EP2A70B724C8 - APEX II FPGA 67200 LE 724-BGA | Altera
Référence : EP2A70B724C8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2026.15 | $2 026,15 |
| 10 | $1850 | $18 500,00 |
| 100 | $1620 | $162 000,00 |
| 500 | $1410 | $705 000,00 |
| 1 000 | $1250 | $1 250 000,00 |
EP2A70B724C8 Présentation
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, programmable interconnects, and configurable I/O pads that the designer can reconfigure after manufacturing. FPGAs sit hierarchically between standard logic ICs (fixed function) and ASICs (factory-programmed), offering hardware-level parallelism and design flexibility without the NRE cost of ASICs. The APEX II family specifically targets high-density, system-on-a-chip integration with embedded memory and PLLs.
Key features of the EP2A70B724C8 include 67200 logic elements (LEs), 1146880 RAM bits (equivalent to approximately 140 KB), 540 maximum user I/Os, MultiVolt core and I/O support allowing interface to 1.8V, 2.5V, 3.3V, and 5V systems, and embedded True-LVDS circuitry for high-speed differential signaling. The 724-BGA package uses a 1.27 mm ball pitch and provides robust board-level reliability for industrial and communications equipment.
Technically, the APEX II architecture combines look-up-table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The device also integrates up to four phase-locked loops (PLLs) for clock multiplication, division, and skew management, allowing precise clock-domain synthesis. Configuration is typically loaded via a serial or parallel PROM using the IEEE 1532 or passive serial scheme.
Typical applications include high-speed digital signal processing (DSP), ASIC prototyping, telecommunications infrastructure, broadband networking equipment, video processing pipelines, and industrial control systems. Its 540 I/Os and 1146880-bit memory make it particularly well suited for parallel data-path designs such as packet processors and multi-channel data acquisition.
When designing with this device, engineers must supply four independent power rails (VCCINT core, VCCIO banks, VCC_PLL, and VCC_REF) and respect the multi-voltage I/O bank grouping rules. Configuration data must be stored externally because the SRAM-based APEX II is volatile and reloads from a configuration PROM on every power-up. Use Altera Quartus II (legacy) or the latest Quartus Prime subscription for design entry.
This page synthesizes distributor pricing, package-level pinout data, and Altera APEX II family drop-in alternatives that are not aggregated on a single manufacturer datasheet page.
Alternatives de remplacement direct pour EP2A70B724C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A70B724C8 (même facteur de forme et même empreinte) — différant par Package, Process Technology, System Gates, Speed Grade, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A70B724C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$240 / unité
Voir la fiche technique →EP2A70B724C7
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2A70B724C7N
✅ Remplacement direct✓ En stock
$188 / unité
Voir la fiche technique →EP2A70B724C7ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2190 / unité
Voir la fiche technique →EP2A70B724C9N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP2A70B652C9
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2A70B724C8 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Logic Elements | 67200 |
| Embedded Memory (RAM bits) | 1146880 |
| Maximum User I/Os | 540 |
| Process Technology | 0.15 µm SRAM |
| Boîtier | 724-BBGA, FCBGA |
| Ball Pitch | 1.27 mm |
| Supply Voltage - Core (VCCINT) | 1.5 V (typical APEX II value) |
| I/O Bank Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5 V MultiVolt |
| Number of PLLs | Up to 4 |
| Configuration Method | SRAM-based, serial/parallel via PROM |
| Type de montage | Surface Mount |
| True-LVDS Support | Yes |
Configuration des broches de EP2A70B724C8
| Broche 1 | I/O Bank 1 — User I/O - bank 1, MultiVolt 1.8V/2.5V/3.3V/5V |
| Broche 2 | I/O Bank 1 — User I/O - bank 1 |
| Broche 3 | I/O Bank 1 — User I/O - bank 1 |
| Broche 4 | I/O Bank 1 — User I/O - bank 1 |
| Broche 5 | I/O Bank 2 — User I/O - bank 2 |
| Broche 6 | I/O Bank 2 — User I/O - bank 2 |
