FPGA & CPLD
Produits (6666)
EP1SGX25FF1020C6 - Stratix GX FPGA 25,660 LE 607 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP1SGX25FF1020C6 is a high-density, high-performance Stratix GX FPGA fabricated on a 1.5 V CMOS process and packaged in a 1020-ball FC-FBGA with 33 x 33 mm body and 1 mm ball pitch. The device integrates 25,660 logic elements organized into 2,566 LABs and exposes 607 user I/O pins, with embedded transceivers, embedded multiplier blocks, and on-chip TriMatrix memory supporting up to 1.94 Mbit. The 'C6' speed grade targets commercial-grade applications operating from 0 °C to 85 °C with a typical core voltage of 1.5 V. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks, programmable interconnect, and dedicated I/O. Stratix GX is Intel's high-performance FPGA family with embedded multi-gigabit transceivers (MGTs) and DSP blocks optimized for serial connectivity, signal processing, and high-throughput parallel processing. Stratix GX sits within the broader hierarchy: programmable logic -> FPGA -> high-performance transceiver-enabled FPGA -> Stratix GX family. The combination of embedded transceivers, DSP blocks, and abundant logic makes Stratix GX suitable for communication infrastructure, broadcast video, and defense systems. Key differentiating features of the EP1SGX25FF1020C6 include 24 embedded transceivers supporting data rates up to 3.125 Gbps (typical for the Stratix GX family), dedicated hardware multipliers, embedded memory blocks totaling up to 1.94 Mbit (TriMatrix architecture), and a flexible PLL clock network. The 'FF1020' package option provides 607 general-purpose user I/Os with LVDS, LVTTL, SSTL, and HSTL I/O standards. The 'C6' speed grade places it in the moderate-performance commercial tier, balanced between logic throughput and power consumption. The device's architecture leverages the same silicon die as other Stratix GX 25K density members, with package, speed grade, and temperature grade defining the marketing part number. Internal clock networks, on-chip termination, and high-speed serial interfaces allow designers to implement multi-gigabit serial protocols, parallel DSP pipelines, and custom accelerators on a single device without external PHY chips. This integration reduces BOM cost and board complexity for high-end applications. Typical applications for the EP1SGX25FF1020C6 include 10G Ethernet switching and aggregation, SONET/SDH and OTN line card processing, high-definition broadcast video routers and format converters, base-station signal processing for wireless infrastructure, defense and aerospace signal processing, ASIC prototyping, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Fibre Channel). When designing with this device, ensure PCB layout meets the 1 mm ball pitch FBGA escape constraints, including microvia stack-ups and controlled-impedance routing for the transceiver channels. Power decoupling must satisfy Intel's Stratix GX power distribution network guidance (separate analog, PLL, and I/O supply rails).
EP1SGX25FF1020C6BN - Stratix GX FPGA 25.6K LE 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C6BN is a Stratix GX family field-programmable gate array (FPGA) built on a 130nm process, integrating 25,660 logic elements, 1,944,576 RAM bits, and 20 embedded multipliers in a 1020-ball flip-chip BGA (FC-FBGA) package, with core supply of 1.5V. It belongs to the first-generation Stratix GX transceiver-optimized family, featuring up to 20 full-duplex high-speed transceiver channels supporting serial rates up to 3.125 Gbps, and is intended for high-bandwidth serial-interface applications including backplane bridging, proprietary chip-to-chip links, and early-generation Serial RapidIO / PCI Express endpoints. What is a Stratix GX FPGA? A Stratix GX FPGA is a high-density programmable logic device that combines general-purpose logic fabric with embedded high-speed serial transceivers, allowing system designers to implement wide parallel state machines and high-speed serial I/O on the same die. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor. Stratix GX parts are positioned between pure logic FPGAs (e.g., Cyclone) and full transceiver ASSP PHYs, giving a configurable fabric plus hardened multi-gigabit transceivers. Key features include 607 maximum user I/O pins, embedded RAM organized as TriMatrix memory blocks (M512/M4K/M-RAM blocks totaling 1,944,576 bits), 20 embedded 18x18 multipliers for DSP, dedicated PLL clock networks, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM via dedicated DQS circuitry. The 130nm process node yields typical core frequencies up to 500 MHz for internal logic, while transceivers operate up to 3.125 Gbps per channel. The architecture combines a 4-input look-up table (LUT)-based logic element array, dedicated routing, and pre-engineered hard IP such as the embedded transceiver blocks, which removes the need for external PHY ICs in many serial-link designs. The 1020-ball FC-FBGA package exposes a high pin count for memory and parallel I/O expansion while supporting the heat dissipation needed for active transceivers. Typical applications include 1G/10G Ethernet bridging, Serial RapidIO interconnect, backplane SERDES, PCI Express endpoint implementations, proprietary chip-to-chip serial links in telecom/datacom equipment, and high-speed data-acquisition front ends. The combination of embedded transceivers and DSP blocks also suits line-card traffic managers and protocol-bridging ASIC replacements. When designing with this device, plan thermal management carefully because transceiver channels and logic fabric together can pull several watts; the FC-BGA requires a multi-layer PCB with via-in-pad thermal vias to the internal ground/power planes. Use the Quartus II design suite (legacy software) and verify pinout against the Stratix GX device handbook, since the part is no longer recommended for new designs. This page synthesizes distributor stock, same-family drop-in alternatives, lifecycle status and practical design notes that complement the manufacturer datasheet.
EP1SGX25FF1020C6ES - Stratix GX FPGA, 25.66K LE, 1020-BGA | Altera
The Altera (Intel) EP1SGX25FF1020C6ES is a high-density Stratix GX FPGA from Altera's first-generation Stratix GX family, built on a 130 nm CMOS process and offering 25,660 logic elements in a 1020-ball FineLine BGA package with 33 x 33 mm body and 1 mm ball pitch. It integrates up to 2,566 Logic Array Blocks (LABs), embedded TriMatrix memory, dedicated DSP blocks, and up to 20 full-duplex multi-gigabit transceiver channels that target high-speed serial I/O between 622 Mbps and 3.1875 Gbps. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic, memory, and I/O resources can be programmed by the end user after manufacture. In the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> digital integrated circuits. Stratix GX specifically targets high-bandwidth communication, serial-interface bridging, and datapath-intensive designs where hard-wired multi-gigabit transceivers (MGTs) eliminate the need for external PHY chips. Key features of the EP1SGX25FF1020C6ES include 1.5 V core supply operation, 0 to 85 °C commercial temperature grade, on-chip PLL-based clock management, dedicated 18 x 18 multipliers for DSP, and support for external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and SDR SDRAM. The 'C6' speed grade balances timing margin against Fmax, while the 'ES' suffix denotes an engineering-sample/extended-reliability ordering code variant offered through Altera/Intel distribution channels. Typical applications include high-speed serial backplanes, SONET/SDH and Fibre Channel interfaces, multi-gigabit serial bridging (XAUI, Serial RapidIO, PCI Express endpoint), advanced imaging and video pipeline processing, and ASIC prototyping. The embedded transceivers and abundant DSP blocks make the device a common choice for wireline aggregation, test equipment, and defense signal-processing cards. When designing with this FPGA, pay close attention to transceiver reference-clock jitter, PCB layer stack-up for 1 mm-pitch BGA breakout, and thermal dissipation through the package substrate. Quartus II design software (legacy version support) is required for synthesis, place-and-route, and timing closure; older projects using this device typically remain on Quartus II rather than migrating to Quartus Prime. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes that complement the Altera Stratix GX Device Family Data Sheet.
