EP2S90F780I4 - Stratix II FPGA 90K LE FBGA-780 | Intel
Référence : EP2S90F780I4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2 450,00 |
| 100 | $195 | $19 500,00 |
| 500 | $165 | $82 500,00 |
| 1 000 | $142.5 | $142 500,00 |
EP2S90F780I4 Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that lets designers implement custom digital logic - combinational and sequential functions, memory blocks, and high-speed transceivers - on the same silicon after fabrication. Within the power-management hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic; the Stratix II family specifically targets high-performance applications such as high-speed digital signal processing, telecommunications backplanes, and ASIC prototyping. EP2S90F780I4 occupies the high-end of this family and shares the same architecture as other Stratix II members.
Key features include up to 1,152 Kbits of embedded M512/M4K/M-RAM block memory distributed across 4,520,488 bits total, 12 DSP blocks capable of 18x18-bit signed multiplication at full speed, and eight phase-locked loops (PLLs) for clock synthesis and skew management. The device supports multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X) on its 534 user I/O pins, enabling direct interface to DDR/DDR2 SDRAM memories and external parallel buses. Adaptive logic modules (ALMs) provide 8 inputs per module, a 2x improvement over the previous Stratix generation.
The 90 nm CMOS process, 1.2 V core voltage, and dedicated hard IP blocks deliver industry-leading performance-per-watt for its era. The internal TriMatrix memory architecture splits on-chip RAM into three block sizes (M512, M4K, M-RAM) so engineers can allocate memory density versus width efficiently. Routing architecture is segmented into row, column, and local interconnects, supporting timing closure for designs operating at hundreds of MHz.
Typical applications for the EP2S90F780I4 include high-performance ASIC prototyping and emulation, telecommunications baseband and bridging equipment, high-speed serial protocol bridging (SPI 4.2, SFI-4, UTOPIA), broadcast video processing, and military/aerospace signal processing. The -I speed/temperature grade (-40C to +100C case) targets industrial and defense applications.
When designing with the EP2S90F780I4, engineers must consider the 29 x 29 mm BGA footprint which requires at least 6 PCB layers with microvia technology for fan-out, and the 534 user I/Os which often demand SSTL-2 or LVPECL termination networks. Power integrity analysis is essential because the device can exceed 20 W at full utilization; a multi-rail synchronous buck DC-DC design with at least four voltage rails (VCCINT, VCCIO banks, VCCA, VCCD_PLL) is recommended.
This page consolidates distributor stock data, drop-in alternatives within the Stratix II family, and practical design notes that extend beyond the manufacturer datasheet for engineers evaluating the EP2S90F780I4 in legacy designs.
Alternatives de remplacement direct pour EP2S90F780I4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S90F780I4 (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Total RAM Bits, Logic Elements, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S90F780I4N
✅ Remplacement direct✓ En stock
$188 / unité
Voir la fiche technique →EP2S90F780C4N
✅ Remplacement direct✓ En stock
$365 / unité
Voir la fiche technique →EP2S90F780C5N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP2S130F780I4N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP2S130F780C5N
✅ Remplacement direct✓ En stock
$2150 / unité
Voir la fiche technique →EP2S90F780I4 Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total RAM Bits | 4,520,488 bits |
| DSP Blocks | 12 (96 18x18 multipliers max) |
| Embedded 18x18 Multipliers | Up to 96 |
| PLLs | 8 |
| Maximum User I/O Pins | 534 |
| Boîtier | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C case) |
| Speed Grade | -4 (I4 suffix) |
| Internal Clock Frequency (max) | 717 MHz |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Lead-free (per datasheet) |
| Statut du cycle de vie | Obsolete (Stratix II family discontinued) |
Guide de configuration des broches du EP2S90F780I4 fbga-780 (29 x 29 mm, 1.0 mm pitch)
Configuration des broches du EP2S90F780I4 (boîtier fbga-780 (29 x 29 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S90F780I4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S90F780I4 convient pour 6 applications: ASIC Prototyping and Emulation, Telecommunications Baseband and Bridging, Broadcast Video Processing, Military and Aerospace Signal Processing, Industrial Automation and Motor Control, High-Performance Test and Measurement.