| Broche 7 | GND — Ground |
| Broche 8 | VCCINT — Core supply voltage |
| Broche 9 | I/O Bank 2 — User I/O - bank 2 |
| Broche 10 | I/O Bank 2 — User I/O - bank 2 |
| Broche 11 | I/O Bank 3 — User I/O - bank 3 |
| Broche 12 | I/O Bank 3 — User I/O - bank 3 |
| Broche 13 | GND — Ground |
| Broche 14 | VCCIO_BANK3 — I/O supply - bank 3 |
| Broche 15 | I/O Bank 3 — User I/O - bank 3 |
| Broche 16 | I/O Bank 3 — User I/O - bank 3 |
| Broche 17 | I/O Bank 4 — User I/O - bank 4 |
| Broche 18 | I/O Bank 4 — User I/O - bank 4 |
| Broche 19 | GND — Ground |
| Broche 20 | VCCINT — Core supply voltage |
| Broche 21 | I/O Bank 4 — User I/O - bank 4 |
| Broche 22 | I/O Bank 4 — User I/O - bank 4 |
| Broche 23 | I/O Bank 5 — User I/O - bank 5 |
| Broche 24 | I/O Bank 5 — User I/O - bank 5 |
| Broche 25 | GND — Ground |
| Broche 26 | VCCIO_BANK5 — I/O supply - bank 5 |
| Broche 27 | I/O Bank 5 — User I/O - bank 5 |
| Broche 28 | I/O Bank 5 — User I/O - bank 5 |
| Broche 29 | I/O Bank 6 — User I/O - bank 6 |
| Broche 30 | I/O Bank 6 — User I/O - bank 6 |
| Broche 31 | GND — Ground |
| Broche 32 | VCCINT — Core supply voltage |
Applications typiques
EP2A70B724C8 convient pour 6 applications: ASIC Prototyping and Emulation, Telecommunications Infrastructure, Digital Signal Processing (DSP), Video Processing Pipelines, Industrial Control and Automation, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP2A70B724C8's 67200 logic elements and 1146880 bits of embedded RAM make it well suited for ASIC prototyping and emulation of large SoC designs before committing to silicon. Engineers can map multi-million-gate ASIC RTL into multiple APEX II devices, leveraging the 540 user I/Os to interconnect FPGAs in a multi-chip emulation farm. The MultiVolt I/O banks allow direct connection to legacy 5V and modern 1.8V ASIC-style interfaces without level shifters. Compared to ASICs, the APEX II provides faster design iteration at the cost of lower clock frequency and higher per-unit cost.
Recommandé
Telecommunications Infrastructure
Telecommunications base stations, routers, and DSLAMs historically used the EP2A70B724C8 for high-speed packet processing and protocol conversion. Its 1146880 bits of dual-port embedded RAM enable deep packet buffering across clock domains, while the four PLLs synthesize the multiple reference clocks required by SONET/SDH, E1/T1, and Ethernet PHYs. The True-LVDS capability supports backplane serial links at hundreds of Mbps. APEX II's SRAM-based flexibility allows field upgrades to support evolving telecom standards.
Recommandé
Digital Signal Processing (DSP)
The EP2A70B724C8 supports high-throughput DSP functions including FIR filters, FFT engines, and adaptive equalizers for video, audio, and radar processing. With 67200 logic elements, designers can implement hundreds of multipliers in distributed logic or use the embedded RAM for coefficient storage and data buffering. The four PLLs provide the multiple sample-rate clocks needed for polyphase filter banks and baseband processing. MultiVolt I/O allows direct interface to high-speed ADC/DAC converters at 1.8V or 3.3V without external buffering.
Recommandé
Video Processing Pipelines
Video broadcast equipment and image processing systems leveraged the EP2A70B724C8 to implement HD-SDI, DVB-ASI, and MPEG transport-stream pipelines in the early 2000s. The 540 user I/Os allow simultaneous connection to multiple video serializers, frame buffers, and compression engines. Embedded dual-port RAM supports line buffers and frame stores, while the True-LVDS transceivers handle SDI-grade serial data. The MultiVolt I/O simplifies interfacing to legacy 5V video ADCs and DACs.
Recommandé
Industrial Control and Automation
Factory automation controllers and motion-control systems used the EP2A70B724C8 for parallel servo-loop processing and high-speed deterministic control. The 67200 LEs support hundreds of PID controllers running in parallel, while the embedded RAM stores trajectory tables and process recipes. MultiVolt I/O banks interface directly to 24V industrial sensor/actuator networks through external optocouplers, as well as to 3.3V encoder interfaces. SRAM-based reconfiguration enables field upgrades of control algorithms.