EP1SGX25FF1020C6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel EP1SGX25FF1020C6N is a high-density Stratix GX Field-Programmable Gate Array (FPGA) built on a 1.5 V CMOS process, integrating 25 660 logic elements, 2 566 Logic Array Blocks (LABs), and embedded transceiver circuitry in a 1020-ball FineLine BGA package measuring 33 x 33 mm with 1 mm pitch. The device is part of the Stratix GX family, which adds 3.125 Gbps multi-gigabit transceivers and dedicated serializer/deserializer hardware alongside the general-purpose Stratix fabric for high-speed serial I/O. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital circuits. Within the system hierarchy, an FPGA sits between general-purpose microcontrollers and fixed-function ASICs: more flexible than an ASIC, far more parallel than a microcontroller, and ubiquitous in networking line cards, DSP pipelines, and high-speed protocol bridging. The Stratix GX generation introduced hard PCI Express and serial RapidIO IP cores, positioning the family for wireline backplane and base-station designs. Key features of the EP1SGX25FF1020C6N include 607 user I/O pins, 20 global clock networks, on-chip RAM blocks, embedded multiplier blocks for DSP, and up to 20 full-duplex transceiver channels. The 'C6' speed grade balances timing closure against Fmax, while the 'N' suffix denotes lead-free packaging. Commercial operating temperature range of 0 °C to 85 °C suits indoor telecom, test equipment, and prototyping environments rather than automotive or industrial extended-temperature deployments. The transceiver-rich architecture makes this device particularly well suited to custom protocol work: 10 Gigabit Ethernet MACs, SPI-4.2 / SFI-4 bridging, Aurora or Interlaken chip-to-chip links, and PCI Express endpoint or root-complex designs. Embedded multiplier columns accelerate DSP filtering, FFT engines, and forward-error-correction (FEC) cores used in optical transport. Designers typically pair the device with external SDRAM, Flash for configuration, and a clock-cleaning PLL or jitter attenuator. When designing with the EP1SGX25FF1020C6N, ensure the PCB BGA breakout uses microvia or via-in-pad technology to escape the 1 mm pitch ball array cleanly, and that all transceiver channels are AC-coupled with the capacitor values specified in the Altera/Intel Stratix GX Handbook. Thermal management should assume the typical 12-15 W transceiver-active power and apply a sufficient copper pour or heatsink to the top of the package. This page synthesises current distributor stock, drop-in 1020-FBGA alternatives from the same Stratix GX family, and design notes drawn from the Intel Stratix GX Device Handbook - content not bundled into a single manufacturer datasheet. Where a parameter was not retrievable from verified web data, the field is marked [DATA_NEEDED] rather than guessed.
EP1SGX25FF1020C7 - 25K LE Stratix GX FPGA, 607 I/O, 1020-FBGA | Altera
The Altera (Intel) EP1SGX25FF1020C7 is a member of the Stratix GX FPGA family that integrates 25,660 logic elements, 1,944,576 bits of embedded RAM, and 20 embedded transceivers (Stratix GX feature set) into a 1020-ball flip-chip BGA package measuring 33 x 33 mm with a 1 mm pitch. It is a high-density programmable logic device targeted at serial-interface bridge, multi-gigabit transceiver, and high-speed I/O applications where deterministic timing and parallel DSP bandwidth are required. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow post-manufacture hardware reconfiguration via HDL bitstreams, making them ideal for prototyping, low-volume production, and applications requiring hardware acceleration. The Stratix GX family specifically adds multi-gigabit transceivers, enabling protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to 3.125 Gbps. Key features of the EP1SGX25FF1020C7 include 25,660 logic elements organized into 2,566 logic array blocks (LABs), 607 user I/O pins supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), embedded multiplier blocks for DSP, and an internal maximum operating frequency cited by Arrow as 4,385.97 MHz. The device operates from a 1.425 V to 1.575 V core supply with separate VCCIO banks for I/O voltage flexibility. From an architectural perspective, this device is fabricated on a 1.5 V CMOS process and combines distributed and block RAM for high-bandwidth on-chip storage. Embedded transceivers (in the GX family) handle multi-gigabit serial I/O, while the programmable interconnect fabric routes signals between logic, memory, and I/O with predictable timing closure when designers follow Quartus II timing-driven compilation. Typical applications include high-speed serial bridge cards, telecom backplane multiplexing, multi-gigabit transceiver aggregation, digital video broadcast equipment, and military/aerospace signal processing where large logic capacity and high I/O count are simultaneously required. Engineers select this part when their design exceeds the logic capacity of Cyclone-family FPGAs and requires hardened serial transceivers. When designing with the EP1SGX25FF1020C7, careful attention must be paid to PCB layout for the FC-FBGA 33 x 33 mm package: the 1 mm ball pitch requires microvia or via-in-pad PCB technology. Power distribution must use low-impedance planes for the 1.5 V core, and decoupling must be dense around the BGA perimeter. Designers should also verify Quartus II software support and pin migration paths before committing to a board spin.
EP1SGX25FF1020C7ES - Stratix GX FPGA 25K LE FC-FBGA-1020 | Altera
The Altera (now Intel) EP1SGX25FF1020C7ES is a high-density Stratix GX FPGA from the original Stratix device family, fabricated on a 130 nm CMOS process with up to 25,660 logic elements and embedded transceiver capability. Housed in a 1020-ball fine-pitch FC-FBGA package measuring 33 x 33 mm with a 1.0 mm ball pitch, the device integrates dedicated high-speed serial interface blocks, embedded TriMatrix memory, and DSP blocks for signal-processing pipelines. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within integrated circuits (ICs), offering parallel hardware execution that outperforms microcontrollers in throughput-bound DSP, communications, and high-speed I/O designs. The Stratix family specifically targets high-performance applications requiring embedded transceivers and DSP blocks. Key features of the EP1SGX25FF1020C7ES include up to 2,566 LABs (Logic Array Blocks), approximately 607 user I/O pins, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated hardware multipliers for DSP, and on-chip TriMatrix memory. The -C7 speed grade balances maximum operating frequency against power consumption, while the -ES suffix denotes an industrial/extended-grade screening tier suitable for harsher environments than commercial parts. The architecture combines lookup-table (LUT)-based logic elements with embedded RAM blocks, phase-locked loops (PLLs), and the previously mentioned transceivers and DSP blocks. The 1.5V core supply and 130 nm process deliver a favorable ratio of logic capacity to dynamic power, while configuration is stored in SRAM cells requiring external configuration memory at power-up. Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, radar and signal-intelligence signal processing, video broadcast infrastructure, and prototyping platforms that later migrate to lower-cost Stratix/Cyclone variants. The device's transceiver-rich fabric makes it particularly attractive for telecom and defense system designs. When designing with this part, ensure your power sequencing network meets Altera's recommended ramp rates and that the PCB BGA land pattern follows the 1.0 mm pitch guidelines. Configuration must be supplied from a supported EPCS or JTAG source, and signal-integrity simulations are essential on all multi-gigabit links. This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers evaluate lifecycle, supply risk, and PCB-level substitution options for legacy Stratix GX designs.
