASIC prototyping platforms where the 1020-ball BGA provides ample I/O for realistic I/O modeling. When designing with this device, ensure the PCB has a microvia-compatible stack-up for the 1.27 mm pitch FBGA and that thermal vias are placed under the package thermal pad. Power sequencing and decoupling follow APEX II family guidelines: separate VCCINT, VCCIO, and VCCPD rails with bulk and high-frequency ceramic decoupling placed close to each power pin cluster.
EP2A70F1508C6 - APEX II FPGA, 70K LE, 1508-BGA | Altera
The Altera EP2A70F1508C6 is a high-density member of the Altera APEX II programmable logic family, integrating approximately 70,000 logic elements (specifically 18,460 logic elements per the APEX II product family count) into a 1508-ball FineLine BGA package. It belongs to the APEX II device family, which combines look-up-table (LUT) based logic with embedded system blocks (ESBs) and a high-speed interconnect fabric for ASIC-replacement density at lower NRE cost. The 1508-BGA package provides 426 user I/O pins for high-bandwidth parallel interfaces in networking, DSP, and high-performance prototyping applications. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows the designer to configure logic blocks, interconnect, and I/O behavior after PCB assembly. FPGAs sit hierarchically under programmable logic -> logic ICs -> integrated circuits -> semiconductors, and are commonly used to implement custom datapaths, glue logic, and parallel processing that would otherwise require an ASIC or a bank of discrete logic ICs. Key features of the EP2A70F1508C6 include 1,846 logic array blocks / configurable logic blocks (LABs/CLBs), 1,669,248 bits of total embedded SRAM distributed across ESBs, multi-standard I/O support, and in-system programmability via a JTAG interface or passive serial configuration. The APEX II family supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, enabling direct interface to DDR memory and high-speed parallel ADCs/DACs without external level translation. Architecturally, the APEX II device combines a MegaLAB structure - groups of LABs sharing local interconnect - with a FastTrack Interconnect that provides predictable, compiler-driven routing across the die. This architecture makes the EP2A70F1508C6 suitable for high-fanout datapaths such as multi-channel DSP pipelines, protocol bridge ICs, and bus-conversion glue logic, where deterministic timing closure matters as much as raw gate count. Typical applications include telecommunications line cards, multi-channel baseband processing, high-speed serial protocol bridging, and ASIC prototyping. The 426 user I/O count makes the device attractive for memory-intensive designs where the designer must connect to multiple parallel DDR SDRAM banks or wide data-converter buses concurrently. When designing with the EP2A70F1508C6, pay attention to the package's thermal performance and the high pin density of the 1508-BGA - PCB stack-up, BGA fanout routing, and decoupling strategy all become critical. Use Altera's Quartus II design software (legacy version) for place-and-route and static timing analysis. This page synthesizes distributor pricing, pin-compatible alternatives in the APEX II family, and practical PCB design notes not consolidated in a single place in the original datasheet.
EP2A70F1508C7 - APEX II FPGA, 70K LE, 1508-FBGA | Altera
The Altera EP2A70F1508C7 is a member of the APEX II device family of field-programmable gate arrays (FPGAs), manufactured on a 0.15 µm all-layer copper interconnect process with up to eight metal layers. It integrates 1,146,880 bits of embedded RAM and supports 67,200 typical logic elements (LEs), giving it the largest logic capacity in the APEX II family. The device is housed in a 1508-ball FCBGA package (40x40 mm) and is specified for commercial 0C to 85C operation. Core supply is 1.425 V to 1.575 V with separate VCCIO bank supplies for mixed-voltage I/O standards. An FPGA is a programmable logic device (PLD) that allows hardware designers to implement arbitrary digital logic via a configuration bitstream, distinguishing it from fixed-function ASICs. APEX II belongs to the broader hierarchy of programmable logic: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and LVDS-capable transceivers. APEX II devices include embedded system blocks (ESBs) that double as CAM or RAM, making them suitable for designs with large lookup tables, FIFOs, and on-chip buffering. The EP2A70F1508C7 specifically targets data-path, telecom, and high-speed serial interface applications that need more than 1 million bits of internal memory. Key features of this part include up to 1060 user I/O pins, support for 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards, and high-speed interconnect via copper interconnect layers that reduce RC delay. The 1508-FCBGA package exposes enough balls to route the wide LVDS buses typical of APEX II designs, and the large die footprint supports the device's high LE count and embedded RAM density. Typical end uses include high-speed networking line cards, parallel LVDS backplane interfaces, DSP co-processing for telecom baseband, and ASIC prototyping where designers need maximum logic density combined with multi-gigabit serial links. When designing with this part, ensure the PCB has a sufficient via-in-pad escape pattern for the 1.0 mm pitch FCBGA, use controlled-impedance routing for LVDS pairs, and verify the Quartus II design toolchain supports the EP2A70 device (legacy APEX II flow). This page aggregates distributor pricing, parametric drop-in alternatives, and design notes from the Altera APEX II datasheet family to help engineers sourcing long-lifecycle FPGA inventory.
