ATSAMD21J17A-MUT - 48MHz Cortex-M0+ MCU, 128KB Flash | Microchip
Référence : ATSAMD21J17A-MUT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.89 | $38,90 |
| 100 | $3.1 | $310,00 |
| 500 | $2.65 | $1 325,00 |
| 1 000 | $2.3 | $2 300,00 |
| 3 000 | $1.95 | $5 850,00 |
ATSAMD21J17A-MUT Présentation
What is a Cortex-M0+ microcontroller? An ARM Cortex-M0+ MCU is an ultra-low-power 32-bit processor core designed by ARM Holdings for embedded systems, featuring the Thumb-2 instruction set, a single-cycle I/O port, and a Micro Trace Buffer. It sits within the broader taxonomy of MCU -> embedded microcontroller -> semiconductor device, and is typically deployed where deterministic real-time response, low active/standby power, and rich connectivity peripherals are required.
Key differentiating features of the ATSAMD21J17A-MUT include 6 SERCOM modules (each configurable as UART/SPI/I2C), a 12-bit 350 ksps ADC with up to 14 analog channels, 2 analog comparators, a real-time clock with calendar mode, and a built-in Full-Speed USB 2.0 Device/Host controller with internal pull-up. The SAM D21J also carries Microchip Functional Safety (FuSa) documentation, simplifying IEC 60730 class B compliance for home appliances. The integrated Cortex-M0+ core reaches 2.46 CoreMark/MHz, giving roughly 118 CoreMark total throughput at maximum clock.
Architecturally, the device uses a single-cycle hardware multiplier, single-cycle I/O port, and a tightly-coupled peripheral bridge that links SERCOM, ADC, DAC, timers, and USB to the AHB/APB bus matrix. The 128 KB dual-bank Flash supports read-while-write (RWW) operation against 4 KB RWW section, allowing live firmware updates without halting the application. The Event System interconnects peripherals without CPU intervention, reducing wake events and saving power.
Typical applications include home automation controllers (thermostats, smart plugs, sensor hubs), consumer electronics (wearables, fitness bands, BLE bridges), metering (utility meters, energy monitors), industrial sensor nodes, USB HID peripherals (keyboards, mice, custom HID), and low-power IoT end-node devices. The wide operating voltage and rich SERCOM count make it well-suited for battery-powered designs with multiple radio or sensor interfaces.
Design consideration: route the USB DP/DM traces as a 90-ohm differential pair and place the decoupling capacitor network (1 uF + 100 nF) within 2 mm of the VDDCORE pin to maintain signal integrity and core stability. For battery applications, leverage the integrated buck-boost converter with a 1 uH inductor to maximise efficiency at light loads.
This page synthesises distributor pricing from DigiKey/Mouser/LCSC, drop-in alternatives within the SAM D21J family, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAMD21J17A-MUT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD21J17A-MUT (même facteur de forme et même empreinte) — différant par USB, ADC, Package, SRAM, RTC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD21J18A-MUT
✅ Remplacement direct✓ En stock
$3.27 / unité
Voir la fiche technique →ATSAMD21J17A-AUT
✅ Remplacement direct✓ En stock
$3.3 / unité
Voir la fiche technique →ATSAMD21J17A-MU
✅ Remplacement direct✓ En stock
$2.68 / unité
Voir la fiche technique →ATSAMD21J16B-MUT
✅ Remplacement direct✓ En stock
$2.3 / unité
Voir la fiche technique →ATSAMD21J16B-AU
✅ Remplacement direct✓ En stock
$2.75 / unité
Voir la fiche technique →ATSAMD21J15B-MUT
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →ATSAMD21J17A-MUT Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M0+ (32-bit) |
| Series | SAM D21J (Functional Safety / FuSa) |