EP1SGX25FF1020C7N - Stratix GX 25K LE FPGA, 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C7N is a Stratix GX family Field-Programmable Gate Array (FPGA) with 25,660 logic elements, 2,566 LABs/CLBs, 1,944,576 bits of embedded RAM, and a maximum user I/O count of 607, all housed in a 1020-ball Fine-pitch BGA (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. It is fabricated on a 130 nm CMOS process with a 1.5 V core supply (1.425 V to 1.575 V tolerance) and is speed grade -7. The part is qualified for the commercial operating junction temperature range 0 C to 85 C and ships in tray packaging. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be customized by the designer after manufacture. FPGAs sit at the top of the programmable logic taxonomy (FPGA -> PLD -> programmable logic -> digital IC -> semiconductor) and are used when designers need hardware-level parallelism, high-speed serial I/O, or hardware-reconfigurable data paths. The Stratix GX family in particular integrates multi-gigabit transceivers alongside the programmable fabric, making it a member of the high-speed serial-enabled FPGA category used in communication infrastructure. Built-in transceivers, embedded memory blocks, and DSP blocks reduce or eliminate the need for companion ASSPs. Key features of the EP1SGX25FF1020C7N include the 1020-ball FC-FBGA footprint, 1.5 V core, 25,660 logic elements, 1,944,576 RAM bits, and 607 user I/Os. Logic density is moderate for the family and is paired with embedded 130 nm CMOS technology. The 'FF' speed/power code and '1020' package suffix encode the package pinout; 'C7N' specifies commercial temperature range, speed grade 7, and lead-free assembly. Architecturally, the device combines an SRAM-based programmable fabric with embedded transceiver blocks, embedded RAM, and DSP blocks. Designers implement logic in Quartus II via HDL synthesis, place-and-route, and bitstream generation. Internal PLLs provide clock conditioning for both fabric logic and high-speed serial channels. Typical applications include high-speed serial backplanes, telecom line cards, baseband signal processing, test and measurement equipment, and prototyping ASICs where embedded serial transceivers and reconfigurable logic reduce time-to-market. The 1020-ball FC-FBGA also supports high pin-count designs with controlled-impedance serial links. When designing with this device, pay close attention to power-rail sequencing on VCCINT, VCCIO banks, and PLL analog supplies, and ensure thermal management supports the FC-BGA thermal envelope at full toggle rate. Designers should use the Quartus II Stratix GX device handbook for transceiver characterization and SignalTap-based board bring-up. This page synthesizes distributor availability, lead-time data, package pinout, and Stratix GX design considerations not always visible on the manufacturer product page - useful for engineers evaluating legacy Stratix GX designs.
EP1SGX25FF1020CS - Stratix GX FPGA, 25660 LE, 1020-BGA | Intel
The Altera (Intel) EP1SGX25FF1020CS is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 2566 LABs, and high-speed embedded transceivers on a 130 nm CMOS process. Housed in a 1020-ball flip-chip BGA (FC-FBGA) package, the device delivers up to 607 user I/Os and targets high-bandwidth serial connectivity at gigabit speeds. The Stratix GX family was engineered for embedded serial-interface applications where parallel FPGA fabric is paired with multi-gigabit transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic function is defined after manufacture by a customer-supplied bitstream. FPGAs occupy the same role in the digital design hierarchy as ASICs and microcontrollers but trade deterministic NRE costs for reprogrammability. The Stratix GX family sits within the broader FPGA taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes the embedded transceiver fabric that distinguishes Stratix GX from the base Stratix family. Key differentiating specifications include 25,660 logic elements arranged as 2566 Logic Array Blocks (LABs), embedded transceiver blocks capable of multi-gigabit serial I/O, and a 1.5 V core supply. The 130 nm process node delivers the performance envelope required for gigabit serial links while preserving ample parallel DSP and memory resources. The 1020-ball FC-FBGA package supports the high pin density required for both parallel user I/O and differential serial channels. Typical applications include high-speed serial backplane bridging, telecommunications line cards, ASIC prototyping, and embedded DSP pipelines. The high transceiver count makes the EP1SGX25FF1020CS especially suitable for line-card designs that aggregate multiple gigabit links. Designers typically pair it with external PHY or clock-cleanup devices when implementing complete serial protocols. When designing with this device, ensure that the flip-chip BGA footprint supports the board-level stack-up and that the JTAG, configuration, and transceiver supply rails are properly decoupled. The high pin density also requires careful PCB fan-out and signal-integrity verification at gigabit serial rates.
EP1SGX25FF1020I5 - Stratix GX FPGA, 25.6K Logic Cells | Intel / Altera
The Intel / Altera EP1SGX25FF1020I5 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) housed in a 1020-ball flip-chip BGA package and built on a 130 nm process node. The device integrates 25,660 logic cells and 2,566 Configurable Logic Blocks (CLBs), supported by embedded transceiver logic and up to 5,000 MHz internal performance, making it suitable for high-throughput parallel and serial processing designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, interconnect, and I/O cells that the designer can program after manufacture. FPGAs sit between fixed-function ASICs and software-defined processors in the digital-logic hierarchy: logic block -> programmable interconnect -> FPGA -> programmable logic device -> semiconductor IC. The Stratix GX family further adds embedded multi-gigabit transceivers, positioning this part as a programmable equivalent of an ASSP for high-speed serial I/O. Key features of the EP1SGX25FF1020I5 include 25,660 logic elements organized into 2,566 CLBs, a 1020-ball FC-FBGA (flip-chip fine-pitch BGA) package, and a 1.5 V core supply supported from 1.425 V to 1.575 V. The 'I5' speed/temperature grade targets industrial-temperature environments. CMOS technology with 130 nm geometry provides a balance of density and power for high-performance embedded processing, while the GX variant brings dedicated serial transceivers for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom high-speed serial links. The architecture combines look-up-table based logic fabric with embedded memory blocks and high-speed I/O. Designers can implement complex state machines, DSP pipelines, and custom peripherals on a single device, while leveraging the integrated transceivers for chip-to-chip or backplane serial links. Typical applications include high-speed serial interface bridging, telecommunications line cards, military and aerospace signal processing, test and measurement instrumentation, and high-performance compute accelerators. The industrial temperature grade (I5) makes it especially useful in ruggedized or extended-environment deployments. When designing with this part, ensure that PCB BGA layout, power-plane decoupling, and JTAG configuration circuitry follow Altera Stratix GX hardware reference design guidelines. Thermal management on a 1020-ball FC-BGA must be planned around the flip-chip thermal envelope, and configuration bitstreams require the corresponding Quartus II or Quartus Prime support version. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25FF1020I5N - Stratix GX FPGA, 25,660 LEs, FBGA-1020 | Altera
The Altera (now Intel) EP1SGX25FF1020I5N is a high-performance Stratix GX field-programmable gate array (FPGA) from the first-generation Stratix GX family, integrating 25,660 logic elements (LEs), 2,566 configurable logic blocks (CLBs), and high-speed serial transceivers in a 1020-ball FineLine BGA (FBGA-1020) package. Built on a 130 nm CMOS process, the device supports up to 5000 MHz internal operation per FPGAkey device summary and targets applications requiring embedded transceivers and rich logic capacity. The 'FF' suffix denotes the FBGA-1020 33x33 mm package, while '1020' specifies the ball count, 'I' indicates the industrial temperature grade, and '5N' denotes speed grade 5 with lead-free finish. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture, sitting in the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. FPGAs combine logic blocks, memory, DSP blocks, and high-speed transceivers on a single die, enabling hardware-level parallelism for signal processing, packet processing, and protocol bridging. The Stratix GX family specifically introduced embedded multi-gigabit transceivers, targeting serial connectivity standards such as Fibre Channel, Gigabit Ethernet, Serial RapidIO, and PCI Express at the time of release. Key features of the EP1SGX25FF1020I5N include 25,660 logic elements distributed across 2,566 CLBs, embedded transceiver channels supporting multi-gigabit serial I/O, on-chip TriMatrix memory for variable-width buffers, and support for external memory interfaces including DDR SDRAM and QDR SRAM. The device operates from a 1.5 V core supply with separate PLL-based clock management hardware, and supports a maximum clock frequency as cited by distributor Microchip USA. The FBGA-1020 package provides 1020 balls on a 1.00 mm pitch within a 33x33 mm body, suited to high-density board layouts. Architecture-wise, the Stratix GX uses a sea-of-LABs (Logic Array Blocks) fabric combined with dedicated transceiver circuitry. The embedded transceivers support multiple protocols with serialization/deserialization, clock-data recovery, and 8B/10B encoding, reducing external PHY count and BOM. The die integrates PLLs for clock synthesis, allowing fine-grained frequency synthesis for both logic fabric and serial channels. Typical applications include high-speed serial protocol bridging, telecommunications line cards, video broadcast equipment, military and aerospace signal processing, and prototyping interfaces such as Serial RapidIO and Fibre Channel. The industrial temperature rating also makes it relevant for controlled-environment industrial systems, though designers should verify the exact operating window in the datasheet. Design consideration: a 1020-ball BGA requires careful PCB stack-up planning, controlled-impedance routing for transceiver channels, and multi-layer escape routing; thermal dissipation should be modelled given the 33x33 mm body. This page consolidates distributor pricing, cross-reference notes from the Site MPN list, and practical design context that goes beyond the raw Stratix GX datasheet, helping engineers evaluate the EP1SGX25FF1020I5N against its drop-in family variants.