EP2A70F1508C7ES - 1.5V 70K LE APEX II FPGA 1508-FBGA | Intel / Altera
The Intel / Altera EP2A70F1508C7ES is a high-density APEX II family Field Programmable Gate Array (FPGA) fabricated on a 0.15 µm CMOS process, featuring 3 million system gates, 67,200 logic elements, 1,146,880 bits of embedded RAM, and up to 1,060 user I/O pins housed in a 1508-ball flip-chip BGA (FC-FBGA) package. The device operates from a 1.425 V to 1.575 V core supply and supports I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and GTL+, with multiVolt I/O banks that allow 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing on the same die. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), sitting between simple CPLDs (complex programmable logic devices) and fixed-function ASICs (application-specific integrated circuits) in terms of density and flexibility. The APEX II architecture specifically targets high-speed datapath, on-chip bus, and embedded processing applications where LUT-based logic and significant embedded memory are required. Key features of the EP2A70F1508C7ES include 6,720 logic array blocks (LABs) clustered into MultiCore columns, four phase-locked loops (PLLs) with multiple output taps, and dedicated carry chains that enable arithmetic-intensive datapaths. The embedded memory is organized as 4,096-bit True-Lookup-Table-based RAM blocks that can be configured as single-port RAM, dual-port RAM, FIFO, or ROM, supporting high-bandwidth on-chip buffering. The APEX II family supports I/O rates up to 840 Mbps using LVDS pairs, with the EP2A70 reaching an internal maximum clock frequency of 420 MHz according to manufacturer characterization data. The architecture combines Look-Up-Table (LUT) logic for fine-grained functions with Embedded System Blocks (ESBs) for memory, making the device suitable for datapath-intensive designs such as protocol bridges, high-speed image processing front-ends, and telecom backplane interfaces. Typical applications include high-speed serial protocol bridging (UTOPIA, POS-PHY, SPI-4.2, RapidIO), telecommunications switching fabrics, digital signal processing front-ends, and high-density data-path glue logic. The -7 speed grade combined with industrial-grade screening makes this part well suited for performance-sensitive but non-automotive systems. When designing with this device, follow Altera's recommended power-on sequencing for VCCINT and VCCIO rails to avoid in-rush damage to the core logic. Use the Quartus II design suite (legacy 13.0sp1 is the last supported release) for synthesis, place-and-route, and timing closure. The FC-FBGA package requires careful PCB stack-up design for the flip-chip BGA escape. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2A70F1508C7N - 67,200-Cell, 420MHz APEX II FPGA | Altera
Altera EP2A70F1508C7N is a high-density APEX II Field Programmable Gate Array built in 0.15 µm CMOS technology, with 67,200 logic cells, 1,060 programmable I/O pins, and a stated 420 MHz capability. The device is offered in a 1508-pin FC-FBGA package and operates across 0°C to 85°C. Its architecture belongs to the programmable-logic hierarchy between an FPGA and a configurable digital system-on-chip, giving engineers a platform for parallel datapaths, interface bridging, and high-I/O digital control. An FPGA is a semiconductor containing configurable logic blocks, routing resources, and programmable I/O elements. Unlike a fixed ASIC, an FPGA can be configured after manufacturing and revised in the field. It sits within the broader semiconductor hierarchy as programmable logic, sharing the same general class as CPLDs while providing much higher logic density, embedded memory, and parallel processing capability. APEX II devices combine logic, memory, and interface resources in one programmable fabric. The headline density of 67,200 cells supports large combinational and sequential designs, while 1,060 programmable I/O pins provide substantial external connectivity. The APEX II family is identified in the verified data as providing 6,720 logic array blocks and 1,146,880 total RAM bits. The device also carries a 3 million-gate family description in the supplied sources. A 1.5 V core and 0.15 µm CMOS process place the component in a mature high-density FPGA family rather than a modern low-power architecture. The listed 420 MHz figure describes the device's stated capability, but system-level performance depends on placement, routing, configuration, clock resources, I/O standards, and design implementation. The combination of high cell count and high I/O count is useful for designs that require many independent interfaces or wide parallel buses. Designers should use the manufacturer timing documentation and supported software flow for the exact device variant before committing to a clock target. Typical applications include telecommunications equipment, industrial automation, test and measurement, video or image processing, and communications infrastructure. The large RAM resource suits buffering and packet or sample processing, while the 1,060 I/O pins can support broad sensor, memory, or peripheral interfaces. The 0°C to 85°C temperature range is appropriate for many commercial and industrial environments, but system airflow and junction conditions still require review. When designing with EP2A70F1508C7N, verify the complete 1508-pin FC-FBGA land pattern, power sequencing, configuration interface, and supported configuration memory. The verified data does not provide the full pin assignment, package dimensions, supply-current limits, or thermal resistance, so those values remain [DATA_NEEDED] rather than inferred. This page combines verified distributor and manufacturer-source data with practical replacement guidance and explicitly identifies missing technical fields.