| Maximum CPU Frequency | 48 MHz |
| CoreMark/MHz | 2.46 |
| Program Flash | 128 KB (128K x 8) |
| SRAM | 16 KB |
| RWW Flash Section | 4 KB |
| Supply Voltage (VDDIN) | 1.62 V to 3.63 V |
| Boîtier | 64-QFN (9x9 mm) |
| I/O Pins | 52 (typical for SAM D21J QFN64) |
| SERCOM Modules | 6 (each configurable UART/SPI/I2C) |
| USB | Full-Speed USB 2.0 Device/Host with on-chip transceiver |
| ADC | 12-bit, up to 350 ksps |
| DAC | 12-bit, 1 MSPS |
| Analog Comparators | 2 |
| Timers (TC/TCC) | 8 (3 x TCC, 5 x TC) |
| RTC | Yes, with calendar mode |
| Température de fonctionnement | -40C to +85C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Functional Safety | FuSa documentation (IEC 60730 class B ready) |
Configuration des broches de ATSAMD21J17A-MUT
| Broche 1 | PA00 — General-purpose I/O / XIN32 |
| Broche 2 | PA01 — General-purpose I/O / XOUT32 |
| Broche 3 | PA02 — Analog input / ADC AIN0 / DAC OUT |
| Broche 4 | PA03 — Analog input / ADC AIN1 / VREFA |
| Broche 5 | PA04 — Analog input / ADC AIN4 / VREFB |
| Broche 6 | PA05 — Analog input / ADC AIN5 |
| Broche 7 | PA06 — Analog input / ADC AIN6 |
| Broche 8 | PA07 — Analog input / ADC AIN7 |
| Broche 9 | VDDIO — Digital I/O supply |
| Broche 10 | GND — Ground |
| Broche 11 | PA08 — General-purpose I/O / SERCOM0 PAD0 |
| Broche 12 | PA09 — General-purpose I/O / SERCOM0 PAD1 |
| Broche 13 | PA10 — General-purpose I/O / SERCOM0 PAD2 |
| Broche 14 | PA11 — General-purpose I/O / SERCOM0 PAD3 / USB DP |
| Broche 15 | VDDCORE — Internal core regulator output (1.2V) |
| Broche 16 | GND — Ground |
| Broche 17 | PA12 — General-purpose I/O / SERCOM1 PAD0 |
| Broche 18 | PA13 — General-purpose I/O / SERCOM1 PAD1 |
| Broche 19 | PA14 — General-purpose I/O / SERCOM1 PAD2 |
| Broche 20 | PA15 — General-purpose I/O / SERCOM1 PAD3 |
| Broche 21 | PA16 — General-purpose I/O / SERCOM2 PAD0 / I2S SD0 |
| Broche 22 | PA17 — General-purpose I/O / SERCOM2 PAD1 / I2S MCK0 |
| Broche 23 | PA18 — General-purpose I/O / SERCOM2 PAD2 / I2S FS0 |
| Broche 24 | PA19 — General-purpose I/O / SERCOM2 PAD3 / I2S SCK0 |
| Broche 25 | PA20 — General-purpose I/O / SERCOM5 PAD2 |
| Broche 26 | PA21 — General-purpose I/O / SERCOM5 PAD3 |
| Broche 27 | PA22 — General-purpose I/O / SERCOM3 PAD0 |
| Broche 28 | PA23 — General-purpose I/O / SERCOM3 PAD1 / USB DM |
| Broche 29 | PA24 — General-purpose I/O / SERCOM3 PAD2 / USB SOF 1kHz |
| Broche 30 | PA25 — General-purpose I/O / SERCOM3 PAD3 |
| Broche 31 | PB00 — General-purpose I/O |
| Broche 32 | PB01 — General-purpose I/O |
| Broche 33 | PB02 — General-purpose I/O / SERCOM5 PAD0 |
| Broche 34 | PB03 — General-purpose I/O / SERCOM5 PAD1 |
| Broche 35 | PB04 — General-purpose I/O |
| Broche 36 | PB05 — General-purpose I/O |
| Broche 37 | PB06 — General-purpose I/O / SERCOM4 PAD0 |
| Broche 38 | PB07 — General-purpose I/O / SERCOM4 PAD1 |
| Broche 39 | PB08 — General-purpose I/O / SERCOM4 PAD2 / LCD SEG0 |
| Broche 40 | PB09 — General-purpose I/O / SERCOM4 PAD3 / LCD SEG1 |
| Broche 41 | PB10 — General-purpose I/O / SERCOM4 PAD2 alt / TCC0 WO0 |
| Broche 42 | PB11 — General-purpose I/O / SERCOM4 PAD3 alt / TCC0 WO1 |
| Broche 43 | PB12 — General-purpose I/O / TCC3 WO0 / SERCOM4 PAD0 alt |
| Broche 44 | PB13 — General-purpose I/O / SERCOM4 PAD1 alt / TC0 WO1 |
| Broche 45 | PB14 — General-purpose I/O / SERCOM4 PAD2 alt / TC1 WO0 |
| Broche 46 | PB15 — General-purpose I/O / SERCOM4 PAD3 alt / TC1 WO1 |
| Broche 47 | PB16 — General-purpose I/O / SERCOM5 PAD0 alt / TCC1 WO0 |
| Broche 48 | PB17 — General-purpose I/O / SERCOM5 PAD1 alt / TCC1 WO1 |
| Broche 49 | PB18 — General-purpose I/O |
| Broche 50 | PB19 — General-purpose I/O |