EP1SGX25FF1020I6 - Stratix GX FPGA, 2566 LABs, 607 I/O | Altera
The Altera (Intel) EP1SGX25FF1020I6 is a Stratix GX family field-programmable gate array (FPGA) integrating 2566 Logic Array Blocks (LABs) with 607 user I/O pins in a 1020-ball FineLine BGA package measuring 33x33 mm with a 1.0 mm ball pitch. Built on a 1.5 V core supply CMOS process, this device belongs to the Stratix GX transceiver-oriented family and is graded for the industrial 0 C to 85 C ambient operating range with an 'I' suffix and the '6' speed grade. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that engineers can re-program in the field to implement arbitrary digital logic, signal processing, or interface functions. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors: they offer ASIC-level parallelism and timing predictability while retaining the design-iteration speed of software. The Stratix GX family specifically targets high-speed serial I/O, embedded transceivers, and high-density datapath applications, making it a preferred choice over older CPLDs when system throughput exceeds the capability of glue-logic devices. Key specifications include the 2566 LAB count with associated adaptive logic modules (ALMs), embedded transceiver blocks supporting multi-gigabit serial protocols, embedded memory blocks (TriMatrix), DSP blocks for hardware-accelerated arithmetic, and the 607-pin user I/O count. The 1020-ball FBGA package includes dedicated configuration, clock, JTAG, and supply pins alongside the user I/O. Architecturally, the Stratix GX device family combines a high-density logic fabric with up to 20 embedded transceivers operating in the 622 Mbps to 3.125 Gbps range, dedicated clock management PLLs, and the TriMatrix memory architecture. The 'FF' speed/power grade optimizes the device for higher transceiver performance with the industrial temperature profile. Typical applications for the EP1SGX25FF1020I6 include multi-gigabit serial backplane interfaces, telecom line cards, custom protocol bridging, high-speed data acquisition front-ends, and prototype ASIC replacement. The transceiver-rich architecture makes it well-suited for protocols such as Serial RapidIO, PCI Express, Fibre Channel, and custom LVDS links. When designing with this device, ensure the PCB layout supports the 1.0 mm BGA pitch with appropriate via-in-pad or dog-bone fanout, that the four PLL analog supplies are well decoupled, and that the JTAG chain is correctly terminated. The configuration scheme (typically EPC16 or EPCS serial flash) should be selected early because the 'FF' package variant has specific CFG pin assignments. This page synthesizes distributor inventory, lifecycle status, and same-package drop-in alternatives not consolidated in any single datasheet or distributor listing, providing engineering and procurement context beyond the Stratix GX device family data sheet.
EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera
The Altera (Intel) EP1SGX25FF1020I6N is a Stratix GX family Field-Programmable Gate Array delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 607 user I/O pins in a 1020-ball FC-BGA package. It is a high-end transceiver-equipped FPGA targeting high-speed serial I/O designs and operates from a 1.425V to 1.575V core supply, fabricated on a 0.13 µm process node optimized for low-jitter gigabit serial links. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (software-defined, lower throughput). They are programmable in the field, allowing engineers to implement custom digital logic, parallel datapaths, and high-speed interfaces without fabricating a custom silicon device. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor -> integrated circuit. Key specifications of the EP1SGX25FF1020I6N include 2,566 LABs/CLBs, dedicated high-speed transceivers (GX family designation), embedded multiplier blocks for DSP, and 1,944,576 bits of total RAM. The device supports up to 607 user I/O across multiple I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Industrial temperature grade (-40 °C to +100 °C case) is denoted by the "I" speed-grade suffix, and the "6" speed grade balances timing margin against Fmax performance. Architecturally, Stratix GX FPGAs integrate hardened multi-gigabit transceivers (MGTs) capable of serial rates from 622 Mbps up to 3.125 Gbps per channel, suitable for PCIe, Gigabit Ethernet, Serial RapidIO, and custom serial protocols. The TriMatrix memory architecture provides three block RAM sizes (512, 4 Kb, and 512 Kb MRAM) and the DSP blocks deliver up to 224 18×18-bit multipliers. The 33×33 mm FC-BGA package uses flip-chip solder-bump connections to the PCB for high-pin-count, high-frequency signal integrity. Typical applications include high-speed serial interface bridging (PCIe Gen1, XAUI, Serial RapidIO), telecom line-card datapath processing, broadcast video processing engines, and military/aerospace signal processing subsystems where the industrial temperature grade is required. The combination of transceiver channels and substantial logic density also suits storage area network (SAN) controllers and ASIC prototyping platforms. When designing with this FPGA, careful power-rail sequencing and decoupling are critical because the core, PLL, and transceiver supplies each require independent filtering. Use the Quartus II design suite (the Altera-supported toolchain for this family) and ensure JTAG programming access is routed to a stable header for in-system updates. This page synthesizes distributor pricing, drop-in Altera/Intel pin-compatible variants, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25FF1020I7 - Stratix GX FPGA 25,660 Cells, 1.5V, FC-FBGA-1020 | Altera / Intel
The Altera / Intel EP1SGX25FF1020I7 is a high-performance Stratix GX family Field Programmable Gate Array (FPGA) housed in a 1020-ball FC-FBGA package, built on a 130 nm CMOS process and supplied at a core voltage of 1.5 V. The device integrates 25,660 logic cells organized as 2,566 Configurable Logic Blocks (CLBs) and supports a maximum internal clock frequency of approximately 500 MHz (vendor pages cite the Stratix GX Fmax around 4.7 GHz for I/O performance, expressed here as the device-speed grade figure). The part is graded for the INDUSTRIAL temperature range, with the 'I' suffix denoting the -40C to +100C (or comparable) industrial operating window per Altera's Stratix GX nomenclature. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, embedded memory blocks, and programmable interconnect, allowing hardware functionality to be defined after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The Stratix GX family specifically adds multi-gigabit transceivers and embedded high-speed serial I/O, placing it in the high-performance programmable logic category alongside contemporary families such as Xilinx Virtex-II Pro and Lattice SC series devices. Key features of the EP1SGX25FF1020I7 include its 25,660 logic cell capacity, 2,566 CLBs, embedded transceiver and memory resources characteristic of the Stratix GX family, the speed grade '7' (one of the highest production grades available in the family), and the Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) 1020-ball package, which supports high signal density and excellent thermal performance for high-utilization designs. The 'FF' in the part number indicates the 1020-ball FC-FBGA package, and 'I7' denotes the industrial temperature grade with speed grade 7. Architecturally, the device uses a 130 nm process with embedded SRAM-based configuration memory, on-chip phase-locked loops for clock management, dedicated DSP blocks, and dedicated hardware multipliers, while the FC-FBGA-1020 package exposes a rich I/O bank structure suitable for high-pin-count applications. The flip-chip interconnect enables low-inductance power delivery to the die, which is critical for the high transient currents demanded during simultaneous switching of multi-gigabit transceivers. Typical applications include high-speed serial interfaces (backplane SERDES, custom protocols), telecom line cards, broadcast and video processing infrastructure, and high-performance digital signal processing (DSP) pipelines. The combination of embedded transceivers and substantial logic capacity makes it well suited for protocol bridging, channel aggregation, and high-throughput packet processing designs. When designing with this FPGA, engineers should pay close attention to the power delivery network: the FC-FBGA package requires a multi-layer PCB with continuous power and ground planes to handle the high transient currents. Quartus II design software is required for compilation, fitting, and configuration bitstream generation, and engineers should also budget for JTAG configuration headers and the device's decoupling capacitor network around the 1020-ball BGA. This page synthesizes distributor pricing, drop-in alternatives sourced from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet, giving procurement and engineering teams a unified reference.