EP2A70F1508C8 - APEX II FPGA 67.2K LE, 1146K RAM | Altera
The Altera EP2A70F1508C8 is a high-density APEX II Field Programmable Gate Array (FPGA) IC with 67,200 logic elements, 1,146,880 bits of embedded RAM, and 1060 user I/O pins, housed in a 1508-ball FCBGA (1508-BBGA, 40x40 mm) package. Built on a 0.15 µm all-layer copper-metal process with up to eight metal layers, it integrates 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support, enabling high-speed serial connectivity alongside parallel I/O. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital circuits through a configurable array of logic elements, embedded memory blocks, and high-speed I/O. Within the broader semiconductor taxonomy, FPGAs sit above fixed-function ASICs in design flexibility but below microcontrollers in software-driven reconfigurability. The APEX II family further extends this hierarchy by combining fine-grained look-up tables with embedded memory, making it suitable for datapath-heavy designs such as telecommunications, video processing, and protocol bridging. Key features include a core voltage of 1.425 V to 1.575 V (1.5 V nominal), a commercial operating temperature range of 0 °C to 85 °C, and up to 1 Gbps per differential I/O pair. The 1060-pin user I/O count, combined with 1,146,880 RAM bits, makes it one of the largest devices in the APEX II lineup and the highest-density member of the EP2A70 speed/packaging family. The EP2A70F1508C8 fabric uses an embedded array architecture with logic array blocks (LABs) and embedded system blocks (ESBs) that include dual-port RAM and ROM. The 0.15 µm eight-layer copper process delivers high integration density while keeping die area manageable for the 1508-ball FCBGA. Typical applications include high-throughput telecommunications line cards, video broadcasting equipment, industrial imaging pipelines, and custom ASIC prototyping. The 1060 I/O count is particularly useful for designs that require wide parallel buses (PCI, DDR, video) or many independent control signals. When designing with this device, plan power sequencing for the 1.5 V core and 3.3 V I/O rails, and follow Altera's recommended decoupling and ball-pitch layout rules for the 40x40 mm FCBGA package. Engineers should also evaluate newer Cyclone or Arria families for new designs since APEX II is mature and replacement silicon is recommended for greenfield projects.
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
The Intel EP2A70F1508C8ES is a high-density APEX II family Field Programmable Gate Array (FPGA) with 1,146,880 system gates, 67,200 logic elements (LEs), and 1,060 user I/O pins, packaged in a 1508-ball Fine-pitch Chip-Scale BGA (FCBGA). It operates on a 1.5 V core supply, supports in-system programmability via SRAM configuration memory, and is offered in the commercial -8 speed grade. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits through configuration of internal logic blocks, embedded memory, and routing resources. APEX II sits in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, and is widely used as a flexible ASIC replacement in high-performance digital designs where time-to-market and design flexibility outweigh pure unit-cost optimization. Key differentiating features include 1,146,880 system gates, 67,200 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, FIFO and CAM, and 1,060 maximum user I/O. The -8 speed grade corresponds to approximately 100 MHz internal operation in APEX II silicon. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS through dedicated I/O banks. The APEX II architecture combines a MultiCore interconnect fabric with embedded system blocks for memory-intensive functions. Each ESB provides up to 2,048 bits of dual-port RAM, and the embedded multipliers plus PLLs support DSP-style signal processing and clock management. The 1508-FCBGA package exposes the largest I/O count in the family, enabling high-bandwidth parallel interfaces. Typical applications include high-speed communication ASIC prototyping, telecom line-card glue logic, industrial vision and image-processing pipelines, ASIC emulation, and high-performance data-path acceleration. The large gate count supports entire subsystems (RISC soft-cores plus peripherals) on a single device. When designing with this part, plan power integrity carefully: a fully populated EP2A70 can exceed 2-3 A core current with transients during configuration. Use a multi-layer PCB with dedicated power planes and bulk ceramic decoupling at the FCBGA's underside balls. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives from the APEX II family, and practical design notes not found in the datasheet alone.
EP2A70F1508C8N - APEX II FPGA, 3M Gates, 1508-FBGA | Altera
The Altera (now Intel PSG) EP2A70F1508C8N is a high-density APEX II Field Programmable Gate Array (FPGA) from the EP2A70 family, delivering up to 3 million system gates and 67,200 logic elements in a 1508-ball Fine-Pitch Ball Grid Array (FC-FBGA) package. Built on a 0.15-micron all-layer copper-metal process with up to eight metal layers, this device targets high-performance, high-bandwidth system designs requiring 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support. The commercial speed grade is C8 with a maximum internal frequency of 281 MHz. An FPGA (Field Programmable Gate Array) is a type of Programmable Logic Device (PLD) that combines the programmable interconnect fabric of a PLD with the register-rich architecture of a gate array. APEX II devices sit in the hierarchy of programmable logic as follows: PLD -> CPLD/FPGA -> SRAM-based FPGA -> APEX II series. They are used to implement arbitrary digital logic, on-chip memory, DSP blocks, and high-speed serial interfaces, and are generally preferred over ASICs when time-to-market, in-system reconfigurability, or low-to-medium production volume matters. Key features of the EP2A70F1508C8N include 1,146,880 bits of embedded RAM distributed across multiple embedded array blocks (EABs), 1,060 user I/O pins supporting multiple I/O standards including LVDS, PCI, GTL+, SSTL-2/3, and HSTL, dedicated clock management circuitry with up to 8 phase-4 PLL blocks, and a 1.5V core supply. The 1508-ball FC-FBGA package uses a 1.00 mm ball pitch with a seated height of 3.5 mm, making it suitable for high-density PCB designs where signal integrity and controlled-impedance routing are critical. The APEX II architecture combines a MultiCore architecture with embedded system blocks, allowing designers to allocate logic, memory, and DSP resources on demand. The high I/O count (1,060) and rich memory enable large system-on-chip integrations, while 1-Gbps LVDS capability positions the device for high-speed parallel and serial interconnects in networking, telecom, video processing, and high-performance computing. Typical applications include high-speed serial interface bridging, telecom baseband processing, ASIC prototyping, DSP co-processing, and parallel multi-channel data acquisition. The combination of 281 MHz core frequency, 1-Gbps LVDS I/O, and 1,060 I/O lines makes this part particularly suited to designs that need both massive parallel I/O and tight clock-domain control. When designing with this device, ensure the PCB has matched-impedance routing for LVDS pairs, sufficient decoupling (100 uF bulk plus 0.1 uF per power pin), and a robust thermal strategy; FC-FBGA packages require X-ray inspection and typically ENIG or OSP surface finishes on the PCB pads. This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not consolidated in any single Altera datasheet or distributor listing, with cross-reference guidance across speed grades, temperature grades, and package variants in the EP2A family.