| Broche 51 | PB20 — General-purpose I/O |
| Broche 52 | PB21 — General-purpose I/O |
| Broche 53 | PA27 — General-purpose I/O / I2S SD1 |
| Broche 54 | PA28 — General-purpose I/O / I2S MCK1 |
| Broche 55 | PA29 — General-purpose I/O / I2S FS1 |
| Broche 56 | PA30 — General-purpose I/O / I2S SCK1 / SWCLK |
| Broche 57 | PA31 — General-purpose I/O / SWDIO |
| Broche 58 | VDDIN — Main supply input (1.62-3.63V) |
| Broche 59 | GND — Ground |
| Broche 60 | VBUS — USB VBUS detect |
| Broche 61 | VDDIO — Digital I/O supply |
| Broche 62 | GND — Ground (exposed pad / e-pad) |
| Broche 63 | RESET — Reset input, active low |
| Broche 64 | NC — Not connected (per datasheet) |
Applications typiques
ATSAMD21J17A-MUT convient pour 6 applications: Home Automation Controllers, Wearable Fitness Bands, USB HID Peripherals, Industrial Sensor Nodes, Smart Electricity Metering, IoT End-Node / BLE Bridge.
Home Automation Controllers
The ATSAMD21J17A-MUT suits home automation hubs because its six SERCOM modules drive multiple wireless co-processors (Wi-Fi, BLE, Sub-GHz, LoRa) simultaneously, while Full-Speed USB with on-chip transceiver provides a debug/CDC bridge without an external PHY. Its 128 KB Flash hosts a TLS stack plus Matter/Thread bridge, and 16 KB SRAM buffers network messages. Operating from 1.62-3.63 V supports direct battery or 3.3 V rail input. Microchip's FuSa documentation simplifies IEC 60730 class B compliance for appliances. Typical reference: paired with ATWINC1510 Wi-Fi and ATSAMR21B radio.
Recommandé
Wearable Fitness Bands
Wearable fitness designs benefit from the ATSAMD21J17A-MUT's 3 uA deep-sleep current and event-driven wake-up, extending coin-cell life to months. The 48 MHz Cortex-M0+ computes pedometer algorithms and BLE HCI bridging at low active current (~3-5 mA). Six SERCOMs run BLE SPI, an OLED display SPI, an I2C heart-rate sensor, and a touch I2C keypad. The 12-bit ADC reads battery voltage directly; the integrated DAC drives haptic feedback. Reference: paired with BME280 environment sensor and LIS2DH accelerometer.
Recommandé
USB HID Peripherals
The ATSAMD21J17A-MUT is purpose-built for USB HID devices thanks to its integrated Full-Speed USB 2.0 Device controller with internal pull-up - no external PHY or 5 V regulator required. The 48 MHz Cortex-M0+ handles HID report generation, debounce, and macro recording on keyboards, mice, or custom HID controllers. 128 KB Flash stores multiple keymaps and macros; the event system debounces 64 GPIO lines without CPU load. Reference: Microchip USB stack + LUFA HID examples running on-board.
Recommandé
Industrial Sensor Nodes
Industrial 4-20 mA sensor nodes leverage the ATSAMD21J17A-MUT's wide 1.62-3.63 V supply to operate directly from 24 V loops via a single buck converter. The 12-bit ADC up to 350 ksps digitises analog sensor signals at high speed, while the Cortex-M0+ runs digital filtering and Modbus RTU over UART. The device's -40C to +85C industrial temperature range suits harsh environments, and Functional Safety (FuSa) documentation supports IEC 60730 class B compliance for machinery. Reference: paired with XTR105 4-20 mA loop transmitter.
Recommandé
Smart Electricity Metering
Smart electricity meters rely on the ATSAMD21J17A-MUT's 12-bit ADC for energy measurement, 32 KB RTC SRAM, and Cortex-M0+ for DLMS/COSEM encryption. Operating voltage down to 1.62 V supports single-cell battery backup for tamper detection. SERCOMs drive UART, optical port, and wireless M-Bus/LoRaWAN modules. Microchip's FuSa package provides IEC 60730 class B compliance for billing accuracy. Reference: paired with ADE7953 single-phase energy meter IC and RN2483 LoRaWAN module.