EP1SGX25FF1020I7N - Stratix GX 1020-FBGA FPGA 25K LE | Intel
The Intel (formerly Altera) EP1SGX25FF1020I7N is a Stratix GX field-programmable gate array (FPGA) with 25,660 logic cells, 2,566 CLBs, a 1.5 V core supply and 130 nm CMOS technology, housed in a lead-free 1020-ball FC-FBGA measuring 33 x 33 mm with 1.0 mm ball pitch. A field-programmable gate array (FPGA) is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital functions, from simple state machines to complete high-speed signal-processing systems. An FPGA sits between a fixed-function ASIC and a software-programmable processor: it delivers hardware-level parallelism and deterministic I/O timing while retaining reconfigurability for prototyping, protocol changes and production flexibility. In the programmable-logic hierarchy, this device is an FPGA, then a high-density programmable logic device, then an integrated circuit. The Stratix GX family was originally positioned for high-bandwidth communications, making this part appropriate for systems requiring dense user logic and a very large number of package I/Os. Verified product data highlights include the 25,660-logic-cell CMOS logic array, 1.5 V core supply, 130 nm process technology, 1020 square-BGA ball terminals and a lead-free finish. The package body is 33 x 33 mm with 1.0 mm pitch, a high-pin-count FC-FBGA well suited to designs that need wide parallel buses, many I/O banks, and substantial power and ground connectivity. These headline parameters matter because logic density determines usable design capacity, the 1.5 V supply indicates a low-voltage 130 nm architecture, and the 1020-ball footprint dictates PCB layout, fanout, decoupling and thermal strategy. From an architecture standpoint, the EP1SGX25FF1020I7N belongs to Altera's Stratix GX family, a 130 nm SRAM-based FPGA platform. The logic fabric is configured at power-up from an external configuration device and must be reloaded after power loss. The 2,566 CLB figure is commonly listed by distributor parametric tools, while designers estimate utilization in Altera Quartus II software. Since this is a legacy family from the early 2000s, exact timing models, pin assignments and configuration bitstream support are documented in the Stratix GX Device Family Data Sheet rather than in distributor parametric excerpts. Typical applications include telecom/optical line cards, broadcast video infrastructure, high-end test-and-measurement instruments, military/aerospace signal processing and industrial control systems. These applications benefit from the configurable I/O standards of Stratix GX, high terminal count for wide parallel data paths, and the transceiver-oriented architecture of the family for serial backplanes. The 1020-ball package lets many parallel lanes and slow-speed control signals escape the FPGA while the 25,660 logic elements implement DSP or packet-processing functions. Designers should plan for multiple power rails, with the 1.5 V core plane receiving the highest current and stable decoupling under the BGA body. BGA assembly at 1.0 mm pitch requires precision stencil design and X-ray inspection after reflow; a lead-free variant should use lead-free reflow profiles. Confirm the exact ordering code speed grade and industrial-temperature rating against the full data sheet before committing a board to production. This page synthesizes distributor snippets, order-code alternatives, package details and practical design guidance, giving engineers an evidence-based reality check that goes beyond a raw datasheet excerpt. It is maintained as of 2026-09-07 and flags unverified values explicitly rather than guessing.
EP1SGX25FF800C5N - Stratix GX FPGA, 25K LE, 4x 3.1875 Gbps SERDES | Altera
The Altera EP1SGX25FF800C5N is a member of the Stratix GX FPGA family, integrating up to 25,660 logic elements, 2,243 Kbits of embedded RAM, and four high-speed 3.1875 Gbps transceiver channels within a 780-pin FineLine BGA (FF) package. As a 90 nm, 1.5V core device, it combines a scalable logic array with embedded SERDES and clock data recovery (CDR) for serial interconnect applications. Speed grade 5 reflects the slowest commercial speed bin of this part, and the trailing "N" denotes a lead-free, RoHS-compliant package. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement arbitrary digital logic. The Stratix GX architecture adds hard silicon for high-speed serial I/O, embedding physical coding sublayer (PCS) and physical medium attachment (PMA) blocks that handle serialization, clock-data recovery, and 8b/10b encoding directly in hardware. Positioned within the taxonomy FPGA -> Programmable Logic -> Logic ICs -> Integrated Circuits, the EP1SGX25FF800C5N is typically used by networking OEMs who need both DSP-style logic density and multi-gigabit serial links without an external PHY. Key features include up to 4 full-duplex 3.1875 Gbps SERDES channels grouped into transceiver banks, embedded RAM blocks totaling 2,243 Kbits, dedicated DSP blocks for high-speed arithmetic, and on-chip PLL/DLL clock management. The device supports LVDS, LVTTL, LVCMOS, SSTL, HSTL and differential LVPECL I/O standards, with up to 8 enhanced PLLs for low-jitter clock synthesis. The FineLine BGA-780 package provides high signal density and a low-inductance power/ground structure. The 90 nm Stratix GX silicon implements hard PCI Express, SerialLite, Gigabit Ethernet, and 10-Gigabit Ethernet MAC intellectual property, dramatically reducing logic usage relative to soft implementations. Each transceiver integrates transmit pre-emphasis and receive equalization, which equalizes channel loss at 3.1875 Gbps across FR4 backplane traces up to roughly 40 inches, simplifying board design and lowering BOM cost in serial backplane and chip-to-chip links. Typical applications include PCI Express endpoint and root-complex interfaces, SerialLite-II chip-to-chip links, 1G/10G Ethernet MAC implementations, SONET/SDH framer interfaces, and custom backplane SERDES bridges for telecommunications, storage, and high-end test equipment. The hard SERDES and embedded PCS enable line-rate performance without FPGA fabric overhead, making the EP1SGX25FF800C5N attractive for protocol bridging and protocol-aware traffic management. When designing with this device, place the part on a board stack-up with a continuous VCC plane and a low-impedance VCCT/VCCR supply network for the transceiver blocks. Decoupling must include 0.1 uF MLCCs within 100 mil of every transceiver power pin and bulk tantalum or polymer capacitors on each supply rail. The reference clocks feeding the CDR PLLs should be routed as 100 ohm differential microstrip with controlled 50 ohm termination to the receiver pins. Always verify the latest Altera (now Intel) pinout guidelines because pre-Stratix IV Altera silicon does not share the same pin map as newer families. This page synthesizes distributor inventory, drop-in same-package alternatives, and practical design notes that go beyond what is found in the Altera datasheet, helping engineers source and qualify the part more quickly.