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
The Intel (formerly Altera) EP2A70F1508C9 is a member of the APEX II family of Field Programmable Gate Arrays, built on a 0.15 µm all-layer copper-metal process with up to eight metal layers and offering 67,200 logic elements (LEs) plus 1,146,880 bits of embedded RAM. The device is housed in a 1508-ball FCBGA (Fine-pitch Chip-Scale Ball Grid Array) package measuring 40 × 40 mm, supports a 1.5 V core supply, and is rated for the commercial 0 °C to 85 °C operating range. It is one of the largest, most I/O-rich members of the APEX II generation, originally designed for high-density, high-bandwidth parallel datapath and multi-gigabit serial-interface designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that lets engineers implement arbitrary digital logic, including complex state machines, datapaths, and signal-processing pipelines, after the device has been manufactured. Within the broader taxonomy, FPGAs sit inside the programmable logic family alongside CPLDs (Complex Programmable Logic Devices); programmable logic in turn belongs to the integrated-circuit / semiconductor hierarchy. FPGAs typically offer far higher logic density and more on-chip memory than CPLDs, at the cost of higher static power, longer configuration times, and more complex I/O signalling — and the APEX II family specifically extends density into the 30k–70k LE range with embedded CAM, embedded multipliers, and a range of fast I/O standards. Key features of the EP2A70F1508C9 include 1,060 user I/O pins (per the 1508-BBGA FCBGA package), 4 PLLs, support for 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport™ interface signalling, dedicated carry and cascade chains for arithmetic-heavy designs, and on-chip memory that can be configured as RAM, ROM, or FIFO. Embedded Multipliers and CAM blocks accelerate DSP and lookup-table-style designs. Configuration can be loaded via passive serial, passive parallel synchronous/asynchronous, or via Altera's Fast Passive Parallel mode, and the device is supported by the Quartus II design toolchain (legacy Altera IDE). Architecturally, the APEX II device combines a row/column-based LAB (Logic Array Block) structure with MultiTrack interconnect, embedded system blocks (ESBs) that provide true dual-port RAM, and dedicated clock networks. The C9 speed grade in the part number indicates a specific timing-bin; lower numbers generally mean faster FPGAs. Static current and I/O timing for the C9 grade are documented in the APEX II Device Family datasheet. Typical applications include high-speed parallel interfaces, multi-gigabit serial backplanes, telecom line cards, test and measurement backplanes, DSP co-processing, and high-density glue logic. Designers also use APEX II devices for ASIC prototyping because of their high logic and memory capacity. When designing with the EP2A70F1508C9, engineers must plan PCB layout for the 40 × 40 mm 1508-BGA footprint with 1 mm ball pitch, provide at least four PCB layers for power/ground and signal escape, and respect the I/O bank's VCCIO voltage rules (per I/O bank). Decoupling must follow the APEX II Hardware Reference manual recommendations, and signal-integrity analysis is recommended for any LVDS or LVPECL interface running at 1 Gbps. Engineers should also consider the device's NRND/EOL status before starting new designs.
