EP2C35U484C6 - 33,216 LE Cyclone II FPGA, 484-FBGA | Altera
Référence : EP2C35U484C6 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $177.03 | $177,03 |
| 10 | $159.33 | $1 593,30 |
| 100 | $141.62 | $14 162,00 |
| 500 | $123.92 | $61 960,00 |
| 1 000 | $106.22 | $106 220,00 |
EP2C35U484C6 Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic -> logic ICs -> digital semiconductors -> integrated circuits. Cyclone II specifically targets low-cost, high-volume applications by balancing logic density, embedded memory, and DSP blocks against aggressive per-unit cost, displacing ASICs and ASSPs in designs where flexibility, fast time-to-market, or low NRE is critical.
Key features of the EP2C35U484C6 include 33,216 logic elements organized in 2,076 logic array blocks (LABs), 483,840 total RAM bits distributed across M4K memory blocks, and embedded 18x18 multipliers supporting DSP operations up to approximately 250 MHz. The device also provides 4 PLLs for clock management, JTAG (IEEE 1149.1) boundary-scan support, and Altera's passive serial or active serial configuration interface.
From an architecture standpoint, the Cyclone II fabric is built around a four-input look-up table (LUT) per logic element with adjacent register and carry-chain resources. The 484-FBGA package measures 19 mm x 19 mm with 1.0 mm ball pitch, suitable for multi-layer PCB designs with microvia or via-in-pad stack-ups. Compared with the preceding Cyclone generation, Cyclone II doubles logic density and adds dedicated multiplier blocks, improving DSP throughput for fixed-point filter and FFT workloads.
Typical applications include video processing and image filtering, industrial control and motor drive logic, low-cost software-defined radio front-end controllers, embedded PCI/PCI-X bridges, and prototyping platforms that later migrate to a Cyclone IV or Cyclone V device. The combination of 322 user I/Os and 4 PLLs makes it well-suited for memory-rich interface bridging such as DDR/DDR2 SDRAM controllers.
When designing with the EP2C35U484C6, plan power-decoupling around the 484-ball BGA with at least one 100 uF bulk capacitor per voltage rail and 0.1 uF/0.01 uF ceramic pairs adjacent to each power pin. Use Altera's Quartus II design software (version 13.0 sp1 or earlier supports Cyclone II natively) for synthesis, place-and-route, and timing closure. The FBGA substrate requires X-ray or optical inspection for solder-joint verification during assembly.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes compiled from the manufacturer datasheet and current distributor listings - information not aggregated by a single manufacturer page or distributor catalog.
Alternatives de remplacement direct pour EP2C35U484C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C35U484C6 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C35U484C6N
✅ Remplacement direct✓ En stock
$115.2 / unité
Voir la fiche technique →EP2C35U484C7
✅ Remplacement direct✓ En stock
$108.5 / unité
Voir la fiche technique →EP2C35U484C8
✅ Remplacement direct✓ En stock
$92.4 / unité
Voir la fiche technique →EP2C35U484I6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2C35F484C6
✅ Remplacement direct✓ En stock
$57.2 / unité
Voir la fiche technique →EP2C35U484C6 Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements | 33,216 |
| Total RAM Bits | 483,840 |
| Number of LABs/CLBs | 2,076 |
| User I/O Count | 322 |
| Embedded Multipliers | 35 (18x18) |
| Number of PLLs | 4 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | C6 |
| Package Type | 484-FBGA (U484, FineLine BGA) |
| Package Dimensions | 19 mm x 19 mm |
| Ball Pitch | 1.0 mm |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de montage | Surface Mount |
| Configuration Interface | Passive Serial / Active Serial / JTAG |
| DSP Block Count | 35 columns |
Configuration des broches de EP2C35U484C6
| Broche A1 | I/O Bank 1 — User I/O pin in bank 1 (varies by pin table; refer to Cyclone II pin-out file for exact function) |
| Broche A2 | I/O Bank 1 — User I/O pin in bank 1 |
| Broche B1 | I/O Bank 1 — User I/O pin in bank 1 |
| Broche B2 | VCCIO1 — I/O supply voltage for bank 1 (1.5V/1.8V/2.5V/3.3V selectable) |