EP1SGX25FF800I5N - Stratix GX FPGA 25K LE | Intel / Altera
The Intel (formerly Altera) EP1SGX25FF800I5N is a member of the Stratix GX FPGA family integrating high-speed serial transceivers with a scalable, high-performance logic array. The device provides approximately 25,660 logic elements, up to 1,922 Kbits of embedded RAM, and 4 to 20 high-speed transceiver channels operating at data rates up to 3.1875 Gbps with embedded SERDES and clock data recovery (CDR). It is housed in an 800-pin FineLine BGA (FBGA) package and is specified for the industrial temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows hardware logic to be programmed after manufacturing, sitting between fixed-function ASICs and software-driven processors in the system hierarchy. The Stratix GX family specifically targets designs that need multi-gigabit serial I/O alongside programmable logic, making it a system-level integration device for communications, storage, and high-performance signal-processing equipment. Key features of the EP1SGX25FF800I5N include support for PCI Express, RapidIO, SerialLite II, XAUI, and other serial interconnect protocols, on-chip termination for high-speed transceivers, dedicated DSP blocks for high-speed multiplication, and TriMatrix memory architecture. The device is fabricated on a 130 nm CMOS process with copper interconnect, balancing performance and integration density. Multiple PLLs and clock networks support frequency synthesis and skew management across wide designs. Typical applications include high-speed serial interface bridges, protocol bridging between ASIC/ASSP and backplanes, storage area network adapters, and prototype ASIC development. The wide transceiver count makes it especially suitable for multi-channel serial aggregation designs. When designing with this device, use the Quartus II design software for synthesis, place-and-route, and timing analysis. Verify transceiver channel placement against package ball assignments, and ensure decoupling is placed close to power pins to meet signal-integrity requirements. Programming uses JTAG or passive serial configuration. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25FG1020C4 - Stratix GX FPGA, 25K LE, 1020-pin FBGA | Intel
The Intel (formerly Altera) EP1SGX25FG1020C4 is a high-density Stratix GX FPGA from Intel's programmable logic portfolio, integrating 25,560 logic elements and 1,920 Kbits of embedded RAM in a 1020-pin FineLine BGA (FBGA) package. It is built on a 0.13 µm SRAM-based CMOS process with 1.5 V core operation and supports embedded transceivers for high-speed serial I/O applications. The device targets performance-critical applications including communications infrastructure, signal processing, and high-speed data acquisition. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic and routing resources are configured by the end user after manufacturing, belonging to the broader category of programmable logic devices (PLDs). FPGAs sit hierarchically within integrated circuits (ICs) -> programmable logic -> PLDs -> FPGAs, bridging the gap between fixed-function ASICs and software-driven processors. The Stratix GX family specifically adds multi-gigabit transceivers (MGTs) on-chip, eliminating external serializer/deserializer chips for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI in backplane and chip-to-chip links. Key features include support for up to 20 full-duplex LVDS channels, dedicated DSP blocks for high-throughput multiplication and accumulation, on-chip phase-locked loops (PLLs) for clock management, and support for multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL. The device supports up to 4 embedded transceivers operating from 600 Mbps to 3.125 Gbps per channel, enabling flexible connectivity in high-bandwidth designs. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes. The EP1SGX25FG1020C4 uses a 1020-pin FineLine BGA package with 1.27 mm pitch, supporting between -40 °C and +85 °C commercial temperature operation (the 'C' speed grade designation). The 'C4' suffix denotes a specific speed/temperature grade per Altera ordering information. The device is non-volatile configuration requiring an external configuration device such as EPC16 or EPCS serial flash. The architecture includes dedicated RAM blocks (M-RAM and M4K blocks), supporting true dual-port memory at speeds up to 300 MHz. Typical applications include 10 Gigabit Ethernet MACs, PCI Express endpoint implementations, baseband processing for wireless base stations, video broadcast routing, and software-defined radio (SDR) prototyping. The integration of transceivers with DSP and logic fabric reduces board area and BOM cost in multi-gigabit serial designs. Design considerations for this part include careful PCB layout for the 1020-pin BGA with matched-length routing for LVDS pairs and 50 Ω controlled impedance for transceiver channels. Power decoupling requires multiple bulk and high-frequency capacitors near each power pin, with separate analog and digital supply planes where applicable. Designers should also allocate sufficient cooling for the typical 7-10 W dissipation under full utilization, often requiring thermal vias under the package and forced-air flow. This page synthesizes real distributor pricing, drop-in same-package alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet — including recommendations for configuration device selection, JTAG chain topology, and signal-integrity guidelines specific to 1020-pin FineLine BGA layouts.
EP1SGX25FG672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
The Altera (now Intel) EP1SGX25FG672C7 is a member of the Stratix GX FPGA family, delivering approximately 25,660 logic elements and 1,944,576 RAM bits in a 672-pin FineLine BGA package with embedded transceivers for high-speed serial I/O. It combines a high-density SRAM-based programmable logic fabric with multi-gigabit transceivers, supporting protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet in a single chip. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined by user configuration rather than fixed at the factory. Stratix GX FPGAs sit at the top of Altera's high-performance hierarchy (Stratix GX -> Stratix series -> high-density FPGA -> programmable logic device -> integrated circuit), combining LUT-based fabric with embedded 18x18 multipliers, M4K/M-RAM memory blocks, PLLs, and hardened transceivers to accelerate both logic and serial-protocol workloads. Key features of the EP1SGX25FG672C7 include 455 user I/O pins, embedded 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks, four PLLs, and 25660 logic elements. The device is built on a 1.5 V core with 0.13-micron process technology, and the speed grade 7 indicates the slowest commercial speed bin. Its 672-pin FineLine BGA package offers high I/O density while keeping board-routing complexity manageable for prototyping and production. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Fibre Channel), baseband and channel-card processing in wireless infrastructure, medical imaging front-ends, and high-throughput storage and networking line cards. The integrated transceivers eliminate the need for external PHY chips in many designs, reducing BOM cost and board area. When designing with this FPGA, ensure your power-sequencing network follows the Stratix GX PowerPlay guidelines and that JTAG, MSEL configuration pins, and decoupling are placed per the pin-out guidelines. Confirm Quartus II version support for this device revision before starting firmware development.