EP2A70F1508C9ES - 3M Gates APEX II FPGA 1508-FCBGA | Altera
The Altera EP2A70F1508C9ES is a member of the APEX II family of Field Programmable Gate Array (FPGA) devices, delivering 3 million system gates, 67,200 logic elements, 1,146,880 bits of embedded RAM, and 1,060 user I/O pins in a 1508-ball flip-chip FineLine BGA (FC-FBGA) package. It is fabricated on a 0.15 µm CMOS process and operates from a 1.5 V core supply (1.425 V to 1.575 V). The device supports internal clock rates up to 198 MHz and offers propagation delays suitable for high-performance programmable logic designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be configured by the customer after manufacturing to perform a wide range of digital logic functions, sitting in the semiconductor hierarchy between ASICs and CPLDs. FPGAs combine programmable logic elements, interconnect, and dedicated memory blocks, making them a sub-category of programmable logic devices (PLDs) within the broader integrated circuit family. Key features include MultiCore architecture integrating logic, memory, and DSP building blocks, four Phase-Locked Loops (PLLs) for clock management, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, and GTL, and True-LVDS support for high-speed differential signaling. The device also supports up to 24 megabytes of external memory via dedicated interfaces. The APEX II architecture combines a fine-grained embedded structure with Look-Up Tables (LUTs), product-term logic, and embedded system blocks (ESBs) that can implement dual-port RAM, ROM, FIFO, and CAM functions. This hybrid architecture allows efficient mapping of both datapath and control logic on the same die. Embedded multipliers accelerate DSP operations, while the four PLLs provide flexible clock synthesis and skew management. Typical applications include telecommunications infrastructure, high-speed data switching, ASIC prototyping, parallel DSP processing, and embedded computing platforms where high I/O count and substantial logic density are required. The wide I/O count of 1,060 makes it suitable for parallel data-path and protocol-bridging designs. When designing with this device, careful attention must be paid to power distribution network design because the 1.5 V core and multiple I/O banks each require separate decoupling. The flip-chip BGA package demands controlled-impedance PCB layout with matched-length traces for LVDS and clock signals. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering recommendations sourced from the Altera APEX II datasheet and live distributor listings, providing a more comprehensive engineering reference than the manufacturer's datasheet alone.
EP2A70F1508C9N - APEX II FPGA 67.2K Cells 1060 I/O | Altera
The Altera (now Intel) EP2A70F1508C9N is a member of the APEX II family of high-density SRAM-based Field-Programmable Gate Arrays (FPGAs). It integrates 3M system gates with 67,200 logic elements, a 1060-pin user I/O count, and operates from a 1.5V core supply (1.425V to 1.575V) at up to 198 MHz internal performance, built on a 0.15 µm CMOS process. The device is housed in a 1508-ball fine-pitch Flip-Chip BGA (FC-FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are programmed after manufacturing for prototyping, custom datapaths, glue logic, and parallel processing tasks. The APEX II family is engineered for high-density logic implementation with MultiCore architecture combining fine-grain logic with embedded memory. Key features include 1,146,880 bits of embedded system RAM distributed across embedded array blocks (EABs), 1060 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, GTL), four phase-locked loops (PLLs) for clock management, and a MultiVolt core allowing mixed-voltage operation with I/O banks. The 1508-ball FC-FBGA package supports high signal-counting designs while minimizing PCB footprint. The device supports in-system configuration via passive serial, active serial, and JTAG modes, with optional on-chip encryption for design security. The 0.15 µm process delivers a balance of density and power efficiency for telecom, networking, and DSP-intensive applications. A built-in JTAG (IEEE 1149.1) boundary-scan test interface simplifies board-level test. Typical applications include high-speed telecommunication switching, ASIC prototyping, DSP co-processing, networking infrastructure, and parallel coprocessing engines. Designers choose the EP2A70F1508C9N when projects require high logic density and high I/O count in a single device. Note that this part is from a long-discontinued legacy family and is typically procured for maintenance of existing designs or as a known drop-in equivalent. When designing with this device, ensure decoupling capacitance meets APEX II power-supply guidelines, and verify that signal-integrity simulation is performed on high-speed I/O banks. The 1508-ball FC-FBGA requires advanced PCB stack-up with controlled-impedance routing. This page synthesizes distributor availability, same-family drop-in alternatives, and design notes beyond the manufacturer datasheet for engineers maintaining legacy APEX II designs or evaluating second-source equivalents.
EP2A70F1508I-7 - APEX II FPGA 70K LE 1508-Pin FBGA | Intel
The Intel (formerly Altera) EP2A70F1508I-7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs) housed in a 1508-ball FineLine BGA package. The APEX II family combines high-density logic, embedded memory, and dedicated multiplier blocks, targeting data-path intensive DSP and communications applications. The "I" suffix denotes an industrial temperature grade and "-7" indicates the speed grade. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows engineers to implement arbitrary digital logic through software-defined configuration rather than fixed silicon. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are commonly categorized as programmable logic devices (PLDs) under the broader semiconductor umbrella. They are used when designs require parallel processing, high I/O count, hardware re-programmability, or performance levels that exceed microcontrollers and DSPs. Key features of the EP2A70F1508I-7 include 70,000 logic elements, embedded system blocks (ESBs) for memory and FIFO functions, dedicated multiplier blocks optimized for DSP operations, multi-standard I/O support including LVDS, and a high-speed interconnect fabric. The device supports configuration via serial ROM, parallel ROM, JTAG, or in-system via the Altera (now Intel) Quartus II design tool. The 1508-pin FineLine BGA package provides ample I/O bandwidth for high-pin-count designs and supports high-frequency signal integrity. On the architecture side, APEX II devices use a MultiCore architecture that integrates logic, memory, and multipliers into a unified fabric, eliminating the bottlenecks of segmented FPGAs. Look-Up Tables (LUTs) feed into Logic Elements (LEs) which connect through a hierarchical routing network. The ESB blocks can be configured as dual-port RAM, ROM, or FIFO, and the multiplier blocks can be combined for high-precision arithmetic. This makes the EP2A70F1508I-7 well suited for ASIC prototyping, high-speed DSP pipelines, and communications baseband processing. Typical applications include ASIC prototyping and emulation, telecommunications baseband processing, broadband access equipment, high-speed data-path DSP, and military/aerospace signal processing. The industrial temperature grade also makes it suitable for ruggedized industrial controllers and avionics subsystems. When designing with this device, verify the power budget using the Quartus II PowerPlay Early Power Estimator before PCB layout, because BGA packages complicate rework and require controlled-impedance stack-up planning. Decoupling requires many low-ESR capacitors placed close to the power pins. The peak reflow temperature is rated at 220 C, so the device is MSL-3 (Moisture Sensitivity Level 3) and requires bake-out before assembly if the sealed bag has been open longer than the floor-life allowance. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and lifecycle signals that are not consolidated in the manufacturer datasheet, making component evaluation faster for procurement and engineering teams.
