EP2A40F1020C8ES - APEX II FPGA 1.5M Gates 1020-BGA | Intel
Référence : EP2A40F1020C8ES ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 500 | $205.2 | $102 600,00 |
| 1 000 | $185.25 | $185 250,00 |
EP2A40F1020C8ES Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened I/O serializers. Modern FPGAs sit at the same architectural tier as microcontrollers and DSPs in embedded systems, but offer hardware-level parallelism: instead of executing instructions sequentially, custom digital circuits are synthesized directly into the silicon fabric. APEX II devices belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs, and historically descended from PAL/GAL architectures.
Key features of the EP2A40F1020C8ES include 655,360 RAM bits distributed across embedded memory blocks, a high I/O count of 735 supporting a wide mix of single-ended and differential signaling standards, and APEX II's signature Look-Up Table (LUT) plus embedded memory dual-function architecture. The device supports in-system programmability via JTAG and configuration via passive serial, and integrates PLLs for clock management.
Technically, the APEX II architecture uses a MultiCore interconnect matrix combining row and column routing with embedded memory blocks (ESBs), enabling efficient implementation of large datapaths and FIFOs. The 1020-BGA FCBGA package offers high signal density and thermal performance suitable for high-utilization designs; engineers should observe controlled-impedance routing and proper decoupling when laying out the PCB.
Typical applications for this part include telecom line cards, industrial control and instrumentation, high-speed data acquisition front-ends, and ASIC prototyping. The high gate count makes it well-suited for designs requiring parallel processing pipelines, custom bus interfaces, or hardware acceleration.
When designing with this FPGA, allocate sufficient PCB area for decoupling capacitors near each supply pin and follow Intel/Altera's recommended footprint and stack-up guidelines for fine-pitch BGA packages. Thermal management via thermal vias under the die and copper pours is recommended at high utilization.
This page synthesizes distributor pricing, same-family APEX II alternatives, and practical design notes not found in the legacy manufacturer datasheet.
Alternatives de remplacement direct pour EP2A40F1020C8ES — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40F1020C8ES (même facteur de forme et même empreinte) — différant par Process Technology, Package, Mounting Type, System Gates, Core Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40F1020C8
✅ Remplacement direct✓ En stock
$310 / unité
Voir la fiche technique →EP2A40F1020C7ES
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP2A40F1020C7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP2A40F1020C7
✅ Remplacement direct✓ En stock
$138 / unité
Voir la fiche technique →EP2A40F1020C6N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP2A40F1020C6
✅ Remplacement direct✓ En stock
$149 / unité
Voir la fiche technique →EP2A40F1020C8ES Valeurs maximales et caractéristiques électriques
| Series | APEX II |
| Logic Elements / Cells | 40,960 |
| Total RAM Bits | 655,360 |
| Number of I/O | 735 |
| Tension d'alimentation | 1.425 V to 1.575 V |
| Température de fonctionnement | 0 °C to 85 °C (TJ) |
| Type de montage | Surface Mount |
| Boîtier / Format | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Packaging | Tray |
| Speed Grade | C8 |
| Number of Logic Elements/Cells | 40,960 |
| Manufacturer | Altera (now Intel PSG) |
Guide de configuration des broches du EP2A40F1020C8ES 1020-fbga (33x33)
Configuration des broches du EP2A40F1020C8ES (boîtier 1020-fbga (33x33)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40F1020C8ES.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40F1020C8ES convient pour 6 applications: Telecom Line Card Interface, Industrial Control and Motion Control, High-Speed Data Acquisition Front-End, ASIC Prototyping and Emulation, Medical Imaging Signal Pipeline, Legacy Avionics Databus Interface.
Telecom Line Card Interface
The EP2A40F1020C8ES's 1.5M system gates and 735 user I/O pins make it well-suited for telecom line card designs that require many concurrent SERDES-like channels and bus interfaces. The 655,360 bits of embedded RAM (ESBs) support per-channel FIFOs and elastic buffers for traffic management. In typical use, the FPGA bridges between a network processor and multiple SFP/QSFP optical modules, handling framer/mapper functions, hardware ACLs, and OAM processing. The APEX II architecture's MultiCore interconnect efficiently routes the dense datapath fabric, while the 1020-FBGA package provides sufficient I/O density for multi-lane designs. Engineers should plan for proper signal integrity on high-speed LVDS links using controlled-impedance routing.
Recommandé
Industrial Control and Motion Control
The EP2A40F1020C8ES is a strong fit for industrial motion controllers that require parallel processing of multi-axis servo loops, encoder feedback, and safety logic. The 40,960 logic elements enable hardware implementation of PID controllers, trajectory planners, and EtherCAT/CANopen MAC layers without CPU intervention. The commercial 0-85 °C operating temperature range covers most factory-floor enclosures, though harsh environments may require additional thermal management. The 1.5 V core supply and PLLs support deterministic clocking for synchronized axis control. Designers typically pair this FPGA with external ADC/DAC converters for current/voltage sensing and use embedded RAM for command queue storage.
Recommandé
High-Speed Data Acquisition Front-End
The high I/O count and embedded RAM of the EP2A40F1020C8ES make it ideal for data acquisition front-ends that interface to multiple high-speed ADCs and DACs. With 735 user I/O, designers can connect parallel LVDS ADC data buses, clock distribution networks, and trigger synchronization logic simultaneously. The 655,360 bits of embedded RAM serve as deep capture buffers, while PLLs generate the low-jitter clocks required by precision converters. Typical applications include radar signal preprocessing, ultrasonic beamforming, and software-defined radio front-ends. The 1020-FBGA package supports the dense routing required to maintain signal integrity across many parallel LVDS pairs.