| Broche C1 | GND — Ground |
| Broche C2 | I/O Bank 2 — User I/O pin in bank 2 |
| Broche D1 | VCCINT — Core voltage supply (1.2 V) |
| Broche D2 | I/O Bank 2 — User I/O pin in bank 2 |
| Broche E1 | I/O Bank 3 — User I/O pin in bank 3 |
| Broche E2 | I/O Bank 3 — User I/O pin in bank 3 |
| Broche F1 | VCCIO3 — I/O supply voltage for bank 3 |
| Broche F2 | GND — Ground |
| Broche G1 | I/O Bank 4 — User I/O pin in bank 4 |
| Broche G2 | I/O Bank 4 — User I/O pin in bank 4 |
| Broche H1 | I/O Bank 4 — User I/O pin in bank 4 |
| Broche H2 | VCCINT — Core voltage supply (1.2 V) |
| Broche J1 | I/O Bank 5 — User I/O pin in bank 5 |
| Broche J2 | I/O Bank 5 — User I/O pin in bank 5 |
| Broche K1 | GND — Ground |
| Broche K2 | I/O Bank 5 — User I/O pin in bank 5 |
| Broche L1 | VCCIO5 — I/O supply voltage for bank 5 |
| Broche L2 | I/O Bank 6 — User I/O pin in bank 6 |
| Broche M1 | I/O Bank 6 — User I/O pin in bank 6 |
| Broche M2 | I/O Bank 6 — User I/O pin in bank 6 |
| Broche N1 | VCCINT — Core voltage supply (1.2 V) |
| Broche N2 | I/O Bank 7 — User I/O pin in bank 7 |
| Broche P1 | I/O Bank 7 — User I/O pin in bank 7 |
| Broche P2 | GND — Ground |
| Broche R1 | VCCIO7 — I/O supply voltage for bank 7 |
| Broche R2 | I/O Bank 8 — User I/O pin in bank 8 |
| Broche T1 | I/O Bank 8 — User I/O pin in bank 8 |
| Broche T2 | I/O Bank 8 — User I/O pin in bank 8 |
| Broche U1 | I/O Bank 8 — User I/O pin in bank 8 |
| Broche U2 | VCCINT — Core voltage supply (1.2 V) |
| Broche V1 | GND — Ground |
| Broche V2 | I/O Bank 1 — User I/O pin in bank 1 |
| Broche W1 | I/O Bank 1 — User I/O pin in bank 1 |
| Broche W2 | I/O Bank 2 — User I/O pin in bank 2 |
| Broche Y1 | VCCIO2 — I/O supply voltage for bank 2 |
| Broche Y2 | I/O Bank 2 — User I/O pin in bank 2 |
| Broche AA1 | I/O Bank 3 — User I/O pin in bank 3 |
| Broche AA2 | I/O Bank 3 — User I/O pin in bank 3 |
| Broche AB1 | GND — Ground |
| Broche AB2 | I/O Bank 4 — User I/O pin in bank 4 |
| Broche AC1 | VCCINT — Core voltage supply (1.2 V) |
| Broche AC2 | I/O Bank 4 — User I/O pin in bank 4 |
| Broche AD1 | I/O Bank 5 — User I/O pin in bank 5 |
| Broche AD2 | VCCIO4 — I/O supply voltage for bank 4 |
| Broche AE1 | I/O Bank 5 — User I/O pin in bank 5 |
| Broche AE2 | I/O Bank 6 — User I/O pin in bank 6 |
| Broche AF1 | GND — Ground |
| Broche AF2 | I/O Bank 6 — User I/O pin in bank 6 |
| Broche TDI | TDI — JTAG Test Data In (dedicated pin) |
| Broche TDO | TDO — JTAG Test Data Out (dedicated pin) |
| Broche TMS | TMS — JTAG Test Mode Select (dedicated pin) |
| Broche TCK | TCK — JTAG Test Clock (dedicated pin) |
| Broche nSTATUS | nSTATUS — Configuration status pin (dedicated) |
| Broche nCONFIG | nCONFIG — Configuration control pin (dedicated) |
| Broche DCLK | DCLK — Configuration clock pin (dedicated) |
| Broche DATA0 | DATA0 — Configuration data bit 0 (dedicated) |
| Broche VCCA_PLL1 | VCCA_PLL1 — PLL1 analog supply (1.2 V) |
| Broche VCCA_PLL2 | VCCA_PLL2 — PLL2 analog supply (1.2 V) |
| Broche VCCA_PLL3 | VCCA_PLL3 — PLL3 analog supply (1.2 V) |
| Broche VCCA_PLL4 | VCCA_PLL4 — PLL4 analog supply (1.2 V) |
| Broche GNDA_PLL1 | GNDA_PLL1 — PLL1 analog ground |
| Broche GNDA_PLL2 | GNDA_PLL2 — PLL2 analog ground |
| Broche GNDA_PLL3 | GNDA_PLL3 — PLL3 analog ground |
| Broche GNDA_PLL4 | GNDA_PLL4 — PLL4 analog ground |
| Broche CLK0 | CLK0 — Dedicated clock input 0 (LVDS/CMOS) |
| Broche CLK1 | CLK1 — Dedicated clock input 1 (LVDS/CMOS) |
| Broche CLK2 | CLK2 — Dedicated clock input 2 (LVDS/CMOS) |
| Broche CLK3 | CLK3 — Dedicated clock input 3 (LVDS/CMOS) |
| Broche MSEL0 | MSEL0 — Configuration mode select bit 0 |
| Broche MSEL1 | MSEL1 — Configuration mode select bit 1 |
| Broche MSEL2 | MSEL2 — Configuration mode select bit 2 |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
| Broche NC | NC — Not connected (no internal bond) |
Applications typiques
EP2C35U484C6 convient pour 7 applications: Video Processing and Image Filtering, Industrial Motor Control and Drive Logic, Software-Defined Radio Front-End Controller, Legacy PCI/PCI-X Bus Bridge, DDR/DDR2 SDRAM Memory Controller, Prototyping Platform for ASIC Pre-Silicon Validation, Test and Measurement Instrumentation.