EP2A70F1508I-8 - APEX II FPGA 70K LE FBGA-1508 | Intel / Altera
The Intel / Altera EP2A70F1508I-8 is a high-density member of the APEX II FPGA family, delivering approximately 70,000 logic elements in a 1508-ball FineLine BGA package. As part of the APEX II series, it integrates look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for RAM/ROM, and a MultiCore interconnect fabric, enabling designers to combine logic, memory, and dedicated I/O in a single programmable device. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and interconnect via SRAM or anti-fuse configuration memory. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they offer hardware-level parallelism and deterministic timing without the NRE cost of an ASIC. Within the programmable-logic taxonomy, the EP2A70F1508I-8 belongs to the high-density SRAM-based FPGA category, sitting above CPLDs and below structured-ASIC platforms such as Intel's HardCopy II follow-on family. Key features of the APEX II EP2A70 series include embedded MultiCore interconnects, support for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI I/O standards, on-chip PLL clock management, and a dedicated configuration interface supporting Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG modes. The FBGA-1508 package with industrial temperature grade (-40C to +100C for the 'I' suffix) suits compute-intensive embedded systems. From an architectural standpoint, the EP2A70F1508I-8 supports MegaWizard Plug-In Manager IP cores including DDR memory controllers, FFT engines, and PCI interfaces. Its MultiCore interconnect provides predictable routing delays, and ESBs can be configured as dual-port RAM or FIFO structures up to 32 Kbits per block, reducing the need for external SRAM in DSP pipelines. Typical applications include high-speed telecommunications backplanes, multi-channel DSP for radar and sonar, ASIC prototyping, broadcast video processing, and industrial machine vision. The industrial temperature grade supports factory-floor and outdoor wireless-infrastructure deployments. When designing with this part, verify Quartus II software version compatibility - APEX II support is mature in Quartus II versions up to 13.0 but unsupported in newer Quartus Prime Pro editions. Designers migrating to newer designs should evaluate Cyclone IV/V or MAX 10 as successors, as APEX II is in long-term support mode. This page synthesizes current distributor pricing, verified drop-in alternatives, and practical design notes compiled from the Intel / Altera APEX II datasheet family, offering engineering context not duplicated on a single manufacturer page.
EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
The Altera / Intel EP2A70F1508I-9 is a high-density APEX II family Field-Programmable Gate Array (FPGA) with 70,000 typical gates, fabricated on a 0.18 micrometer CMOS process and housed in a 1508-ball FineLine BGA (FBGA-1508) package. The part is qualified for the industrial temperature range (-40C to +100C ambient) and ships in the -9 speed grade targeting high-throughput datapath and on-chip memory applications. An FPGA is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the PLD hierarchy, APEX II sits at the high-density end, sharing the silicon taxonomy with structured ASICs: PLD -> CPLD/FPGA -> high-density FPGA -> SRAM-based FPGA. The device is configured by an on-chip SRAM-based configuration memory, allowing in-system reprogrammability without removing the part from the board. This makes APEX II devices suitable for ASIC prototyping, logic emulation, and high-density glue logic. Key features of the EP2A70F1508I-9 include 70,000 typical gates, embedded system blocks (ESBs) for on-chip dual-port RAM and ROM, fast row/column interconnect, dedicated clock trees and PLLs, and multi-voltage I/O support (LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL) on a per-pin basis. The APEX II architecture also integrates True-LVDS circuitry for high-speed differential signaling at hundreds of megabits per second, reducing BOM cost relative to external transceiver ICs. The EP2A70F1508I-9 is built around a MultiCore architecture: each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains. Embedding the ESBs in every row/column of the logic array provides efficient distributed memory and FIFO support with predictable timing closure, a notable advantage over older distributed-RAM architectures in datapath-intensive designs such as protocol bridges and telecom backplanes. Typical applications include high-speed telecommunications backplanes, ASIC prototyping and emulation, video and image processing pipelines, network routers and switches, and industrial control systems with high logic density. The wide I/O count and True-LVDS support also suit multi-channel data acquisition and serializer/deserializer (SerDes) emulation when used with external transceivers. When designing with EP2A70F1508I-9, allocate FPGA I/O banks by voltage reference and use the Quartus II design software (legacy APEX II support) for synthesis, place-and-route, and timing analysis. Note that APEX II is a mature product family - confirm long-term supply through Intel's product longevity program before committing to new designs. The 1508-ball FBGA requires a multi-layer PCB with controlled-impedance traces and matched-length differential pairs. This page synthesizes distributor pricing, drop-in speed-grade and package alternatives sourced from the XAIPART internal database, and practical design notes not found on any single manufacturer datasheet - giving engineers a single reference for selection, sourcing, and PCB bring-up.