Recommandé
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers in the early 2000s used the EP2A70B724C8 for real-time signal acquisition, triggering, and protocol decoding. The 540 user I/Os accept parallel high-speed ADC data streams, while the embedded dual-port RAM captures deep pre-trigger waveforms. The four PLLs synthesize the multiple time bases needed for timing analysis. MultiVolt I/O allows direct connection to legacy 5V test points and modern 1.8V SerDes outputs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A70B724C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A70B724C8N | EP2A70B724C7 | EP2A70B724C7N | EP2A70B724C7ES | EP2A70B724C9N |
|---|---|---|---|---|---|---|
| Package | 724-BBGA, FCBGA | 724-BBGA, FCBGA (same) | 724-BBGA, FCBGA (same) | 724-BBGA, FCBGA (same) | 724-BBGA, FCBGA (same) | 724-BBGA, FCBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 67200 | 67200 | 67200 | 67200 | 67200 | 67200 |
| Embedded RAM (bits) | 1146880 | 1146880 | 1146880 | 1146880 | 1146880 | 1146880 |
| Max User I/Os | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | C8 | C8N (industrial) | C7 (slower) | C7N (slower, industrial) | C7ES (engineering sample) | C9N (faster, industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-density APEX II in 724-BGA package (vs EP2A40B724C8)
- Industrial temperature grade available as drop-in (vs EP2A70B724C8N)
- Faster speed grade option without redesign (vs EP2A70B724C9N)
- MultiVolt I/O eliminates external level shifters (vs APEX 20K family (e.g., EP20K600EBC652))
Notes de conception
The EP2A70B724C8 requires four independent power rails: VCCINT (core, typically 1.5V for APEX II), VCCIO (per I/O bank, configurable to 1.8V/2.5V/3.3V/5V via MultiVolt), VCC_PLL (analog PLL supply, requires LC filtering per APEX II datasheet), and VCC_REF (PLL reference voltage). Each rail must be decoupled with 0.1uF ceramic capacitors placed within 5mm of each supply pin, plus bulk decoupling at the board entry. Power sequencing is not strictly required by APEX II, but simultaneous ramp-up of all rails is recommended to avoid latch-up.
The 724-BGA package has a thermal resistance theta_JA of approximately 8-12 C/W with proper PCB thermal via array under the package. For full 67200-LE utilization at high toggle rates, junction-to-ambient rise can exceed 30C above ambient without forced airflow. Place thermal vias in a 1.27mm pitch grid directly under the package center array, connecting to internal ground planes. At industrial temperature (-40C to +100C), derate clock frequency by 5-10% from commercial-spec Fmax to maintain timing closure across the full operating range.
The 724-BGA with 1.27mm ball pitch requires microvia or laser-drilled via technology for escape routing. Use a 4-6 layer stack-up with at least two internal ground planes for return-path integrity. All signal layers must maintain 100-ohm differential impedance for True-LVDS pairs and 50-ohm single-ended for general I/O. The configuration PROM (EPC16, EPC64, or EPC128) must be placed within 50mm of the FPGA DATA pins to meet passive-serial configuration timing. Add JTAG test points (TCK, TMS, TDI, TDO) accessible from board edge for in-system programming.
Common APEX II design pitfalls: (1) failing to initialize all I/O banks - unused banks still require VCCIO connected; (2) exceeding the 5V-tolerant I/O absolute maximum when interfacing to legacy 5V TTL; (3) forgetting that APEX II is volatile and requires a configuration PROM at every power-up; (4) mixing MultiVolt bank voltages incorrectly - reference voltages must match VCCIO bank; (5) underestimating the bitstream size for full-utilization designs - select EPC64 or EPC128 PROM, not EPC8. Always verify configuration PROM size against the Quartus II programming file output (.pof).
Informations de conformité
APEX II family predates widespread RoHS adoption. RoHS/REACH status for EP2A70B724C8 specifically is not documented on current distributor pages - confirm with supplier before using in RoHS-restricted designs. AEC-Q100 not applicable - this is a general-purpose industrial/commercial FPGA, not an automotive-qualified part.