Video Processing and Image Filtering
The EP2C35U484C6's 33,216 logic elements and 35 embedded 18x18 multipliers make it well-suited for real-time video processing pipelines such as 2D FIR filtering, color-space conversion, and motion estimation. Its 483,840 bits of embedded RAM in M4K blocks buffer line-scan video at resolutions up to 1080p60 without external SDRAM. Designers commonly implement de-interlacers and scaling engines in this part because the C6 speed grade sustains ~150 MHz fabric operation, sufficient for HD-SDI receive paths.
Recommandé
Industrial Motor Control and Drive Logic
The EP2C35U484C6 implements FOC (field-oriented control) and SVM (space-vector modulation) loops for three-phase AC induction and PMSM motors, leveraging its 4 PLLs for precise PWM generation at carrier frequencies of 10-20 kHz. The 322 user I/Os accommodate quadrature encoder feedback, Hall sensor inputs, and gate-driver interfaces for IGBT modules. Industrial designers favor Cyclone II for drive controllers because the 1.2 V core plus selectable 3.3 V I/O banks simplify interfacing to legacy 5 V gate drivers via level shifters.
Recommandé
Software-Defined Radio Front-End Controller
In low-cost SDR platforms, the EP2C35U484C6 handles baseband I/Q sample routing, FIR channel filtering, and DDC/DUC (digital down/up conversion) while a companion ADC/DAC operates at the RF interface. Its 35 DSP multipliers support 31-tap FIR filters at 100 MHz, well-suited for narrowband channelization. The 4 PLLs derive independent sample clocks for ADC and DAC paths, and the 322 user I/Os connect to LVDS pairs from high-speed ADCs like the AD9649.
Recommandé
Legacy PCI/PCI-X Bus Bridge
The EP2C35U484C6 implements PCI 32-bit/33 MHz or PCI-X 64-bit/66 MHz bus bridges between legacy hosts and modern peripherals, using its 322 user I/Os to fan out the bus plus sideband signals (REQ#, GNT#, FRAME#, IRDY#, TRDY#, STOP#, DEVSEL#, PAR, PERR#, SERR#). Cyclone II is popular for retrofit PCI bridge boards because its LVTTL I/O banks support 5 V PCI signaling via external clamp diodes and bus switches. The C6 speed grade meets the 33 MHz PCI clock-to-out timing with comfortable margin.
Recommandé
DDR/DDR2 SDRAM Memory Controller
The EP2C35U484C6 implements soft DDR and DDR2 SDRAM controllers using its PLL-derived DQS phase-shift clocks and SSTL-2 or SSTL-18 I/O standards. The 322 user I/Os comfortably accommodate a 32-bit DDR2 data bus plus 14-bit address, command, and control signals. Designers value the 483,840 RAM bits for line buffers that hide DDR page-miss penalties. The U484 484-FBGA package keeps signal-trace lengths under 25 mm, essential for SSTL timing closure at 200-400 MT/s data rates.
Recommandé
Prototyping Platform for ASIC Pre-Silicon Validation
The EP2C35U484C6 serves as a prototyping vehicle for ASIC RTL validation, fitting up to 5 million ASIC gates through its 33,216 LEs plus multiplier-based arithmetic. Engineers map ASIC RTL to Cyclone II fabric, validate functional behavior at near-ASIC clock rates, and use JTAG-based signal tap to debug corner cases. The C6 speed grade supports internal Fmax around 250 MHz, allowing validation of timing-sensitive ASIC blocks before tape-out. Quartus II software supports the Verilog/VHDL synthesis flow directly.