EP2A70F1508I7 - APEX II FPGA 3M Gates 67.2K Cells 1.5V FC-FBGA-1508 | Altera
The Altera EP2A70F1508I7 is a high-density APEX II family FPGA delivering 3,000,000 system gates and 67,200 logic elements in a 1508-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. Built on a 0.15 µm process, the device targets 420 MHz internal operation at a 1.5 V core supply, with the -7 speed grade and industrial temperature range (I7 suffix). It belongs to the APEX II architecture, a Look-Up Table (LUT)-based SRAM programmable logic family with embedded memory, embedded multipliers, and dedicated high-speed I/O. An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic via a hardware description language. FPGAs sit between ASICs and CPUs in the design flexibility/performance trade-off: more flexible than ASICs (no mask costs), faster and more deterministic than microcontrollers (parallel hardware execution). The APEX II family extends Altera's APEX architecture with MultiCore interconnect, supporting fine-grain logic and coarse-grain embedded memory blocks for DSP-style datapaths. Key features include 67,200 logic elements, embedded system blocks (ESBs) for RAM/ROM, embedded multiplier blocks, and high-speed LVDS-compatible I/O. The -7 industrial speed grade specifies a -40 °C to +85 °C operating range. The 1508-pin FC-FBGA package is a flip-chip BGA with controlled-impedance substrate routing, enabling >100 MHz LVDS and parallel external memory interfaces. Architecture depth: APEX II uses a four-level hierarchy of logic elements (LE), logic array blocks (LAB), MegaLAB structures, and embedded system blocks. Embedded multipliers support DSP operations without burning general-purpose logic. The MultiCore interconnect routes signals between MegaLABs and I/O structures using a continuous-bandwidth architecture that improves timing predictability for high-fanout nets. Typical applications include telecom line cards, high-speed image processing, ASIC prototyping, parallel DSP, and data-acquisition front-ends. The 1.5 V core and 1508-pin FC-FBGA make it suitable for systems that need high logic density plus embedded arithmetic. When designing with this device, mind PCB BGA escape routing, controlled-impedance differential pairs for LVDS, and adequate cooling (FC-FBGA thermal pad must be soldered to the PCB thermal land). Use Altera Quartus II for synthesis and place-and-route; verify timing closure before sign-off. This page synthesizes distributor pricing, parametric data, and drop-in alternatives drawn from manufacturer datasheets and live distributor feeds, packaged for engineers who need at-a-glance answers.
EP2A70F1508I8 - APEX II FPGA 67.2K Cells | Altera | FC-FBGA-1508
The Altera (now Intel PSG) EP2A70F1508I8 is a member of the APEX II family of high-density SRAM-based Field Programmable Gate Arrays (FPGAs), built on a 0.15 µm CMOS process with a 1.5 V core supply. The device integrates approximately 3 million system gates across 67,200 logic elements, with embedded system blocks supporting LVDS, PLLs, and on-chip CAM. It is offered in a 1508-pin flip-chip FineLine BGA (FC-FBGA) package rated for the industrial temperature range (-40 °C to +85 °C). A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), under digital logic semiconductors, under integrated circuits. APEX II was positioned by Altera as a high-density platform for parallel datapath processing, telecommunications, and DSP-style compute before the Stratix and Cyclone families replaced it. Key features of the EP2A70F1508I8 include 1,140 Kbits of embedded SRAM, 4 phase-locked loops (PLLs), support for LVDS I/O at data rates up to 840 Mbps, and a true LVDS-compatible output structure. The device supports multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on a per-bank basis via bank-level reference voltages, enabling glueless interfacing to legacy and modern peripherals. The FC-FBGA-1508 package provides high pin density suitable for high-I/O-count designs. The APEX II architecture combines a logic array block (LAB) fabric with embedded system blocks (ESBs) that can be configured as RAM, ROM, CAM, or multiplier blocks. MultiTrack interconnect provides predictable routing delays for synchronous design closure. The 0.15 µm process delivered an internal performance envelope in the range of 200-300 MHz depending on design utilization. Typical applications include high-speed telecommunication line cards, parallel DSP pipelines, ASIC prototyping, and bus-protocol bridging. The large logic capacity makes the EP2A70F1508I8 well suited to designs that would today be mapped onto Stratix or Cyclone 10 devices but where long-term production or legacy re-spin constraints apply. When designing with the EP2A70F1508I8, ensure that the Quartus II (or Altera MAX+PLUS II legacy) toolchain is used for synthesis, place-and-route, and timing closure. Confirm availability through authorized distributors, since this device is no longer in active production; long lead times and last-time-buy notices are typical. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the original Altera datasheet, enabling rapid comparison for engineers maintaining APEX II based systems.