Recommandé
ASIC Prototyping and Emulation
The 1.5M-gate capacity of the EP2A40F1020C8ES accommodates prototyping of mid-complexity ASICs, including SoC subsystems and custom processors. Engineers map ASIC RTL into the APEX II fabric using Quartus II synthesis, validate functionality at near-real-time speeds, and iterate before committing to silicon. The 735 I/O pins emulate a wide range of peripheral interfaces (DDR, USB, Ethernet, PCIe-style protocols). Multiple EP2A40 devices can be cascaded via dedicated inter-FPGA links to support larger ASIC prototypes. The C8 speed grade provides sufficient timing margin for ASIC emulation workloads where exact frequency matching is not required.
Recommandé
Medical Imaging Signal Pipeline
The EP2A40F1020C8ES suits medical imaging systems such as ultrasound front-ends, where parallel beamforming across hundreds of channels demands both high logic density and many I/O. The embedded memory blocks store per-channel filter coefficients and intermediate sample buffers, while the LUT-based fabric implements the actual FIR/IIR beamforming math in parallel. The commercial 0-85 °C temperature range supports cart-based diagnostic equipment, though portable/wearable variants may require industrial-temp screening. The 1.5 V core keeps power consumption manageable despite the 40,960-LE footprint, an important factor for clinician-handheld systems.
Recommandé
Legacy Avionics Databus Interface
The EP2A40F1020C8ES is used in legacy avionics programs that require MIL-STD-1553, ARINC 429, and ARINC 664 bus interfaces implemented in programmable logic. The 735 I/O pins support dozens of simultaneous avionics channels, while the 40,960 logic elements implement Manchester encoding/decoding, bus arbitration, and error-checking in hardware. The APEX II family has long flight-provenance on military and aerospace platforms, making it a low-risk choice for sustaining engineering. Engineers typically add ruggedized packaging and conformal coating on top of the commercial-grade silicon for DO-160 environmental compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40F1020C8ES — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40F1020C8 | EP2A40F1020C7ES | EP2A40F1020C7N | EP2A40F1020C7 | EP2A40F1020C6N | EP2A40F1020C6 |
|---|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Series | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Logic Elements | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Total RAM Bits | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 |
| User I/O | 735 | 735 | 735 | 735 | 735 | 735 | 735 |
| Speed Grade | C8 | C8 - same | C7 (faster) | C7 (faster) | C7 (faster) | C6 (fastest) | C6 (fastest) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
Principaux différenciateurs
- Highest gate-count APEX II in 1020-BGA (vs EP2A25F1020C8ES)
- C8 speed grade offers lowest unit cost (vs EP2A40F1020C7ES)
- APEX II LUT plus embedded-memory architecture (vs EP20K600CF1020C8 (APEX 20K family))
Notes de conception
The 1020-ball FCBGA package with 33 mm × 33 mm body requires microvia or stacked-via PCB technology to route signals out of the inner rows. Decoupling must be placed directly under the BGA on the opposite PCB layer: 0.1 µF X7R per supply pin plus 10 µF bulk per supply rail. Maintain controlled-impedance (50 Ω single-ended, 100 Ω differential) for LVDS pairs and use length matching within 150 mil for parallel buses. Reference APEX II Handbook Chapter 7 for the recommended footprint, stack-up, and escape routing patterns.
The 1.5 V core and multiple VCCIO rails (3.3 V, 2.5 V, 1.8 V, 1.5 V) require a multi-rail power supply with strict sequencing. Power-up sequence must follow the APEX II datasheet: 1.5 V core before VCCIO, or simultaneously within 100 ms. Use a dedicated sequencer IC or FPGA power controller such as the LTC2923. Bulk capacitance of at least 220 µF per supply rail plus per-pin 0.1 µF ceramics is required to handle inrush during configuration. Estimated core current at 100% utilization is 1.5-2.5 A; budget the regulator accordingly.
Do not assume ES-suffixed APEX II parts are lead-free without confirming RoHS status via supplier declaration. Configuration mode pins (MSEL) must be set correctly at power-up: missing or floating MSEL pins can leave the device in an undefined state. JTAG chain ordering is critical when multiple FPGAs share one TCK/TMS bus; verify the BSDL files match the silicon revision. Finally, do not exceed the 8 ns pin-to-pin timing assumption of C8 grade without re-running timing analysis at the actual operating temperature and voltage corner.
Estimated: at 100% logic utilization with 1.5 V core drawing ~2 A, the 1020-FBGA package dissipates approximately 3 W. With theta_JA around 18 °C/W (still-air, JEDEC 4-layer board), the junction temperature rise is roughly 54 °C above ambient. For 25 °C ambient, Tj ≈ 79 °C, well within the 85 °C commercial limit. For designs approaching 4 W dissipation, add thermal vias under the die and consider a heatsink or airflow to maintain margin. Verify with a thermal probe on prototype units.
Place configuration EEPROM (e.g., EPC16 or EPC64) within 4 inches of the FPGA and route the serial data line away from switching signals. Use a dedicated 4-layer PCB with continuous ground and power planes; never route signals across a plane split. For LVDS, maintain 100 Ω differential impedance and use AC-coupling capacitors at the receiver when crossing voltage domains. Clock traces should be length-matched to within 50 mil and guarded by ground pour to minimize jitter.
Informations de conformité
RoHS and lead-free status for the EP2A40F1020C8ES were not confirmed in the verified distributor data. APEX II parts under ES suffix are typically lead-free, but production builds should obtain a signed compliance declaration from the supplier. AEC-Q100 is not applicable for this commercial-grade FPGA.