Recommandé
Test and Measurement Instrumentation
The EP2C35U484C6 powers digital pattern generation, protocol decoding, and signal conditioning in bench-top test equipment, leveraging 35 DSP multipliers for FFT-based spectrum analysis at sample rates up to 200 MSPS. The 4 PLLs generate precisely tuned test clocks, and the 322 user I/Os drive parallel LVDS test fixtures. Cyclone II is favored for mid-range logic analyzers because its embedded RAM acts as a deep sample buffer without external FIFO memory, reducing BOM cost and PCB area.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C35U484C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C35U484C6N | EP2C35U484C7 | EP2C35U484C8 | EP2C35U484I6 | EP2C35F484C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA (U484) | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (F484) - variant |
| Logic Elements | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 |
| Speed Grade | C6 | C6 | C7 (faster) | C8 (fastest) | I6 (industrial, comparable timing) | C6 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Lead-Free Finish | Standard (SnPb or Pb-free) | Yes (Pb-free) | Standard | Standard | Standard | Standard |
| Total RAM Bits | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 |
| User I/O Count | 322 | 322 | 322 | 322 | 322 | 322 |
| PLL Count | 4 | 4 | 4 | 4 | 4 | 4 |
Principaux différenciateurs
- Highest I/O count in the EP2C35 package options (vs EP2C35F484C6)
- Pb-free RoHS-compliant equivalent available (vs EP2C35U484C6N)
- Industrial temperature range drop-in option (vs EP2C35U484I6)
Notes de conception
The EP2C35U484C6 requires a clean 1.2 V core rail (VCCINT) capable of delivering up to approximately 1.5 A under full logic utilization. Use a buck converter followed by an LDO post-regulator for noise-sensitive designs, and place at least four 100 uF bulk capacitors plus per-pin 0.1 uF/0.01 uF ceramic pairs adjacent to the BGA. The four PLL analog supplies (VCCA_PLL1-4) must be filtered with ferrite beads and decoupled with 10 uF plus 0.1 uF capacitors per PLL. Bank I/O supplies (VCCIO1-8) can be 1.5V/1.8V/2.5V/3.3V and may be tied to multiple banks if they share the same voltage standard.
The 484-FBGA package has a typical theta_JA of approximately 15 C/W with a properly designed 4-layer PCB and thermal vias beneath the package. Estimated: under worst-case logic utilization (90%) at 250 MHz and 1.2 V core, total power dissipation may reach 2-3 W, producing a junction temperature rise of 30-45 C above ambient. Cyclone II does not include an on-chip temperature diode; rely on PCB thermal simulation or external board-mounted sensor for thermal verification. Forced airflow is recommended for high-ambient industrial enclosures.
The 1.0 mm pitch 484-FBGA requires microvia or via-in-pad PCB technology for reliable assembly. Use 0.4 mm diameter solder balls on 0.5 mm diameter SMD pads with 0.3 mm solder mask openings. Place a continuous ground plane on layer 2 directly beneath the BGA to provide low-impedance return paths and thermal spreading. Decoupling capacitors should be placed on the bottom side of the PCB within 2 mm of each BGA pin group via short stub traces. X-ray inspection is mandatory for production verification of solder joints since the BGA balls are hidden beneath the package.
Common pitfalls when designing with the EP2C35U484C6 include: (1) failing to drive MSEL[2:0] to the correct configuration mode (AS=000, PS=001, JTAG=010) before power-up, (2) leaving unused PLL outputs floating instead of tying to ground through 1 kohm resistors, (3) mixing 3.3 V PCI signaling with 5 V tolerant I/O standards without proper bus-switch isolation, and (4) using Quartus II versions newer than 13.0 sp1 which removed Cyclone II device support - stick to Quartus II 13.0 sp1 or earlier. Also, do not confuse the U484 footprint with the F484 footprint - they are mechanically different BGA variants despite both having 484 balls.
Differential signaling (LVDS) on the EP2C35U484C6 requires matched trace lengths within 20 mil (0.5 mm) and 100 ohm differential impedance. For DDR/DDR2 interfaces, use SSTL-2 or SSTL-18 I/O standards with matched DQS-to-DQ trace lengths within 50 mil. The 4 PLLs can shift DQS clock phases by -90 to +90 degrees for write-leveling. For high-speed LVDS pairs (>500 Mbps), use AC-coupling capacitors (0.01 uF) and ensure the receiver common-mode voltage falls within 0.0-2.4 V. Always perform IBIS-model-based signal-integrity simulation before committing to PCB layout.
Informations de conformité
RoHS and REACH compliance status for EP2C35U484C6 (non-N suffix) was not provided in the verified web data. The N-suffix variant (EP2C35U484C6N) is typically Pb-free per Altera part numbering convention, but this should be confirmed via the manufacturer declaration document. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade qualified IC.