ASIC Prototyping and Emulation
The EP2S90F780I4 fits ASIC prototyping because its 90,960 logic elements and 12 DSP blocks (96 18x18 multipliers) at up to 717 MHz internal clock provide sufficient capacity to emulate multi-million-gate ASICs in-system. Multiple boards can be chained to map larger designs. The 4,520,488 bits of embedded TriMatrix memory reduce external SRAM requirements for register files and FIFOs during emulation. Quartus II synthesis supports incremental compilation, allowing engineering teams to partition designs across multiple FPGAs. Performance matches pre-tapeout timing on most logic-heavy blocks.
Recommandé
Telecommunications Baseband and Bridging
In telecom baseband and protocol bridging, the EP2S90F780I4's 8 PLLs, 534 user I/Os, and support for LVDS/LVPECL/SSTL/HSTL make it ideal for SPI-4.2, SFI-4, and UTOPIA interface bridging at multi-gigabit rates. The 12 DSP blocks accelerate Reed-Solomon, Viterbi, and Turbo decoder primitives, while the 4.5 Mbit RAM implements packet buffers without external memory. Industrial temperature grade (-40C to +100C) suits outdoor BTS equipment. Bank-based I/O voltage supplies (VCCIO) simplify mixed-standard interfacing to legacy backplanes.
Recommandé
Broadcast Video Processing
The EP2S90F780I4 supports broadcast video processing at HD-SDI and 3G-SDI rates thanks to its high-speed LVDS transceivers and 4.5 Mbit embedded memory that holds multiple video frames for color-space conversion, scaling, and frame-rate conversion. The 717 MHz internal clock enables real-time 1080p60 processing pipelines. Twelve DSP blocks accelerate deinterlacing, noise reduction, and chroma keying in real time. The 534 user I/Os interface to SDI serializers, HDMI receivers, and DDR2 frame buffers without external bridge ICs.
Recommandé
Military and Aerospace Signal Processing
The EP2S90F780I4's Industrial temperature range (-40C to +100C) meets MIL-STD-810 environmental requirements for military and aerospace signal processing in radar, electronic warfare, and SIGINT subsystems. The 12 DSP blocks implement FFT, pulse compression, and adaptive beamforming at sustained rates. The 90 nm radiation-tolerant process and sealed FBGA-780 package withstand vibration and thermal cycling in airborne platforms. Distributors can screen parts to MIL-STD-883 for added assurance in mission-critical applications.
Recommandé
Industrial Automation and Motor Control
In industrial automation, the EP2S90F780I4 provides the deterministic DSP performance and industrial-grade temperature tolerance required for multi-axis servo control and high-speed PLC logic. The 12 DSP blocks run PID, state-space, and FOC motor control algorithms at microsecond loop rates. The 4.5 Mbit RAM stores trajectory tables and feedback logs. Eight PLLs synchronize encoder sampling, PWM switching, and EtherCAT communications across the 534 user I/Os, eliminating the need for external timing chips.