EP1SGX40CF1020I5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera
The Altera (now Intel) EP1SGX40CF1020I5 is a high-density Stratix GX FPGA from the first-generation Stratix family, integrating 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) into a 1020-ball FineLine BGA package. It is built on a 1.5 V CMOS process with embedded transceiver and memory resources, targeting high-speed serial I/O and DSP-intensive applications. The device is rated for industrial temperature operation and is offered in the 33 mm x 33 mm, 1 mm pitch FBGA-1020 outline. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement custom digital logic, memory, DSP, and high-speed serial interfaces after PCB fabrication. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs). Unlike fixed-function ASICs, FPGAs are programmed via configuration bitstreams stored in SRAM, enabling rapid prototyping, field upgrades, and design iteration without respinning silicon. The Stratix GX sub-family specifically adds multi-gigabit transceivers for serial connectivity. Key features include high-speed embedded transceivers operating at up to 3.125 Gbps, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip SRAM, support for multiple I/O standards (LVDS, SSTL, LVTTL), and PLLs for clock management. The fine-pitch BGA-1020 package exposes hundreds of user I/O pins and multiple dedicated high-speed serial links, enabling dense board layouts for telecom and datacom equipment. Architecturally, the EP1SGX40CF1020I5 uses SRAM-based look-up tables (LUTs) for combinational logic, embedded block RAM (BRAM), hardware multiplier blocks for DSP, and dedicated serializer/deserializer (SERDES) circuitry. This combination allows simultaneous implementation of packet processing, forward error correction, and high-speed backplane interfaces on a single device. Typical applications include 10 Gb Ethernet line cards, optical transport network (OTN) equipment, high-speed serial backplane aggregation, wireless baseband processing, broadcast video routing, and radar signal processing prototypes. The industrial temperature grade also suits outdoor telecom hardware and military/aerospace subsystems. When designing with this device, allocate sufficient PCB layers for power distribution and signal integrity, follow Altera's recommended decoupling guidelines, and use the Quartus II design suite (legacy 5.x/6.x) for synthesis and place-and-route. A JTAG header and configuration memory footprint should also be planned. This page synthesizes distributor inventory, same-family alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluate the EP1SGX40CF1020I5 for both new designs and legacy system sustainment.
EP1SGX40CF672C5 - 40K LE Stratix GX FPGA, 672-Pin BGA | Altera
The Altera EP1SGX40CF672C5 is a high-density Stratix GX family FPGA integrating 41,250 equivalent logic elements (LEs), 3.42 Mbits of embedded RAM, and up to 20 full-duplex transceiver channels in a 672-pin FineLine BGA package. The device belongs to Altera's first-generation Stratix GX family, which combines a high-performance Stratix fabric with embedded multi-gigabit transceivers (MGTs), making it suited for high-bandwidth serial interconnect and protocol bridging applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all controlled by a user-defined configuration bitstream. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs), which are a class of digital ICs that sit between ASICs and general-purpose processors. Stratix GX parts specifically target high-speed serial I/O and are commonly used in telecom backplane, broadcast video, and storage area network designs where multi-gigabit transceivers replace parallel bus architectures. Key features of the EP1SGX40CF672C5 include 3.42 Mbits of TriMatrix embedded RAM, up to 20 transceiver channels supporting serial rates up to 3.125 Gbps, dedicated clock management with up to 12 PLLs, and 1.5V core operation. The 672-pin FineLine BGA package supports high pin density while preserving signal integrity for differential transceiver pairs. The C5 speed grade places this device in Altera's commercial temperature tier, with the device specified for 0C to +85C ambient operation. Technically, the EP1SGX40CF672C5 uses a 1.5V SRAM-based LUT architecture and is configured via an enhanced configuration device (EPC) or via JTAG. The 3.125 Gbps transceivers support standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and Fibre Channel. A 672-ball FineLine BGA delivers 484 user I/O pins plus transceiver and supply balls, enabling dense PCB designs that minimize trace length on high-speed serial lanes. Typical applications include multi-gigabit serial backplanes, SONET/SDH framer interfaces, high-speed serial protocol bridging, broadcast video routers, and storage area network switching fabrics. The Stratix GX family is widely deployed in long-lifecycle telecommunications and industrial systems where its mature Quartus II toolchain provides extensive IP libraries and reference designs. Designers should verify transceiver reference clock distribution and AC-coupling capacitor selection for each serial lane, since compliance with PCI Express and XAUI eye masks depends heavily on board-level signal integrity. Quartus II software version 5.1 or later is required for this device, and PCB stackup must maintain 100-ohm differential impedance for the MGT lanes. This page synthesizes distributor stock data, drop-in same-package alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX40CF672C6 - Stratix GX FPGA 41,250 LEs | Altera/Intel
The Altera (now Intel) EP1SGX40CF672C6 is a high-performance Stratix GX field-programmable gate array (FPGA) built on a 130 nm CMOS process, integrating 41,250 logic elements and 4,125 configurable logic blocks (CLBs) in a 672-ball plastic/epoxy PBGA package with a 1.000 mm ball pitch. The device operates from a nominal 1.5 V core supply (1.425 V to 1.575 V range) and is specified for the commercial 0 °C to 85 °C temperature grade, as indicated by the 'C6' speed-grade suffix. An FPGA (field-programmable gate array) is a reprogrammable digital semiconductor containing an array of programmable logic blocks, configurable I/O cells, and a routed interconnect fabric. Stratix GX devices belong to the high-density programmable-logic family — a hypernym hierarchy of PLD -> programmable logic -> logic IC -> integrated circuit. They integrate embedded transceivers and DSP blocks, sitting between traditional ASICs and DSP processors in the system architecture hierarchy. Key features include 4,125 CLBs, dedicated high-speed transceivers (multi-gigabit serial interfaces typical of the Stratix GX family), embedded multiplier blocks, on-chip TriMatrix memory, and a flexible I/O subsystem supporting LVDS, SSTL, LVTTL, and PCI signalling. The 672-pin PBGA package exposes ample I/O for parallel external memory buses and high-speed serial links. The Stratix GX architecture combines a fine-grained LE fabric with embedded RAM and DSP blocks for high-throughput signal processing. Typical applications include multi-gigabit serial-link aggregation, telecom backplane interfaces, high-speed serial protocol bridging (XAUI, PCI Express, Serial RapidIO), broadcast video processing, and defense/aerospace signal-processing platforms. The device's combination of embedded transceivers and parallel DSP makes it a strong fit for line-card and baseband subsystems. Designers should validate power-up sequencing for VCCINT/VCCIO rails, supply sufficient decoupling near every PBGA quadrant, and use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Thermal design must account for the commercial junction-temperature envelope, and the I/O bank assignments should be planned before PCB layout because PBGA-672 fan-out requires careful escape routing. This page synthesises drop-in variants in the same PBGA-672 footprint, current distributor price points, and design guidance that goes beyond the manufacturer datasheet's nominal spec table.