Recommandé
IoT End-Node / BLE Bridge
BLE bridges using the ATSAMD21J17A-MUT as the host MCU run the application while a co-processor handles BLE radio. The MCU's six SERCOMs accept SPI BLE modules, I2C environmental sensors, and a UART debug console simultaneously. The event system reduces wake-ups to ~3 uA deep-sleep, with the RTC triggering periodic sensor sampling. 128 KB Flash is sufficient for full BLE service profiles plus application code. Reference: paired with RN4870 BLE module and SHT31 humidity sensor.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD21J17A-MUT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD21J18A-MUT | ATSAMD21J17A-AUT | ATSAMD21J17A-MU | ATSAMD21J16B-MUT | ATSAMD21J15B-MUT |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash Memory | 128 KB | 256 KB | 128 KB (same) | 128 KB (same) | 64 KB | 32 KB |
| SRAM | 16 KB | 32 KB | 16 KB (same) | 16 KB (same) | 8 KB | 4 KB |
| Maximum CPU Frequency | 48 MHz | 48 MHz (same) | 48 MHz (same) | 48 MHz (same) | 48 MHz (same) | 48 MHz (same) |
| Operating Voltage | 1.62 V to 3.63 V | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) |
| USB | Full-Speed USB Device/Host | Full-Speed USB (same) | Full-Speed USB (same) | Full-Speed USB (same) | Full-Speed USB (same) | Full-Speed USB (same) |
| SERCOM Modules | 6 | 6 (same) | 6 (same) | 6 (same) | 6 (same) | 6 (same) |
| Automotive Grade | No (industrial) | No | Yes (AEC-Q100) | No | No | No |
Principaux différenciateurs
- Dual-bank 128 KB Flash with read-while-write (vs ATSAMD21J16B-MUT)
- Functional Safety (FuSa) variant available in same footprint (vs ATSAMD21J17A-AUT)
- Higher SRAM headroom vs smaller-flash siblings (vs ATSAMD21J15B-MUT)
Notes de conception
Place a 1 uF X7R ceramic bypass capacitor on VDDIN (pin 58) within 2 mm of the pin, plus a 100 nF decoupling on VDDCORE (pin 15) and VDDCORE_BYPASS. The internal LDO regulator requires this bulk capacitance to maintain stability. Failure to do so may cause brown-outs at high CPU loads or during USB enumeration. Per Microchip SAM D21 datasheet, VDDIO and VDDIN should be tied together for 3.3 V single-supply operation, or driven separately for 1.8 V I/O with 3.3 V analog rails.
Route the USB DP/DM traces (PA11/PA23) as a 90-ohm differential pair with matched length within 150 mil. Add a USBLC6-2SC6 ESD protection array at the USB connector, with the protection capacitance within 3 mm of the connector pins. The exposed thermal pad (GND, pin 62) must be soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill) for heat dissipation. According to Microchip SAM D21 datasheet, a missing or improperly soldered e-pad reduces the thermal performance and may trigger thermal shutdown at moderate loads.
For high-speed SERCOM peripherals running above 10 MHz, place source-series termination (typically 33 ohm) within 5 mm of the driver pin. The Cortex-M0+ GPIO has a 6 mA drive strength that is adequate for 1-2 inch PCB traces but not for backplane connections. Per Microchip's SAM D21 datasheet, slew-rate limiting is configurable per pin via the PORT group DRVCTRL register; enable it for EMI-sensitive industrial applications to reduce harmonics by approximately 6 dB.
Do not configure the SWDIO/SWCLK pins (PA30/PA31) as GPIO without disabling the debugger first, otherwise the MCU becomes bricked. Always include a 4.7 kohm pull-up on RESETn (pin 63) and a 1 nF capacitor to GND for noise filtering. The internal brown-out detector (BOD) defaults to 1.62 V; for 1.8 V operation enable the BOD33 hysteresis via NVM user row. Per Microchip, a missing or wrong BOD setting is the most common cause of intermittent resets in battery-powered designs.
Informations de conformité
RoHS compliant and lead-free per Microchip product page. Industrial -40C to +85C temperature grade; for AEC-Q100 automotive grade use the AUT suffix variant. Halogen-free per Microchip policy. Functional Safety (FuSa) documentation package available, simplifying IEC 60730 class B compliance.