Recommandé
High-Performance Test and Measurement
The EP2S90F780I4 fits high-performance test equipment because its 717 MHz internal clock and 96 embedded multipliers support real-time FFT, arbitrary waveform generation, and protocol-aware bit-error-rate testing. The 4.5 Mbit embedded RAM stores deep capture buffers and signal correlation tables without external memory. Eight PLLs derive multiple synchronized sample clocks from a single reference, simplifying ATE architecture. Industrial temperature grade suits benchtop and rack-mounted test instruments operating in factory environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S90F780I4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S90F780I4N | EP2S90F780C4N | EP2S90F780C5N | EP2S130F780I4N | EP2S130F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29x29 mm) | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same |
| Logic Elements | 90,960 | 90,960 (identical) | 90,960 (identical) | 90,960 (identical) | 132,540 (+45%) | 132,540 (+45%) |
| DSP Blocks | 12 (96 18x18 multipliers) | 12 (identical) | 12 (identical) | 12 (identical) | 16 (128 multipliers) | 16 (128 multipliers) |
| Total RAM Bits | 4,520,488 | 4,520,488 (identical) | 4,520,488 (identical) | 4,520,488 (identical) | 6,747,840 (+49%) | 6,747,840 (+49%) |
| User I/O Pins | 534 | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (identical) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (identical) | Commercial |
| Speed Grade | -4 (I4 suffix) | -4 (identical) | -4 (identical) | -5 (slower timing) | -4 (identical) | -5 (slower timing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible Industrial grade variant with N suffix (vs EP2S90F780I4N)
- 45% higher logic density in the same package footprint (vs EP2S130F780I4N)
- Industrial temperature grade versus commercial variants (vs EP2S90F780C5N)
Notes de conception
Estimated: The EP2S90F780I4 FBGA-780 (29x29 mm, 1.0 mm pitch) requires at least 6 PCB layers with microvia (laser-drilled) technology for fan-out. The 534 user I/Os demand a controlled-impedance stack-up (50 ohm single-ended, 100 ohm differential) on the top two layers. Full breakout cannot fit on top-only routing; the inner layers must absorb escape traces. Use 1 oz copper on outer layers and 0.5 oz on inner layers to balance current capacity and impedance control. Decoupling: place 0402-size 0.1 uF X7R ceramics within 100 mils of every VCCINT/VCCIO ball, plus bulk 47 uF tantalum or polymer capacitors near the device.
Estimated: At full utilization with all 96 multipliers running at 400 MHz and 50% toggle rate, the EP2S90F780I4 can dissipate 15-22 W. With a theta_JA of approximately 10 C/W for the FBGA-780 package on a standard JEDEC test board, this yields a 150-220C junction temperature rise above ambient. A thermal solution is mandatory: copper pour over the BGA balls with thermal vias to inner planes, plus a heatsink or forced airflow of at least 200 LFM. Industrial temperature grade limits case temperature to +100C maximum. Consider de-rating by enabling Quartus II power analyzer to estimate per-design dissipation before layout.
The EP2S90F780I4 requires at least four separate voltage rails: VCCINT (1.2 V core), VCCIO (eight banks at 1.5/1.8/2.5/3.3 V per bank), VCCA (2.5 V analog supply for PLLs and transceivers), and VCCD_PLL (1.2 V digital PLL supply). Each rail should have its own LDO or synchronous buck regulator with remote sense. Total worst-case current can exceed 15 A on VCCINT alone at full speed. Use a power-sequencing controller (e.g., LTC2974 or equivalent) to enforce proper ramp order - VCCINT must come up before VCCIO, and VCCA before VCCD_PLL.
Common pitfalls when designing with the EP2S90F780I4: (1) Configuration - the device uses passive serial (PS), fast passive parallel (FPP), or JTAG modes; missing the nCONFIG or nSTATUS pull-ups prevents configuration. (2) I/O bank voltage mixing - VCCIO pins must match the I/O standard (SSTL-2 requires 2.5 V, LVDS uses 2.5 V with 100 ohm differential). Mixing 3.3 V and 1.8 V on the same bank is invalid. (3) Obsolescence - the Stratix II family is end-of-life, so second-source or future-proof designs should use Cyclone IV/V or Stratix V/10. (4) Quartus II version - use Quartus II 13.1 or earlier, since later versions dropped Stratix II support.
Informations de conformité
RoHS-compliant per Intel datasheet. Industrial temperature grade only - not AEC-Q100 qualified (automotive not targeted). REACH and conflict minerals compliance should be verified per shipment with the broker.