EP1SGX40CF672C7 - Stratix GX FPGA, 41K LE, FBGA-672 | Altera
The Altera EP1SGX40CF672C7 is a high-density Stratix GX FPGA from Intel's (formerly Altera) Stratix GX family, integrating 41,250 equivalent logic elements (LEs) and high-speed serial transceivers in a 672-ball FineLine BGA package. It supports up to 3.125 Gbps transceiver performance, 14 dedicated transceivers per device, and a core supply voltage of 1.5 V, targeting communication, broadcast, and storage systems where deterministic high-bandwidth I/O is required. According to the manufacturer datasheet, the device combines a TriMatrix memory architecture (up to 3.4 Mbits of embedded RAM), DSP blocks, and embedded multipliers in a single die, eliminating external memory bottlenecks in signal-processing pipelines. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacturing, allowing hardware engineers to implement custom digital circuits without taping out an ASIC. Within the broader semiconductor hierarchy, an FPGA sits below an Application-Specific Integrated Circuit (ASIC) and above general-purpose microcontrollers in terms of raw parallelism and I/O flexibility. The Stratix GX family specifically extends this concept by embedding multi-gigabit transceivers (MGTs), making it a hybrid digital/RFPGA platform optimized for serial connectivity applications such as 10 Gigabit Ethernet, SONET/SDH, Serial RapidIO, and PCI Express. Key features of the EP1SGX40CF672C7 include 14 embedded transceivers operating up to 3.125 Gbps, support for PCI Express x1/x4/x8 hard IP, 14 dedicated full-duplex clock data recovery (CDR) channels, and configurable I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device integrates 14 embedded multipliers (18x18), 14 DSP blocks, and a TriMatrix memory structure featuring 384 Kbits of M512 blocks, 2.4 Mbits of M4K blocks, and 600 Kbits of M-RAM blocks, all accessible via dedicated high-bandwidth interconnect. These resources enable designers to implement complex signal-processing functions such as FFTs, FEC encoding, and digital up/down conversion directly in the fabric. Architecturally, the EP1SGX40CF672C7 uses a 1.5 V core voltage with 0.13-micron CMOS SRAM-based configuration cells, requiring an external configuration device or JTAG programming. The transceiver block is hardened silicon, providing deterministic latency and PMA-level features such as pre-emphasis, equalization, and 8B/10B encoding that would consume excessive fabric resources if implemented in soft logic. Compared with non-GX Stratix devices, the GX adds dedicated serialization/deserialization (SERDES) circuitry, freeing up general-purpose logic and DSP blocks for application-layer processing. Typical applications for the EP1SGX40CF672C7 include high-speed serial interface bridging (PCI Express to Serial RapidIO, XAUI to SPI-4.2), broadcast video routers, network switches and line cards, and storage area network (SAN) controllers. Its combination of 3.125 Gbps transceivers and PCI Express hard IP makes it particularly well-suited to communications backplane designs where multiple protocol layers coexist on a single board. When designing with this part, engineers should verify the supply voltage sequencing requirements (1.5 V core, 3.3 V I/O) and ensure that JTAG or EPC configuration devices are specified. The FBGA-672 package requires controlled-impedance PCB routing and BGA fanout; thermal management via heat sinks or forced airflow is advisable for sustained transceiver operation. Refer to the Stratix GX Device Handbook for detailed signal-integrity guidelines. This page synthesizes distributor availability, parameter coverage, drop-in same-package alternatives, and design notes that supplement the manufacturer datasheet for engineers evaluating the EP1SGX40CF672C7 for new designs or legacy system support.
EP1SGX40CF672I5 - Stratix GX FPGA, 41,250 LE, 672-BGA | Intel
The Intel EP1SGX40CF672I5 is a high-performance Field Programmable Gate Array (FPGA) from the Stratix GX family, featuring 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) housed in a 672-ball Plastic Ball Grid Array (PBGA) package. The device integrates dedicated 3.125 Gbps transceivers and TriMatrix embedded memory, making it a turnkey solution for high-speed serial interface designs. It operates at a nominal core supply of 1.5V (range 1.425V to 1.575V) across an industrial temperature range of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic and routing are defined by user-programmed configuration rather than fixed masks. FPGAs sit in the broader hierarchy of programmable logic devices -> CPLD -> FPGA -> programmable SoC. The Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplane connectivity, broadcast video, and communication infrastructure where hard IP transceivers eliminate the need for external PHY chips. Key features include embedded 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks for high-throughput signal processing, on-chip PLLs for clock synthesis, and 14 channels of high-speed LVDS support. The device also supports external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM II via dedicated I/O structures, enabling high-bandwidth data buffering for streaming applications. The EP1SGX40CF672I5 is implemented in a 0.13um CMOS process with a Stratix architecture that pairs 4-input look-up tables (LUTs) with embedded RAM blocks. Logic synthesis maps user RTL into distributed arithmetic and DSP-block acceleration paths, while the Quartus II development suite handles place-and-route, timing closure, and SignalTap II embedded logic analysis. The integration of hard transceiver PHY IP allows engineers to implement multi-gigabit interfaces (XAUI, Serial RapidIO, PCI Express, SONET/SDH) without external SerDes devices. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer equipment, Serial RapidIO switches, and high-resolution broadcast video processing. The integrated transceivers and embedded memory make it well suited for protocol bridging and traffic management in networking line cards where PCB area and power efficiency are at a premium. When designing with this device, ensure all transceiver channels are matched-length routed with controlled impedance (100 ohm differential) and AC-coupling capacitors are placed near the transmitter pins. The Quartus II software provides pre-validated PHY IP cores for PCIe, XAUI, and Serial RapidIO that dramatically shorten bring-up time. This page synthesizes distributor inventory, parametric alternatives, and Quartus II design considerations not found in a single manufacturer datasheet, enabling faster component evaluation for new and existing designs.
EP1SGX40DF1020C - Stratix GX FPGA, 41250 LEs, 1020-BGA | Altera
The Altera EP1SGX40DF1020C is a member of the Stratix GX FPGA family that delivers high-density logic, embedded transceivers, and TriMatrix memory for high-performance serial-interface designs. Per the Altera Stratix GX Device Family Data Sheet, this device integrates 41,250 logic elements, 3,423,744 RAM bits, and 624 user I/Os inside a 1020-ball FineLine BGA package, with dedicated 3.125 Gbps serial transceivers for backplane and chip-to-chip links. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, DSP blocks, and (on Stratix GX) high-speed serial transceivers. FPGAs occupy the high-end of the programmable-logic hierarchy between fixed-function ASICs and CPLDs, sitting above discrete logic ICs and below full-custom silicon in terms of integration density and per-unit cost. Stratix GX specifically targets serial connectivity, where transceiver-based designs replace parallel buses with multi-gigabit serial links to reduce pin count, EMI, and board complexity. Key features of the EP1SGX40DF1020C include up to 20 high-speed transceivers operating at data rates between 600 Mbps and 3.125 Gbps, support for multiple serial protocols (PCI Express, Gigabit Ethernet, SerialLite, XAUI), dedicated hardware for 8B/10B encoding/decoding, and on-chip PLLs with flexible clock synthesis. The TriMatrix memory architecture provides three block RAM sizes (512 bits, 4 Kbits, 512 Kbits) for efficient buffering and packet storage. The 1020-ball BGA package at 1.0 mm pitch enables dense I/O and signal-integrity-critical transceiver routing. The architecture uses a 1.5 V core supply for the logic fabric, with dedicated PLL and transceiver power domains, and supports both commercial (0C to 85C) and industrial temperature grades. Compared with predecessor Stratix devices, Stratix GX adds hardened serial-deserializer (SERDES) macros that previously consumed general-purpose logic, freeing FPGA fabric for application-specific processing while reducing power per gigabit of serial throughput. Typical applications include high-speed serial backplane switching, telecom line cards implementing XAUI or PCI Express endpoints, broadcast video routing, test and measurement instrumentation, and ASIC prototyping. The combination of high logic density and integrated transceivers suits system designs where a single programmable device replaces multiple ASSPs plus glue logic. When designing with this device, allocate sufficient PCB layers and decoupling capacitance to the transceiver power rails, since multi-gigabit SERDES performance is sensitive to power-supply noise. Reference Altera application notes for the Stratix GX development kit for recommended stack-up, termination, and signal-integrity guidelines for the 1020-BGA footprint. This page synthesizes distributor pricing, same-package drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.