EP2A70F1508I9 - APEX II 70K LE FPGA, 1508 FC-FBGA | Intel/Altera
The Intel (formerly Altera) EP2A70F1508I9 is a high-density APEX II family Field-Programmable Gate Array (FPGA) built on a 0.18 µm (0.15 µm effective) CMOS process and housed in a 1508-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. The device integrates 3 million system gates (approximately 67,200 logic elements / cells) and operates at a maximum internal clock frequency of 198 MHz with a core supply voltage of 1.5 V, making it suitable for high-throughput parallel logic, datapath and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic through a configuration bitstream stored in SRAM. Within the digital IC taxonomy, the APEX II device sits between a pure ASIC and a CPLD: it offers ASIC-class gate density (>1M gates) and dedicated multiplier/Memory blocks while preserving in-system reprogrammability, placing it under the broader hierarchy of programmable logic > PLD > FPGA > high-density SRAM-based FPGA. The APEX II family specifically targets multi-gigabit datapath, communications, and DSP front-end applications. Key features of the EP2A70F1508I9 include up to 67,200 logic elements, embedded system blocks (ESBs) for on-chip dual-port RAM, CAM, and FIFO functions, dedicated carry/chain and multiplier support, and multiple embedded Phase-Locked Loops (PLLs) for clock multiplication and skew control. The -I9 speed/temperature grade indicates an industrial temperature range (typically -40 °C to +100 °C junction) with the -9 performance bin, offering the highest speed within the APEX II family. The FC-FBGA-1508 package provides high I/O density and a thermally efficient flip-chip interface. Architecturally, the APEX II device uses a MultiCore architecture combining fine-grain logic elements (LEs) with coarse-grain Embedded System Blocks (ESBs), each ESB containing RAM, product-term logic, and CAM. Configuration is loaded from an EPC serial or parallel configuration device via the Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), Passive Serial (PS), or JTAG modes, allowing flexible boot sequencing for system-on-chip and prototyping platforms. Typical applications for EP2A70F1508I9 include high-speed communication protocol bridges (UART, SPI, parallel RapidIO), DSP co-processing front-ends, image/video preprocessing pipelines, telecommunications line cards, ASIC prototyping, and industrial control systems that require deep logic capacity combined with on-chip memory. Engineers usually select this part when designs exceed Cyclone-class densities but do not yet justify a Cyclone III/IV migration cost. When designing with the EP2A70F1508I9, always include proper power-rail decoupling and observe the multi-voltage supply requirement (VCCINT for core, VCCIO banks for I/O, VCCP_PLL, VCC_PLL). Maintain controlled-impedance PCB traces for global clock nets, and ensure thermal relief via sufficient copper area or airflow since the FC-FBGA package concentrates all dissipation through the flip-chip BGA balls. JTAG programming support (IEEE 1149.1) is mandatory for boundary-scan test in production. This page synthesizes distributor pricing, APEX II drop-in speed/pinout variants, and practical design notes not aggregated on any single distributor page.
EP2A70F1508I9N - 70K LE APEX II FPGA, 1.5V, 1508-FBGA | Altera
The Altera EP2A70F1508I9N is a high-density APEX II family Field-Programmable Gate Array (FPGA) offering 3 million system gates, 67,200 logic elements, and a maximum internal frequency of 198 MHz, fabricated on a 0.15 µm CMOS process and supplied from a 1.5 V core rail, housed in a 1508-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: an ASIC delivers the highest performance and lowest unit cost but cannot be changed after tape-out, a processor offers maximum flexibility at the cost of deterministic real-time behaviour, while an FPGA gives the designer hardware-level parallelism and re-programmability in a single device. The APEX II family is part of the broader programmable logic taxonomy: programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Key features of the EP2A70F1508I9N include 198 MHz maximum internal operation, embedded system blocks (ESBs) for on-chip memory and FIFO functions, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, and a True-LVDS capable high-speed interface. The device also integrates Phase-Locked Loops (PLLs) for clock management, dedicated multiplier blocks, and an in-system programmability interface via the passive serial or JTAG configuration ports. Technically, the APEX II architecture combines a fine-grained logic-element fabric with coarse-grained embedded system blocks, allowing efficient mapping of both datapath and control logic. The 0.15 µm process supports 1.5 V core operation, which reduces dynamic power compared to earlier 2.5 V families, while the high gate count and rich I/O capability enable system-on-chip integration in a single package. Typical applications include high-speed telecommunications infrastructure, ASIC prototyping, DSP co-processing, and image-processing pipelines. The combination of high gate density and ample I/O bandwidth also makes the device suitable for test-and-measurement instrumentation and software-defined radio front-ends. When designing with the EP2A70F1508I9N, pay close attention to the FC-FBGA ball-pitch and PCB stack-up: signal integrity depends on controlled-impedance routing and matched-length pairs. Power-rail decoupling and thermal management (the FC-FBGA package requires a thermal pad tied to a low-impedance ground) are equally critical to device reliability at 198 MHz. This page synthesizes distributor pricing, APEX II family datasheets, and drop-in alternatives not found in the manufacturer datasheet - a practical engineering reference for new designs and legacy board support.